Integrated skin capable of achieving heat shielding, heat insulation and stealth and preparation method of integrated skin

A technology of skin and heat insulation layer is applied in the field of integrated skin of anti/heat insulation and stealth and its preparation, which can solve the problems such as the inability to apply the low-frequency stealth performance of ultra-materials, and achieve the improvement of insufficient structural performance, improvement of comprehensive stealth ability, Designable effects

Active Publication Date: 2019-03-29
BEIJING RES INST OF MECHANICAL & ELECTRICAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In order to solve the problem that the stealth scheme of the conventional absorbing structure cannot be applied to the high-temperature environment of high-speed flight and the low-frequency stealth perfor

Method used

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  • Integrated skin capable of achieving heat shielding, heat insulation and stealth and preparation method of integrated skin
  • Integrated skin capable of achieving heat shielding, heat insulation and stealth and preparation method of integrated skin
  • Integrated skin capable of achieving heat shielding, heat insulation and stealth and preparation method of integrated skin

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] Step 1: Prepare the metal structure layer

[0040] Titanium alloy Ta5 is selected as the high-strength metal alloy as the structural layer, and a metal structural layer with a thickness of 3mm is obtained by machining, and prefabricated holes are prepared by machining technology, which is convenient for bolt connection in the later stage. The spacing of the prefabricated holes is 300mm, and the The hole diameter is about 6mm.

[0041] Step 2: Preparation of organic absorbing layer

[0042] Pour fluorine rubber and micron magnetic nickel powder (30wt.%) into the open mill and knead evenly, and the kneading temperature is 50°C, and the above-mentioned mixture is pressed into a wave-absorbing layer raw film with a thickness of 2mm by a calender, and cut into Put the designed shape into the mold, heat up and vulcanize after closing the mold, and obtain the required magnetic wave-absorbing patch material. The dielectric constant and dielectric loss are about 20 and 0.1, res...

Embodiment 2

[0052] Step 1: Prepare the metal structure layer

[0053] Nickel alloy C276 is selected as the high-strength metal alloy as the structural layer, and a metal structural layer with a thickness of 0.8mm is obtained by machining, and prefabricated holes are prepared by machining technology, which is convenient for bolt connection in the later stage. The hole diameter is about 16mm.

[0054] Step 2: Prepare resin matrix containing magnetic absorber

[0055] Using micron magnetic iron-nickel alloy powder (75wt.%) as the wave absorbing agent and polyimide as the solvent, the wave absorbing agent and the solvent are fully mixed by mechanical stirring and ultrasonic dispersion to form a wave absorbing matrix to prepare the bottom magnetic resin base composite absorbing layer.

[0056] The third step: preparation of organic absorbing layer

[0057] The magnetic resin-based composite material layer is made of silica fiber-reinforced polyimide-based composite material, and aluminum ox...

Embodiment 3

[0067] Step 1: Prepare the metal structure layer

[0068] Titanium alloy Ta5 is selected as the high-strength metal alloy as the structural layer, and a metal structural layer with a thickness of 4mm is obtained by machining, and prefabricated holes are prepared by machining technology, which is convenient for bolt connection in the later stage. The spacing of the prefabricated holes is 260mm, and the The hole diameter is about 4mm.

[0069] Step 2: Prepare resin matrix containing magnetic absorber

[0070] Using micron iron powder (60wt.%) as a wave absorbing agent and polytetrafluoroethylene as a solvent, the wave absorbing agent and solvent are fully mixed by mechanical stirring and ultrasonic dispersion to form a wave-absorbing matrix to prepare the bottom magnetic resin-based composite material Absorbing layer.

[0071] The third step: preparation of organic absorbing layer

[0072] The magnetic resin-based composite material layer is made of quartz fiber-reinforced PT...

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Abstract

The invention provides an integrated skin capable of achieving heat shielding, heat insulation and stealth and a preparation method of the integrated skin. The integrated skin comprises a wave-transparent ceramic-based composite material, an electrical loss-type wave-absorbing heat-insulating integrated layer, a transition layer, an organic wave-absorbing layer, and a metal structural layer from the outside in, wherein the functional layers are connected through ceramic-based composite bolt members so as to form the skin structure. The skin has the advantages that the stealth performance, heatshielding and heat insulation performance and structural load-carrying capacity are designed comprehensively and optimally, insufficient broadband wave-absorbing performance, low structural strengthand other problems of stealth structural materials are solved effectively under high temperature conditions, and finally the design of the integrated skin capable of achieving the stealth function isachieved; the broadband stealth performance is achieved through the design of a multi-layer wave-absorbing periodic structure or a resistive film, and the electrical loss-type high temperature-resistant wave-absorbing structure with an heat insulation function is designed on the outer layer of the integrated skin capable of achieving heat shielding, heat insulation and stealth, so that heat insulation, cooling and absorption of high-frequency electromagnetic waves are achieved; and the working temperature of an inner-layer magnetic wave-absorbing material is made lower than the Curie temperature of the inner-layer magnetic wave-absorbing material, and finally the integrated skin capable of achieving heat shielding, heat insulation and stealth is obtained.

Description

technical field [0001] The invention belongs to the technical field of high-speed aircraft stealth, and in particular relates to an anti / heat-insulating stealth integrated skin and a preparation method thereof. Background technique [0002] During the flight of high-speed aircraft, the outer surface temperature will exceed 600°C due to severe aerodynamic heating, and the maximum temperature can reach more than 1400°C. Strong scattering components such as air intakes, wings, cabins, and tails of high-speed aircraft are all under high-temperature aerodynamic heating conditions. Down. Stealth performance is an important indicator of future high-speed aircraft, but the shape of high-speed aircraft is constrained by various design requirements such as overall, structure, and aerodynamics. The application of shape stealth technology is greatly restricted. The most important and effective technical approach of strong scattering. [0003] For magnetic loss materials, demagnetizati...

Claims

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Application Information

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IPC IPC(8): B32B15/00B32B15/08B32B27/28B32B27/20B32B9/00B32B9/04B32B25/14B32B15/06B32B27/32B32B7/08B32B37/00B64C1/12
CPCB32B5/18B32B7/08B32B9/005B32B9/043B32B9/045B32B9/046B32B15/00B32B15/06B32B15/08B32B25/14B32B27/20B32B27/281B32B27/322B32B37/00B32B2262/10B32B2307/304B32B2311/18B32B2311/22B32B2315/02B32B2319/00B32B2327/18B32B2379/08B64C1/12B32B2266/126
Inventor 郝璐刘晓菲张松靖郭晓铛
Owner BEIJING RES INST OF MECHANICAL & ELECTRICAL TECH
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