Electromagnetic shielding film preparing method
A technology of electromagnetic shielding film and metal shielding layer, which is applied in the fields of magnetic/electric field shielding, reduction of crosstalk/noise/electromagnetic interference (, printed circuit manufacturing, etc.), which can solve the problems of poor shielding efficiency and conductivity of electromagnetic shielding films, and achieve Improve electromagnetic shielding performance, improve electromagnetic shielding effect, and enhance the effect of conductive performance
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[0016] The embodiment of the present invention provides a method for preparing an electromagnetic shielding film, comprising the following steps:
[0017] S01. Provide a carrier film layer, and prepare an insulating layer on the carrier film layer;
[0018] S02. Carry out conductive treatment to the insulating layer by means of vacuum plating;
[0019] S03. Place the conductively treated insulating layer substrate in an alkaline electrolyte, and perform at least three electroplating depositions on the surface of the conductive substrate by using an alkaline solution precipitation method to prepare a metal shielding layer;
[0020] S04. placing the metal shielding layer in a micro-etching solution, performing micro-etching on the surface to obtain a micro-etching layer;
[0021] S05. placing the metal shielding layer after the microetching treatment in an acidic electrolyte, and performing at least one acid solution settlement treatment to prepare a foamed metal layer;
[002...
Embodiment 1
[0051] A method for preparing an electromagnetic shielding film, comprising the following steps:
[0052] S11. Provide a base film with a thickness of 15 μm to 200 μm, evenly coat the surface of the base film with a silicone oil release agent or a silicone-free release agent of 0.1 μm to 30 μm, cure with UV, and then bake and cure at 50°C to 180°C Form a carrier film with a release layer; evenly coat modified epoxy resin glue or high-temperature resistant ink with a thickness of 1 μm to 50 μm on the carrier film layer, bake and cure at 50°C to 180°C to form an insulating layer.
[0053] S12. Conducting conductive treatment on the insulating layer by means of vacuum plating.
[0054] S13. placing the conductively treated substrate in an alkaline electrolyte, and performing at least three electroplating depositions on the surface of the conductive layer by using an alkaline solution deposition method to obtain a semi-finished metal layer;
[0055] S14. placing the alkali-treate...
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