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Method for improving packaging performance of electrowetting device and electrowetting device

A device packaging and electrowetting technology, applied in the field of electrowetting, can solve problems such as ink leakage, reduced device life and output, poor device packaging performance, etc., and achieve the effect of simple process, reliable quality and excellent packaging performance

Active Publication Date: 2015-04-29
SHENZHEN GUOHUA OPTOELECTRONICS +2
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  • Description
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Problems solved by technology

[0006] The plastic frame is generally made of pressure-sensitive adhesive (PSA) material. Because the sealed chamber is mainly water or salt solution, in order to prevent the hydrophilic group of the plastic frame from interacting with water, the plastic frame is mostly made of hydrophobic Pressure-sensitive adhesive preparation, such as polyacrylate, polyisobutylene, etc., the contact angle of water droplets on the surface is generally ≥ 90°, so when the surface of the pixel wall is too hydrophilic, it is difficult to bond the plastic frame and the pixel wall tightly, resulting in poor device packaging performance , easy to cause ink leakage, that is, the liquid in the closed chamber flows out, or the external pollutants enter, thereby reducing the life and output of the device

Method used

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  • Method for improving packaging performance of electrowetting device and electrowetting device
  • Method for improving packaging performance of electrowetting device and electrowetting device
  • Method for improving packaging performance of electrowetting device and electrowetting device

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preparation example Construction

[0045] The pixel wall 24 can be prepared by methods well known to those skilled in the art. For example, the photoresist material can be coated in one or more steps. The coating method can be, but not limited to, spin-coating, roller coating. -coating, slit-coating, dip-coating, spray-coating, blade-coating, etc. Then the film is further pre-baked, UV light exposure and post-exposure baking (PEB), and then developed to obtain the pixel wall 24. In order to avoid the phenomenon of driving ink jumping, it is necessary to ensure that the water droplets on the surface of the pixel wall 24 are in contact Angle ≤ 50 degrees.

[0046] Preferably, the method in the invention patent of 201410665529.5 submitted by the present inventor is used to prepare the pixel wall 24, that is, the pixel wall 24 is formed of a hydrophilic SOG material or the pixel wall has a layer of hydrophilic SOG material on the surface Therefore, the surface of the pixel wall 24 thus obtained has high hydrophilicit...

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Abstract

The invention discloses a method for improving the packaging performance of an electrowetting device and the electrowetting device. A layer of attaching material good in hydrophobicity is arranged on the surfaces of pixel walls of a packaging attaching area, the problems that when a high-hydrophilic material is adopted to prepare the pixel walls to avoid the ink jumping phenomenon, the attaching performance of a rubber frame and the pixel walls is poor, and the packaging sealing performance is not good can be solved, an obtained packaging device is more reliable in quality, ink jumping is avoided, and the packaging sealing performance is guaranteed. Furthermore, the attaching material can cover the intersection of the longitudinal pixel walls and the transverse pixel walls, supporting columns are formed, and a series of display problems caused when base plates are bent due to gravity or stress are prevented. The method is simple in technology, low in cost and easy to control, and the obtained electrowetting device has superior packaging performance.

Description

Technical field [0001] The invention relates to electrowetting technology, in particular to a method for improving the packaging performance of an electrowetting device and an electrowetting device obtained therefrom. Background technique [0002] An electrowetting device generally includes two substrates, one of which is provided with a plastic frame on the surface, and the other substrate is provided with a pixel wall arranged in a matrix. The two substrates are bonded by the plastic frame and the surface of the pixel wall. , The package forms a closed chamber, where the closed chamber contains a non-conductive first fluid (alkanes, etc.) and a conductive second fluid (water or salt solution), and the fluids are in contact with each other and are immiscible. [0003] The pixel wall is usually a patterned structure obtained through a photolithography process, and the pixel grid area enclosed by the pixel wall is the display area, and the electrowetting display device produces a di...

Claims

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Application Information

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IPC IPC(8): G02B26/00
CPCG02B26/00
Inventor 周国富窦盈莹李发宏水玲玲罗伯特·安德鲁·海耶斯
Owner SHENZHEN GUOHUA OPTOELECTRONICS
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