A
printed circuit board (PCB) serves as a core basic component of the
electronic information industry, and the manufacturing process of the PCB faces double challenges of rapid iteration and customization requirements of electronic products. A traditional PCB
manufacturing technology (such as mechanical board manufacturing, silk-
screen printing and the like) is suitable for large-scale production, but has the defects of long production period, high cost, minimum order quantity limitation and the like, and is difficult to meet the market requirements of small batch and high flexibility. Under the background, the 3D printing technology is completely exposed by means of the efficient customized production capacity, the supply efficiency of a minimum batch of PCBs (such as test single boards and concept
verification boards) can be remarkably improved, the production batch constraint of a traditional method is avoided, and the comprehensive cost
advantage is shown in the design
verification stage. However, the current 3D printing PCB technology is still limited by the
circuit complexity and the number of
layers and is mostly limited by single / double panel manufacturing, and the performance of the conductive
slurry and the base material needs to be optimized urgently. The key technical bottlenecks of interlayer vertical
interconnection, multilayer medium lamination manufacturing and the like need to be broken through in the future, so that 3D printing of high-density and multilayer arbitrary
interconnection PCBs is achieved, deep application of the technology in the field of intelligent manufacturing and
new materials is promoted, and an innovative development opportunity is created for the PCB industry.