Backboard system

A backplane and veneer technology, used in instruments, electrical digital data processing, digital data processing components, etc., can solve problems such as single heat dissipation design, and achieve the effect of less constraints and flexible heat dissipation air duct design

Inactive Publication Date: 2012-09-19
HUAWEI TECH CO LTD
View PDF3 Cites 23 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing backplane system has the problem of single heat dissipation design, such as figure 1 and figure 2 As shown in the figure, the orthogonal mid-backplane and mid-backplane plug-in structure can only design heat dissipation devices through the air ducts in the upper and lower directions, such as image 3 As shown in the figure, the orthogonal structure of the central backplane requires the design of two sets of vertical air ducts to dissipate heat from the single board 2 on both sides of the backplane 1.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Backboard system
  • Backboard system
  • Backboard system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0026] Such as Figure 4 As shown, the embodiment of the present invention provides a backplane system, which is applied to network equipment, and includes a plurality of backplanes 1; a plurality of slots 11 for connecting single boards are arranged at the edge of each backplane 1; the same Each slot 11 on the backplane 1 is used to connect a different board; each backplane 1 has a slot 11 used to connect to the same board.

[0027] Such as Figure 5 As shown, s...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a backboard system, relating to the technical field of communication and used for reducing the limitation of a heat radiation framework. The backboard system is applied to network equipment and comprises a plurality of backboards, wherein a plurality of slots for connecting single boards are formed on the edge of each backboard; each slot on the same backboard is used for connecting the different single boards; and each slot on each backboard is used for connecting the same single board.

Description

technical field [0001] The invention relates to the technical field of communications, in particular to a backplane system. Background technique [0002] In a frame-type network device, the backplane is the core component. The backplane and different boards are connected to each other to implement signal interconnection between different boards. The backplane and the boards form the backplane system. Existing backplane systems include the following three structures: single-sided plug-in board, mid-backplane mated or mid-backplane orthogonal. Specifically, such as figure 1 As shown in , the single-sided plug-in structure is that one side of the backplane 1 is provided with a single board 2, as shown in figure 2 As shown in the figure, the inter-plug structure of the middle backplane is that the two sides of the backplane 1 are respectively provided with opposite boards 2, as shown in image 3 As shown, the orthogonal structure of the mid-mounted backplane is that the two ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/16G06F1/18
Inventor 郭蓥张俊
Owner HUAWEI TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap