81 results about "Vertical transition" patented technology

A television line doubler (interlaced to progressive scan converter) incorporating the following aspects—an improved field motion detector which does not treat low frequency vertical transitions as motion; a frame motion detector having an improved ability to differentiate motion from subcarrier signal components; a sawtooth artifact detector; a sawtooth artifact detector in combination with a film pattern detector, such that the artifact detector can take the film pattern detector out of film mode earlier than it would if it only were responsive to a break in the film pattern; tandem field motion detectors; an improved field based film detector; film pattern detectors and motion detectors used therewith which operate by performing end-of-field calculations; the combination of a field motion detector and a frame motion detector such that the frame motion detector provides a motion signal used as a verification by the field motion detector; an improved NTSC film detector requiring a minimum number of NTSC film pattern sequences; and an improved PAL film detector employing a minimum motion threshold detector.

A pseudo-coaxial vertical transition (10) includes a substrate (16). A bump array is disposed in a substantially concentric bump pattern upon the substrate (16) for simulating a pseudo-coaxial vertical electromagnetic wave propagation. The bump array is formed from a centrally disposed bump (32) having a predetermined bump diameter, and a plurality of at least five ground bumps (36) substantially equi-distant and circularly disposed about the centrally disposed bump (32). The predetermined bump diameter and a bump spacing of the centrally disposed bump are determined in relation to the plurality of ground bumps and a dielectric constant of air for providing a characteristic impedance.

A portable deck system for recreational vehicles and fifth wheel campers for enhancing the accessibility of an elevated exterior door. The system includes a platform assembly having a top surface positionable adjacent to a threshold of the entry door, a plurality of legs extending between the ground and the platform assembly and hingeably coupled to the platform assembly. An access assembly is operationally coupleable to the platform assembly, and provides a vertical transition between the platform assembly and ground level. A railing assembly extends along at least a portion of the platform for providing a hand grip for the user.

The invention discloses a method for preparing a vertical transition metal sulfide nanosheet array through chemical vapor deposition. The method comprises the following steps: 1) adopting porous goldas a growth substrate; 2) placing single sulfur and a chloride of a transition metal as precursors at the upstream of an air flow; and 3) introducing a carrier gas to remove residual air, after the air flow is stabilized, respectively heating the single sulfur, the chloride of the transition metal and the porous gold to different temperatures, keeping the temperatures for a certain time, and growing on the substrate, thereby obtaining the vertical transition metal sulfide nanosheet array. By adopting the method, preparation of large-scale metallic transition metal sulfide nanosheets can be achieved, and moreover the vertical metallic transition metal sulfide nanosheet array prepared by using the synthesis method has excellent electro-catalysis hydration separation properties.

A vertical-transition structure comprises a microstrip line and a combination of a coaxial connector and a metallic ring underneath the microstrip line. A first through hole is created next to the microstrip line and near one end of its signal line. The metallic ring has a second through hole. The coaxial connector has a center conductor including an extended portion to be inserted into the second through hole via its center, and subsequently through the first through hole to connect to the signal line vertically.

Specially, the extended portion is not inserted through the center of the first through hole. The present structure can improve the high-frequency insertion loss of the vertical transition caused by the sudden change of electromagnetic field distributions from a coaxial line to a microstrip line and the resonant is response of the coaxial connector, and therefore, increase the 1-dB transmission passband of the vertical transition substantially.

The invention relates to the technical field of millimeter-wave passive radio-frequency circuits, in particular to a radio-frequency vertical transition structure based on a ceramic microstrip line. The radio-frequency vertical transition structure based on the ceramic microstrip line can realize the characteristics of capacitance and induction devices in the prior art by using the ceramic dielectric microstrip line, utilizing a dielectric constant up to 9.8 of ceramic, adjusting the width of the microstrip line in different positions and combining other inherent characteristics (such as ceramic dielectric layer thickness) of the microstrip line, therefore, introduction of additional capacitance and induction devices in a circuit is not required; an in-line structure of a high-density metallized via hole is not required; the sensitivity of indexes such as a radio-frequency port voltage standing wave ratio and transmission loss to design tolerance, processing tolerance and technology tolerance can be effectively reduced; and first yields of design, processing and manufacturing can be increased. In addition, the unit price of the ceramic dielectric microstrip line is sharply lowered during batch processing, so that the excellent radio-frequency performance can be ensured on the premise that the cost is significantly lowered.

The invention provides a tail-sitter vertical take-off and landing unmanned aerial vehicle. The unmanned aerial vehicle comprises a fuselage (1), wings (2), tail wings (3), motors (4) and propellers (5), wherein the wings (2) and the tail wings (3) are disposed on the outer surface of the fuselage (1); the wings (2) are disposed in a lower dihedral manner, and the tail wings (3) are disposed in anupper dihedral manner; flight modes of the unmanned aerial vehicle comprise a vertical flight mode, a vertical-to-level transition mode, a level flight mode and a level-to-vertical transition mode, and the unmanned aerial vehicle combines both flight characteristics of a rotary-wing unmanned aerial vehicle and a fixed-wing unmanned aerial vehicle, so that an area for takeoff and landing is reduced. The speed in the level flight mode is high. The unmanned aerial vehicle has the characteristics of vertical take-off and landing, can be deployed in various restricted environments such as mountainous and hilly lands and narrow urban streets, and has a horizontal high-speed cruising function, so that the hang time is increased and the navigation is expanded. The invention also provides a control system and a control method of the tail-sitter vertical take-off and landing unmanned aerial vehicle.

The invention relates to the field of tile type active phased-array antenna, and particularly relates to a tile type TR module capable of realizing radio-frequency signal vertical transmission. The module comprises a shell, the shell is internally provided with an upper chamber and a lower chamber, the upper chamber is internally provided with a radio frequency link and a radio frequency input connector, the lower chamber is internally provided with a change-over microstrip, the change-over microstrip is respectively in signal transmission connection with the radio frequency link and the radiofrequency input connector, thus, transmission of the radio frequency signal is on the same part, devices are arranged closely, integration level is relatively high, and structure form space is compact, stability and reliability of signal transmission are guaranteed, moreover, the shell is simple in structure, improvement of production efficiency of the module is facilitated, moreover, the radio frequency signal is subjected to vertical transition twice and then input to the radio frequency link, thus, vertical input of the radio frequency signal is realized, loss of the signal is reduced, andstability and reliability of signal transmission are guaranteed further.

The invention belongs to microwave antenna technology and relates to the improvement of the microstrip line-coaxial vertical transition structure. Comprising a microstrip line [1] and a coaxial line [2] vertically connected to the microstrip line, it is characterized in that there is a transition conductor [2c] in the above-mentioned transition hole, and the upper end surface of the transition conductor [2c] is connected to the microstrip [ The edge of the end of 1a] is welded to form an electrical connection, and the lower end surface of the transition conductor [2c] is welded to the end of the inner conductor [2a] of the coaxial line [2] to form an electrical connection. The present invention makes the impedance of the connection position of the transition structure a resistive impedance, makes the impedances of the two transmission lines completely match, and avoids the problems of deterioration of voltage standing wave ratio, increase of insertion loss, and narrowing of working frequency band due to impedance mismatch.

The invention relates to a vertical transition from a broadband micro strip to a micro strip. The vertical transition is composed of a first medium substrate, a middle stratum and a second medium substrate which are parallely distributed, wherein a top layer micro strip structure is arranged at one end of the first medium substrate, a bottom layer micro strip structure is arranged at the other end of the second medium substrate, the top layer micro strip structure is completely same with the bottom layer micro strip structure, the top layer micro strip structure and the bottom layer micro strip structure are oppositely distributed, the middle stratum is a metal layer provided with a U-shaped coupling groove, the top layer micro strip structure and the bottom layer micro strip structure both comprises a first micro strip line, a second micro strip line and a high-low impedance stub line of a two-stage terminal open circuit, and the high-low impedance stub line of the two-stage terminal open circuit is located between the first micro strip line and the second micro strip line. The vertical transition is simple in structure, greatly expands bandwidth, reduces system loss, enables design to be flexible, reduces cost and is wide in applicable scope.

A method for a vertical transition between a coaxial structure and a microstrip line features a slot in the ground plane of the microstrip line and near one end of its signal line. Multiple through holes are created at the substrate within the slot. The multiple through holes include a transition hole next to the end of the signal line, and at least a second hole. The transition hole and the slot are managed to establish a first eccentric configuration to achieve field transformation between the coaxial structure and the microstrip line, which would reduce the insertion loss of the vertical transition at higher frequencies and increase its 1-dB passband. The second hole and the slot are arranged to create a second eccentric configuration, and the second hole is used to relocate a resonance response caused by the slot towards higher frequencies to further increase the 1-dB passband.

The invention discloses a microstrip vertical transition structure, which is characterized in that the microstrip vertical transition structure comprises a microstrip section and a waveguide section;The microstrip segment comprises two microstrip plates respectively inserted into the waveguide segments with the center window of the wide side; The waveguide section comprises a waveguide cavity main body, an upper cover plate of the waveguide cavity and a lower cover plate of the waveguide cavity respectively buckled with two ends of the waveguide cavity main body; The microstrip plate is respectively arranged between the waveguide cavity main body and the upper cover plate of the waveguide cavity, and between the waveguide cavity main body and the lower cover plate of the waveguide cavity.The invention adopts a microstrip-based method, which comprises the following steps of: Waveguide The form of microstrip has lower insertion loss, larger working bandwidth, compact structure, convenient processing and easy loading and unloading. And the height of the waveguide can be easily changed, which can be applied to more vertical transition requirements of the microstrip.

Mobile antenna system comprising rotary part by azimuth, which is an electronically steered in elevation phase array antenna, comprising: plurality of (multi)layered structures, placed at certain levels, said structures include microstrip antenna elements (12), feeding lines (20), which properly combined and guide the electromagnetic energy, forming the necessary phase and amplitude distribution over the antenna elements, a plurality of electronic modules (28) providing amplification, phase change, frequency conversion and steering of the received signal, power supply and control circuits for the same electronic modules; a plurality of vertical transitions (13), providing the passing of the electromagnetic energy between the layered structures from different levels; frequency converting device and rotary joint (18), passing the received signal, the power supply and control circuits to the static part; sensors detecting the spatial movement of the system, and power supply and control units; static part, comprising bottom (10), cover (2) with radiotransparent part (1), mechanical supports, motor (11), gear, plurality of electronic modules (19, 6, 7).

The invention relates to a three-dimensional stacked packaging module single-board testing tool. The three-dimensional stacked packaging module single-board testing tool is composed of four parts of a control signal and radiofrequency signal circuit board and an installation module thereof (1010), a vertical interconnection connector and an installation frame thereof (1020), a circuit board to be tested and a fixing frame thereof (1030) and a radiofrequency signal output module (1040). The vertical interconnection connector and the installation frame thereof (1020) are composed of an installation frame (1021), vertical transition connectors (1022) and guide sleeves (1023); the circuit board to be tested and the fixing frame thereof (1030) are composed of a metal plate to be tested (1031) and a circuit board (1032); and the signal output module (1040) is composed of radio frequency connectors (1041), hexagon copper posts (1042), fuzz button conversion coaxial connectors (1043), guide pillars (1044), a mounting base plate (1045), microstrip boards (1046) and cover plates (1047). By employing the three-dimensional stacked packaging module single-board testing tool, the contact area of a radiator is increased, space of the thermal design is expanded, natural heat dissipation can satisfy the demand, and the difficulty level and cost of the thermal design are reduced.

A high-speed transverse-swing feeding conveying belt feeding shoe magnet automatic chamfering grinding machine comprises an electrical appliance control system, a power device and an abrasive wheel (91), and is characterized by further comprising a transverse-swing assembly, a push rod assembly and a lifting assembly, wherein the transverse-swing assembly, the push rod assembly and the lifting assembly are driven by the power device. The automatic chamfering grinding machine has the advantages that a transverse-swing cam, a push rod cam and a fixture lifting cam move coaxially and synchronously to enable high synchronicity of various independent mechanical movements, and strict synchronization in X-axial, Y-axial and Z-axial linear movement of the magnetic shoe is realized by three rotary cams, one linear cam and four linear movement pairs (a fixture carriage linear movement pair, a push rod carriage linear movement pair, a vertical transition carriage linear movement pair and a swing rod carriage linear pair), and accordingly stable and reliable operation under the high-speed condition can be realized, and the chamfering speed of the automatic chamfering grinding machine is higher than that of the prior art.

The invention discloses a transition structure among three-dimensional multi-chip component boards. The transition structure among the three-dimensional multi-chip component boards comprises a three-dimensional component module made of epoxy resin, an upper-layer circuit board sealed in the three-dimensional component module and a lower-layer circuit board sealed in the three-dimensional component module, a metal layer laid on the surface of the three-dimensional component module and a coplanar waveguide sculptured on the metal layer. The upper-layer circuit board is arranged under the lower-layer circuit board in a paralleled mode, and the coplanar waveguide is vertically arranged on the lateral side of the three-dimensional component module and is perpendicular to the upper-layer circuit board and the lower-layer circuit board. The transition structure among the three-dimensional multi-chip component boards is capable of conducting a three-dimensional vertical interconnection on a lateral side of a 3D-Multi Chip Module (MCM), and achieving vertical interconnections among multi-layer circuit boards. Areas of planar circuits are not occupied by the interconnections. Signal transmission has a wide frequency band, little insertion loss, little return loss and a simple structure. Circuit functions of expanding filtering and distributing power and the like are easy to expand on the interconnections arranged on the lateral side. Further, requirements to registration precision of a vertical circuit and a horizontal circuit are not high, accordingly technical implementability is high.

The invention discloses a three-dimensional tile type microwave assembly which comprises a metal structural part, a radio frequency insulator, a feed insulator, a circuit piece and a micro-rectangularelectric connector, wherein the metal structural part plays a role in fixedly supporting the microwave assembly, the radio frequency insulator, the feed insulator, the circuit piece and the micro-rectangular electric connector; the radio frequency insulator and the circuit piece realize high-performance and high-reliability transmission of microwave signals in the vertical direction; the micro-rectangular electric connector, the feed insulator and the circuit piece realize transmission from the vertical direction to the horizontal direction of a power supply and control signals. The three-dimensional tile type microwave assembly depends on the traditional micro-assembly process, and realizes the vertical transmission of microwave and power control signals based on the radio frequency insulator and the micro-rectangular electric connector. Compared with the prior art, except for the vertical transition structure of the upper and lower end surface radio frequency insulators and the micro-rectangular electric connector, other circuits in the microwave assembly can be realized in single-side horizontal transmission, and the three-dimensional tile type microwave assembly is simple to assemble and reliable in performance.

A circuit board assembly includes a low-frequency (LF) substrate, a monolithic microwave integrated circuit (MMIC), electrical components, a high-frequency (HF) substrate, and an antenna. The LF substrate is formed of FR-4 type material. The LF substrate defines a waveguide through the LF substrate. The MMIC is attached to the top-side of the LF substrate and outputs the radio-frequency signal. The electrical components are electrically attached to the LF substrate. The HF substrate is soldered to the top side of the LF substrate. An opening through the HF substrate surrounds the MMIC. A vertical transition guides the radio-frequency signal output by the MMIC to the waveguide. A plurality of wire bonds electrically connects the MMIC to the HF substrate and couple the radio-frequency signal from the MMIC to the vertical transition. The antenna is attached to the LF substrate and configured to radiate the radio-frequency signal from the waveguide.

The invention relates to a coating system and a coating method, especially to a dynamic/static hybrid coating system and a dynamic/static hybrid coating method by the utilization of the dynamic/static hybrid coating system. The dynamic/static hybrid coating system comprises a static coating system and a dynamic coating system. The static coating system contains a static coating chamber, a first coating assembly and a first transmission assembly. The reciprocating scan distance is zero or any distance less than the spacing between adjacent target materials. The dynamic coating system contains a dynamic coating chamber, a second coating assembly and a second transmission assembly. The dynamic/static hybrid coating method contains two modes. The first mode is as follows: static coating comes first and dynamic coating follows; then vertical transition of a substrate is conducted and the substrate comes out in a reverse direction; and the substrate is uncoated after translation. The second mode is as follows: the substrate firstly enters the innermost chamber; static coating is conducted after vertical transition; then, the substrate comes out in a reverse direction for dynamic coating; and finally, the substrate comes out from a low vacuum chamber. By the system and the method, a substrate can be coated and coating is uniform. Electrostatic damage to an electrostatic sensitive device can be prevented.