Micro-strip-to-waveguide vertical transition structure achieved through multi-layer step type substrate integration waveguide
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
- Publication Date
- 2014-01-15
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Abstract
Description
technical field
[0001] The invention belongs to the field of millimeter wave communication, and in particular relates to a vertical transition design technology from a millimeter wave broadband microstrip to a waveguide. Background technique
[0002] Microstrip-waveguide transition is widely used in various microwave and millimeter wave modules to realize the transmission of microwave and millimeter wave signals from planar circuits, especially planar integrated circuits containing active devices, to waveguide structures, and waveguide structures are characterized by their Features such as low loss and high Q value are widely used in the millimeter wave frequency band.
[0003] So far, traditional microstrip-to-waveguide vertical transitions mainly include E-plane probe-fed type, slot-coupled patch type, and aperture (ground) coupled (stacked) patch type. The former usually requires a short-circuit surface, which is an obstacle to the compactness and integration of the circ...