The invention discloses a
radio frequency front end with high stability, and belongs to the technical field of
radio frequency front ends. The
radio frequency front end comprises a multi-layer circuitboard, chips, a
vertical transition structure and a
dielectric enclosure frame, and realizes the high-stability work of the
radio frequency front end under high-frequency and high-integration requirements. The multi-layer circuit board is a multi-layer
dielectric plate comprising a radio frequency
transmission line layer, a
control line layer, a power
supply network layer and an isolation groundlayer, and is connected with the chips through solder balls and a heat dissipation substrate to realize electrical and thermal transmission. The chips are a power
amplifier, an LNA, a radio frequencyswitch, an amplitude-
phase control chip, a power divider
chip and the like. The
vertical transition structure is a vertical
metal connecting hole connected with a strip-shaped
transmission line, the
dielectric material of the dielectric
enclosure frame is the same as that of the multi-layer circuit board, vertical
metal grounding holes are formed in the periphery of the dielectric
enclosure frame,and the dielectric enclosure frame is prepared on the periphery of a
chip cavity to form an isolation boundary with a certain height. According to the invention, the performance and the working stability of the radio frequency front-end module and the application
system are effectively improved.