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360 results about "Structural load" patented technology

Structural loads or actions are forces, deformations, or accelerations applied to a structure components. Loads cause stresses, deformations, and displacements in structures. Assessment of their effects is carried out by the methods of structural analysis. Excess load or overloading may cause structural failure, and hence such possibility should be either considered in the design or strictly controlled. Mechanical structures, such as aircraft, satellites, rockets, space stations, ships, and submarines, have their own particular structural loads and actions. Engineers often evaluate structural loads based upon published regulations, contracts, or specifications. Accepted technical standards are used for acceptance testing and inspection.

Modular building construction employing concrete mold assembly

A modular building construction where each module consists of self-contained molds to allow concrete to form within the walls of each module as well as between the modules when two or more modules are placed together. The structural load capacities of the modules are transmitted directly into the concrete within the wall without bearing directly on the module below. The forming structure for the modules can be fabricated either using wood or metal construction. The exterior and interior wall finishes are the resulting structure of the molds. Since the molds are self-contained the walls can consist of, either drywall, rigid insulation, thin brick or siding just to name a few. The interior forming structure can extend into the concrete footing or above or to adjacent modules to structurally secure the modules together. The modules can be built with a flooring structure as well as ceiling. The interior walls as well as the floor and ceiling also function as wall supporting braces. The exterior walls have many different forming molds to accommodate many different construction situations. Some forming structures are formed with a thermal break between the exterior and interior forming structure. The thermal break allows the wall to also be used as a heating or cooling distribution system. Different types of connectors are described allowing for the connectors to be hidden. Several methods are shown how the electrical distribution can be provided within a concrete wall by using the forming structure within the mold. A ribbed concrete mold can be formed for a poured-in-place wall as well as for a floor and roof system. Temporary floor bracing can be used when pouring the flooring system, or only just the concrete beams can be poured and the floor can be poured later. The flooring system can be used as concrete wall or as a roof structure.
Owner:LEBLANG DENNIS

Stress sensor based electronic device functional profile feature point displacement field reconstruction method

The invention discloses a stress sensor based electronic device functional profile feature point displacement field reconstruction method. The method includes: determining a structural parameter and a material attribute of an electronic device functional profile and distribution positions and the number of stress sensors; acquiring a stress value measured by functional profile stress sensors under the action of service loads; establishing a structural finite element model of a functional profile; performing modal analysis on the functional profile; acquiring a modal shape and a stress modal shape of the functional profile; extracting a stress modal shape matrix corresponding to position nodes of the stress sensors; calculating a generalized modal coordinate; extracting a modal shape matrix corresponding to feature points of the functional profile; and reconstructing displacement of the feature points of the functional profile. Based on a modal analysis theory, the method can use stress values measured by the few stress sensors to reconstruct a displacement field of the feature points of the electronic device functional profile in the condition of unknown structural load information, and can direct structural distortion compensation and electrical performance compensation of the electronic device functional profile.
Owner:XIDIAN UNIV

Integrated skin capable of achieving heat shielding, heat insulation and stealth and preparation method of integrated skin

The invention provides an integrated skin capable of achieving heat shielding, heat insulation and stealth and a preparation method of the integrated skin. The integrated skin comprises a wave-transparent ceramic-based composite material, an electrical loss-type wave-absorbing heat-insulating integrated layer, a transition layer, an organic wave-absorbing layer, and a metal structural layer from the outside in, wherein the functional layers are connected through ceramic-based composite bolt members so as to form the skin structure. The skin has the advantages that the stealth performance, heatshielding and heat insulation performance and structural load-carrying capacity are designed comprehensively and optimally, insufficient broadband wave-absorbing performance, low structural strengthand other problems of stealth structural materials are solved effectively under high temperature conditions, and finally the design of the integrated skin capable of achieving the stealth function isachieved; the broadband stealth performance is achieved through the design of a multi-layer wave-absorbing periodic structure or a resistive film, and the electrical loss-type high temperature-resistant wave-absorbing structure with an heat insulation function is designed on the outer layer of the integrated skin capable of achieving heat shielding, heat insulation and stealth, so that heat insulation, cooling and absorption of high-frequency electromagnetic waves are achieved; and the working temperature of an inner-layer magnetic wave-absorbing material is made lower than the Curie temperature of the inner-layer magnetic wave-absorbing material, and finally the integrated skin capable of achieving heat shielding, heat insulation and stealth is obtained.
Owner:BEIJING RES INST OF MECHANICAL & ELECTRICAL TECH
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