The invention discloses an air medium-filled suspended slot
line structure, which is an air medium-filled suspended slot
line structure based on an MISL platform and is formed by stacking a plurality of
layers of
metal plates, a self-packaging structure is formed, a slot
line structure of a main circuit is arranged on one layer of
metal plate inside, and the other layer of
metal plate is arranged on the other layer of metal plate inside. And hollow cavities filled with air are formed in the metal plates above and below the slot line structure of the main circuit through partial
cutting. According to the invention, a multi-layer metal plate stacking structure is adopted to form a multi-layer self-packaging structure,
etching can be carried out on the internal metal plates to form a slot structure, and mediums in the slot structure and above and below the metal plates where the slot structure is located are air, so that
dielectric loss caused by a slot line structure designed based on a traditional PCB is thoroughly eliminated, and the reliability of the slot line structure is improved. And therefore, relatively low loss can be realized. Due to the adoption of a self-packaging structure, an
electric field is mainly distributed in air in the packaging structure, so that the
radiation loss of the slot line can be greatly reduced.