Universal testing method for broad band product interface single board

A general-purpose testing and interface board technology, applied in transmission monitoring, digital transmission systems, electrical components, etc., can solve problems such as affecting the progress of the market, unfavorable system integration, system interference, etc., to achieve low test equipment cost, convenient system integration, system Composing simple effects
CN1411173AInactive Publication Date: 2003-04-16HUAWEI TECH CO LTD

Patent Information

Authority / Receiving Office
CN ยท China
Current Assignee / Owner
HUAWEI TECH CO LTD
Publication Date
2003-04-16
Estimated Expiration
Not applicable ยท inactive patent

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Abstract

A wide a band product interface single plate general test method based on a system containing host test device of providing data source, analyzing and receiving data includes the following steps: connecting the tested interface plate to a general bus interface of the testing device via n interface bus converting module; controlled by the host, CPU initializes the tested interface plate, matches and sends tested data and circulates back via tested interface plate, processes received data; CPU fetches the above mentioned test result and statistic information to the testing host.
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Description

technical field

[0001] The invention belongs to the communication equipment testing technology, in particular to a universal testing method for interface single boards of broadband products. Background technique

[0002] With the development of communication technology, there are more and more types of interface boards for broadband products, and the speed is getting faster and faster. Therefore, higher requirements are put forward for the testing of such boards.

[0003] The interface type single board is generally simple in structure, mainly realizes the physical layer function of the communication network, and provides the service interface with the link layer. The composition of general broadband interface boards is as follows: figure 1 shown. It is mainly composed of physical layer processing chips, link layer interfaces, optical and electrical interfaces, and serial-to-parallel conversion units.

[0004] Broadband interface boards are always connected to the transce...

Claims

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