Three-dimensional stacked packaging module single-board testing tool and testing method

Abstract

The invention relates to a three-dimensional stacked packaging module single-board testing tool. The three-dimensional stacked packaging module single-board testing tool is composed of four parts of a control signal and radiofrequency signal circuit board and an installation module thereof (1010), a vertical interconnection connector and an installation frame thereof (1020), a circuit board to be tested and a fixing frame thereof (1030) and a radiofrequency signal output module (1040). The vertical interconnection connector and the installation frame thereof (1020) are composed of an installation frame (1021), vertical transition connectors (1022) and guide sleeves (1023); the circuit board to be tested and the fixing frame thereof (1030) are composed of a metal plate to be tested (1031) and a circuit board (1032); and the signal output module (1040) is composed of radio frequency connectors (1041), hexagon copper posts (1042), fuzz button conversion coaxial connectors (1043), guide pillars (1044), a mounting base plate (1045), microstrip boards (1046) and cover plates (1047). By employing the three-dimensional stacked packaging module single-board testing tool, the contact area of a radiator is increased, space of the thermal design is expanded, natural heat dissipation can satisfy the demand, and the difficulty level and cost of the thermal design are reduced.

Description

technical field [0001] The invention belongs to radio frequency testing technology Background technique [0002] The contact signal output is a form of external output interface of a three-dimensional stacked package module. One test method for the contact output module is to use a button to SMA or a button to SMP. However, due to the small size of the three-dimensional package module, the connector The installation surface area is large, most of the heat dissipation area of ​​the module is occupied by the connector, the available heat dissipation area is very small, and the connector is in the vertical direction, so the cable connection operation is very inconvenient. [0003] Three-dimensional packaging requires accurate positioning during the test process. A pair of positioning pins are used for positioning. The gap between the positioning pins and the positioning holes is enlarged due to the leverage effect. Damage; using multiple pairs of positioning pins for positioni...

AI Technical Summary

Problems solved by technology

[0002] The contact signal output is a form of external output interface of a three-dimensional stacked package module. One test method for the contact output module is to use a button to SMA or a button to SMP. However, due to the small size of the three-dimensional package module, the connector The installation surface area is large, most of the heat dissipation area of ​​the module is occupied by the connector, the available heat dissipation area is very small, and the connector is in the vertical direction, the cable connection operation is very inconvenient

[0003] Three-dimensional packaging requires accurate positioning during the test process. A pair of positioning pins are used for positioning. The gap between the positioning pins and the positioning holes is enlarged due to the leverage effect. Damaged; using multiple pairs of positioning pins for positioning, due to over-positioning, the sliding resistance between the positioning pins and the positioning holes is relatively large, there is a clear sense of astringency, and the user experience effect is poor

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