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Backboard system

A backplane and veneer technology, used in instruments, electrical digital data processing, digital data processing components, etc., can solve problems such as single heat dissipation design, and achieve the effect of less constraints and flexible heat dissipation air duct design

Inactive Publication Date: 2012-09-19
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing backplane system has the problem of single heat dissipation design, such as figure 1 and figure 2 As shown in the figure, the orthogonal mid-backplane and mid-backplane plug-in structure can only design heat dissipation devices through the air ducts in the upper and lower directions, such as image 3 As shown in the figure, the orthogonal structure of the central backplane requires the design of two sets of vertical air ducts to dissipate heat from the single board 2 on both sides of the backplane 1.

Method used

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Embodiment Construction

[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0026] Such as Figure 4 As shown, the embodiment of the present invention provides a backplane system, which is applied to network equipment, and includes a plurality of backplanes 1; a plurality of slots 11 for connecting single boards are arranged at the edge of each backplane 1; the same Each slot 11 on the backplane 1 is used to connect a different board; each backplane 1 has a slot 11 used to connect to the same board.

[0027] Such as Figure 5 As shown, s...

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Abstract

The invention discloses a backboard system, relating to the technical field of communication and used for reducing the limitation of a heat radiation framework. The backboard system is applied to network equipment and comprises a plurality of backboards, wherein a plurality of slots for connecting single boards are formed on the edge of each backboard; each slot on the same backboard is used for connecting the different single boards; and each slot on each backboard is used for connecting the same single board.

Description

technical field [0001] The invention relates to the technical field of communications, in particular to a backplane system. Background technique [0002] In a frame-type network device, the backplane is the core component. The backplane and different boards are connected to each other to implement signal interconnection between different boards. The backplane and the boards form the backplane system. Existing backplane systems include the following three structures: single-sided plug-in board, mid-backplane mated or mid-backplane orthogonal. Specifically, such as figure 1 As shown in , the single-sided plug-in structure is that one side of the backplane 1 is provided with a single board 2, as shown in figure 2 As shown in the figure, the inter-plug structure of the middle backplane is that the two sides of the backplane 1 are respectively provided with opposite boards 2, as shown in image 3 As shown, the orthogonal structure of the mid-mounted backplane is that the two ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/16G06F1/18
Inventor 郭蓥张俊
Owner HUAWEI TECH CO LTD
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