Micro-strip-to-waveguide vertical transition structure achieved through multi-layer step type substrate integration waveguide

Abstract

The invention discloses a micro-strip-to-waveguide vertical transition structure achieved through multi-layer step type substrate integration waveguide. One section of multi-layer step substrate integration waveguide is adopted through the structure to achieve the vertical transition of a micro-strip and a caliber of the waveguide between the micro-strip and the caliber of the waveguide. Coupling calibers are etched among all layers of step substrate integration waveguide and between the substrate integration waveguide at the lowest layer and the caliber of the waveguide, the multi-layer substrate integration waveguide in the two plane directions is in matched connection with the single-layer micro-strip through the step structure, and the broadband performance is achieved. The novel multi-layer step substrate integration waveguide structure is adopted, the short circuit plane is omitted, the plane integration is facilitated, and especially connection between a plane circuit and a waveguide structure system is facilitated. The broadband performance is achieved by optimizing the design calculation.

Description

technical field [0001] The invention belongs to the field of millimeter wave communication, and in particular relates to a vertical transition design technology from a millimeter wave broadband microstrip to a waveguide. Background technique [0002] Microstrip-waveguide transition is widely used in various microwave and millimeter wave modules to realize the transmission of microwave and millimeter wave signals from planar circuits, especially planar integrated circuits containing active devices, to waveguide structures, and waveguide structures are characterized by their Features such as low loss and high Q value are widely used in the millimeter wave frequency band. [0003] So far, traditional microstrip-to-waveguide vertical transitions mainly include E-plane probe-fed type, slot-coupled patch type, and aperture (ground) coupled (stacked) patch type. The former usually requires a short-circuit surface, which is an obstacle to the compactness and integration of the circ...

AI Technical Summary

Problems solved by technology

In recent years, there have also been research reports on the vertical transition from SIW to waveguide, which eliminates the short-circuit surface, and the working bandwidth can be wide or narrow. It is easy to obtain a wider working bandwidth by using the vertical transition of a thicker SIW structure, but such a structure is too thick. The thickness of the substrate is not compatible with the microstrip structure working in this frequency band, which also limits its interconnection with planar circuits, especially functional modules containing active devices

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