Plasma foreline thermal reactor system

Abstract

The present disclosure relates to methods and apparatus for treating vacuum processing system exhaust gases. In addition, methods and apparatus for maintenance of foreline plasma reactor subsystems are disclosed. In some embodiments, an apparatus for treating an exhaust gas in a foreline of a vacuum processing system includes a plasma source coupled with a foreline of a process chamber, a treatment agent source coupled with the plasma source, and a downstream trap to cool an exhaust stream and trap particles in the exhaust stream. In some embodiments, multiple foreline plasma reactor subsystems are used with a vacuum processing system, and one foreline plasma reactor subsystem can be isolated and maintained (e.g., cleaned) while exhaust gas treatment continues in another foreline plasma reactor subsystem and processing continues in the vacuum processing system.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application claims benefit of U.S. provisional application Ser. No. 61 / 949,217, filed Mar. 6, 2014, which is herein incorporated by reference.BACKGROUND[0002]1. Field[0003]Embodiments of the present disclosure generally relate to vacuum processing techniques. More particularly, embodiments of the present disclosure relate to a system for controlling reactions and condensation of exhaust gases from a vacuum processing system and cleaning methods for the same system.[0004]2. Description of the Related Art[0005]The flat panel display and semiconductor industries, as well as other industries, use vacuum processing (e.g., chemical vapor deposition (CVD)) techniques to produce high-purity solid materials. The process is often used to produce thin films. In many vacuum processing techniques, the substrate (e.g., a wafer) is exposed to one or more volatile precursor gases (i.e., vapors), which react with and / or decompose on the substrate sur...

AI Technical Summary

Benefits of technology

The patent describes a method to prevent particles from accumulating in the vacuum pump and foreline of a vacuum processing system. This is achieved by mixing a plasma with exhaust gas from the system and cooling the mixture. The method results in the trapping of particles formed from the plasma and exhaust gas mixture. The technical effect of this method is to improve the performance and reliability of vacuum processing systems by reducing the amount of particles present.

Problems solved by technology

The process gases used by CVD and other vacuum processing facilities include many compounds which must be abated or treated before disposal, due to regulatory requirements and environmental concerns.

If steps are not taken to prevent the reaction or condensation of the exhaust gases, pipes may be blocked and pumps may be damaged by the accumulation of chemicals deposited by the exhaust gases.

If there is no effective way to clean the undesired deposits from the equipment in situ, then the equipment must be removed or shut down for cleaning “off-line”.

If the equipment has to be opened to accomplish cleaning, this may lead to excessive reaction chamber down-time.

This problem exists in many types of vacuum processing chambers, such as etch reactors, ion implant chambers, plasma treatment chambers, atomic layer deposition chambers, and the like.

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