Patents
Literature
4results about How to "Improve encapsulation" patented technology
Efficacy Topic
Property
Owner
Technical Advancement
Application Domain
Technology Topic
Technology Field Word
Patent Country/Region
Patent Type
Patent Status
Application Year
Inventor
Impact-resistant photovoltaic encapsulant film, preparation method thereof and photovoltaic module
ActiveCN118832891BImprove encapsulationImprove impact resistanceNon-macromolecular adhesive additivesMacromolecular adhesive additivesElastomerPolymer science
This invention discloses an impact-resistant photovoltaic encapsulating film, its preparation method, and a photovoltaic module. The photovoltaic encapsulating film comprises multiple layers of unidirectional prepreg tape laminated together. The unidirectional prepreg tape is obtained by melt impregnation of thermoplastic resin and continuous fibers surface-treated with a coupling agent. The thermoplastic resin includes polyolefin elastomer (POE) and POE grafts. During the melt impregnation process, the continuous fibers surface-treated with the coupling agent and the POE grafts undergo a chemical reaction to achieve compatibility. This invention employs a pre-melt impregnation followed by crosslinking technique. The uncrosslinked POE resin has good fluidity and can be fully melt-impregnated with the continuous fibers. Electron beam irradiation post-treatment technology allows the impregnated base film to undergo a crosslinking reaction, resulting in a fiber-reinforced impact-resistant photovoltaic encapsulating film. The film prepared by this invention meets industry technical standards for UV resistance, aging resistance, and impact resistance, while also being low-cost and simple to manufacture, making it widely applicable in the field of lightweight flexible photovoltaic modules.
Owner:SHENZHEN FLEXTECH CO
Electrical conduit transport pipe pillow for landfills
A pipe pillow for transporting and burying power conduits is disclosed. The pipe pillow has circular clamps for power conduits on the inner surfaces of one side pillow and the other side pillow. The outer surfaces of both side pillows have quarter-circle defect angles at the top and bottom, respectively. The upper and lower surfaces of both side pillows have dovetail grooves A and B, respectively. Two insert rods are used to pass through multiple dovetail grooves A and B on the upper and lower parts of both side pillows, respectively, and then two screws and two nuts are used to form a lock. This invention utilizes insert rods to pass through multiple dovetail grooves on the upper and lower parts of both side pillows to achieve modular splicing of rows of power conduits, facilitating fixing during transportation and concrete encapsulation, backfilling, or displacement, sliding, or adhesion during operation.
Owner:STATE GRID HENAN ELECTRIC POWER CO YICHUAN COUNTY POWER SUPPLY CO
Preparation and packaging method of solvent-resistant electronic paper micro-cup
This invention provides a method for preparing and encapsulating solvent-resistant electronic paper microcups, belonging to the field of electronic paper display technology. Addressing the problems of uneven wall thickness and difficult demolding in existing electronic paper microcups, this invention aims to provide a solution. The method includes substrate pretreatment, microcup layer fabrication, template treatment, curing, demolding, oil phase filling, and sealing steps. Specifically, the template treatment uses perfluoroalkylchlorosilane for anti-sticking treatment, extending template life and enabling multiple uses; the microcup layer coating thickness is 20–100 μm to ensure uniform microcup wall thickness; the oil phase filling temperature is -25–40℃; and sealing uses a thin film with a thickness of 10–50 μm, which is effectively encapsulated through heat pressing and curing. This invention combines photopolymerization, nanoimprinting, and low-surface-area demolding technology to overcome the defects of uneven wall thickness and difficult demolding in existing technologies. The prepared microcup electronic paper exhibits good solvent resistance, high mechanical strength, and excellent encapsulation effect.
Owner:GUANGZHOU OED TECH INC
A disposable ultrasonic welding anti-theft packaging box
Owner:BEIJING JIUZHUN TECH CO LTD