5 results about "Foreline" patented technology

A kit of parts for forming a foreline (112) for coupling a process chamber (108) to a vacuum pumping and / or abatement system (110), the kit comprising: a plurality of foreline sections (122, 124); wherein each foreline section (122, 124) is a tube comprising: a first end portion (122a, 124a) that is substantially straight; a second end portion (122b, 124b) that is substantially straight, opposite the first end portion (122a, 124a); and an intermediate portion (122c, 124c) disposed between the first and second end portions (122a-b, 124a-b) and connected to the first and second end portions (122a-b, 124a-b) by respective bends (122d-e, 124d-e), the first and second end portions (122a-b, 124a-b) being substantially parallel to each other; the intermediate portion (122c, 124c) being inclined with respect to the first and second end portions (122a-b, 124a-b); and the foreline sections (122, 124) being configured to be attached together so as to form a continuous foreline (112).

Embodiments of an apparatus for coating a plurality of gas lines are provided herein. In some embodiments, an apparatus for coating a plurality of gas lines via an ALD process includes: an oven having an enclosure that defines an interior volume configured to house the plurality of gas lines, the enclosure having a door configured for transferring the plurality of gas lines into and out of the interior volume; a plurality of inlet ports disposed through a first wall of the enclosure; a plurality of exhaust ports disposed through a second wall of the enclosure; a fluid panel disposed outside of the oven and coupled to the plurality of inlet ports via corresponding ones of a plurality of fluid distribution assemblies; and a foreline disposed outside of the oven and coupled to the plurality of exhaust ports.

The utility model relates to vacuum degassing furnace technical field, and disclose a kind of multi-station vacuum degassing furnace, including cavity, mechanical pump and molecular pump, through the front stage pipeline setting in the front stage valve of mechanical pump output end, setting in the front stage valve and molecular pump between the front stage air release valve, through connecting pipeline setting in the molecular pump input end of molecular pump plug-in valve, setting in the molecular pump and molecular pump plug-in valve between the vacuum gauge.The multi-station vacuum degassing furnace, through the three-stage vacuum system cooperation of mechanical pump, molecular pump and ion pump and the collaborative control of front stage valve, molecular pump plug-in valve and ion pump plug-in valve, the efficient vacuum pumping of multi-station vacuum degassing furnace is realized, heating controller and heating element cooperate to ensure cavity temperature stability, high vacuum gauge tube real-time monitoring vacuum degree and through total controller realize automation control, host computer provides intuitive operation interface, overall system structure is compact, control is accurate, energy consumption is low.

The utility model discloses a pressure detection device of a preceding-stage pipeline and thin film deposition equipment, the device comprises the preceding-stage pipeline, a mounting pipe and a vacuum gauge, the first end of the mounting pipe is connected with the vacuum gauge, and the second end of the mounting pipe passes through the side wall of the preceding-stage pipeline and extends into the preceding-stage pipeline; and an air inlet is formed in the second end of the mounting pipe, and the air inlet is opposite to the airflow direction of air in the preceding-stage pipeline. According to the application, the air inlet of the mounting pipe of the vacuum gauge extends into the preceding-stage pipeline and is arranged opposite to the airflow direction, so that dust or gas byproducts in the preceding-stage pipeline can be prevented from entering the mounting pipe in a turning manner, the blockage or zero drift of the vacuum gauge is avoided, the detection precision of the vacuum gauge is improved, and the service life of the vacuum gauge is prolonged.

Exemplary semiconductor processing systems may include a gas source coupled with a number of processing chambers. The gas source may include a controller. Each chamber may include an exhaust assembly having a foreline and a pump. The systems may include at least one abatement system coupled with each pump. The systems may include a plurality of exhaust lines that extend between each pump and the abatement system. The systems may include a dilution gas source coupled with each exhaust line. The systems may include a mass flow controller coupled between the dilution gas source and each exhaust line. The systems may include a temperature sensor coupled with each exhaust line between the pump and the abatement system. The temperature sensor may be communicatively coupled with the controller of the gas source, which may control flow of a gas to a chamber based on a measurement from the temperature sensor.