31results about How to "Guaranteed RF performance" patented technology

The invention provides a method for manufacturing a metal substrate by adopting reflow soldering, comprising the following steps: 1, providing a tin-stibium-tin paste, a metal base plate and a PCB (Printed Circuit Board); 2, designing a steel-mesh window-opening graphic according to the PCB and the metal base plate, and adopting a steel-mesh printing method to print the tin-stibium-tin paste on the metal base plate; 3, adopting a soldering jig to bear the PCB and the metal base plate, and providing the pressure size and uniformity required when the PCB and the metal base plate are soldered; and 4, adopting the reflow soldering method, setting the temperature for reflow soldering according to the melting requirement of the tin-stibium-tin paste and the size of the metal base plate, and leading the tin-stibium-tin paste to be melted to solder and laminate the PCB and the metal base plate into the metal substrate. In the method, the ultra-high-temperature tin-stibium-tin paste with heat conduction and electric conduction is adopted to solder the high-frequency PCB and the metal base plate together, and the radio-frequency performance of the high-frequency PCB and the radiating performance of the metal base plate are effectively guaranteed, so that the reliability of the metal substrate is improved, the processing cost is reduced, then non-layering of the PCB and the metal base plate also can be guaranteed when an electronic device is secondarily attached.

The invention discloses a method and apparatus for improving radio frequency power consumption of a mobile terminal. The method comprises the following steps: detecting whether a mobile terminal is switched from a normal use electricity consumption mode to a smart electricity saving mode, and if the mobile terminal is switched from a normal electricity consumption mode to a smart electricity saving mode, then lowering the APT voltage value of a radio frequency power amplifier, such that ICQ of the radio frequency power amplifier is deviated from a normal point and ACLR property is lowered and working current is reduced. According to the invention, the method is easy to operate, enables the mobile terminal to acquire longer time of duration, improves user experience, enables a user to switch the mobile terminal between the two working modes on the basis of actual needs, and when the mobile terminal is switched to normal use electricity consumption mode, can guarantee radio frequency indexing property of the mobile terminal.

The invention relates to a three-dimensional stacked packaging module single-board testing tool. The three-dimensional stacked packaging module single-board testing tool is composed of four parts of a control signal and radiofrequency signal circuit board and an installation module thereof (1010), a vertical interconnection connector and an installation frame thereof (1020), a circuit board to be tested and a fixing frame thereof (1030) and a radiofrequency signal output module (1040). The vertical interconnection connector and the installation frame thereof (1020) are composed of an installation frame (1021), vertical transition connectors (1022) and guide sleeves (1023); the circuit board to be tested and the fixing frame thereof (1030) are composed of a metal plate to be tested (1031) and a circuit board (1032); and the signal output module (1040) is composed of radio frequency connectors (1041), hexagon copper posts (1042), fuzz button conversion coaxial connectors (1043), guide pillars (1044), a mounting base plate (1045), microstrip boards (1046) and cover plates (1047). By employing the three-dimensional stacked packaging module single-board testing tool, the contact area of a radiator is increased, space of the thermal design is expanded, natural heat dissipation can satisfy the demand, and the difficulty level and cost of the thermal design are reduced.

The invention discloses a mobile terminal. The mobile terminal comprises a shell, a printed wiring board, a metal frame, a first connector, a second connector and a first antenna, wherein the metal frame encircles the shell and comprises a first frame, a second frame and a third frame, the first frame is provided with a first gap, the first connector is connected with the first frame on the first gap, the second connector is connected with the third frame and a ground end of the printed wiring board separately, the first antenna comprises a first antenna main radiation body, a first part, a second part, a first inductor, a third part, a fourth part and a fifth part, the first part parallel to the first frame is connected with the first connector, the second part parallel to the third frame is connected with the first part, the first inductor is connected with the second part and the ground end of the printed wiring board separately, the third part is arranged under the second part and is parallel to the second part, one end of the third part is suspended, the fourth part parallel to the first part is connected with a second inductor and the third part separately, and the fifth part parallel to the first part is connected with the second inductor and a first feeding end of the printed wiring board separately. By the mobile terminal, the antenna cost is reduced, and the mobile terminal is convenient and flexible to debug. The invention also discloses an antenna of the mobile terminal.

The invention discloses a low-cost radio frequency differential amplifier. The differential amplifier comprises an input balun, a differential radio frequency circuit, and an output balun, wherein the input balun is used for outputting an input radio frequency single-ended signal by converting the same into a balancing mode from an unbalancing mode by use of two sub-baluns so as to obtain a differential signal required by the differential radio frequency circuit; the differential radio frequency is used for amplifying the balanced radio frequency signal output by the input balun; and the output balun is used for outputting the balanced radio frequency signal, which is output by the different radio frequency circuit, by converting the same into the unbalancing through two sub-baluns. By use of the differential amplifier disclosed by the invention, the layout of the system is compact while the radio frequency performance of the circuit is guaranteed, the chip area around an active device is sufficiently utilized, and the cost is effectively lowered.

The invention discloses a heterogeneous micro-packaging method for a radio frequency power amplifier chip, which is applied to the technical field of radio frequency and aims to solve the problem that the service life is not considered during hole arrangement in the conventional packaging technology. The heat dissipation through holes are optimized through the simulation technology, so that the optimized heat dissipation through hole layout meets the related parameter performance of chip packaging, and the radio frequency performance and the heat dissipation problem of the chip packaging are effectively balanced.

The invention discloses a current multiplexing radio frequency front end structure, and belongs to the technical field of electronic circuits. The current multiplexing radio frequency front end structure comprises a mixer, a low noise amplifier and a static bias current control circuit, the signal output end of the low-noise amplifier is connected with the signal input end of the frequency mixer;the low-noise amplifier and the frequency mixer realize static bias current sharing through a three-terminal inductor; a static bias current control circuit is connected between the power supply voltage and the third end of the three-end inductor, and the static bias current control circuit is used for increasing the current flowing to the low-noise amplifier; the static bias current control circuit comprises a PMOS transistor, a source electrode and a grid electrode of the PMOS transistor are connected, the source electrode of the PMOS transistor is connected with power supply voltage, and adrain electrode of the PMOS transistor is connected with the third end of the three-end inductor; the problem that an existing radio frequency front end structure is large in power consumption is solved. And the effects of reducing the power consumption of the radio frequency front-end structure and realizing the low-power-consumption application of the wireless sensor network are achieved.

The invention provides an easy-to-bend flexible transmission line. The easy-to-bend flexible transmission line comprises metal grounds, a signal layer and a dielectric layer, wherein the plurality ofmetal grounds form a multilayer structure of the transmission line, the dielectric layer fills the space among the plurality of metal grounds, and the signal layer is embedded into the dielectric layer. The top metal ground located on the top surface of the dielectric layer and the bottom metal ground located on the bottom surface of the dielectric layer are provided with buffer holes in the bending area. According to the transmission line provided by the invention, windowing copper reduction design is carried out in the bending area, on the premise of ensuring the radio frequency performanceof the flexible transmission line, the flexible transmission line can complete required bending processing, and copper reduction is carried out in the bending area, so that the process difficulty canalso be reduced. The problems that a traditional flexible transmission line is large in resilience force and bending difficulty and inconvenient to bend are solved.

The invention discloses an electronic device, and relates to the communication accessory technology. The electronic device can prevent the radio frequency performance of an antenna from being influenced. The electronic device comprises a shell and the electronic device antenna used for communication with the outside. The shell comprises a first area corresponding to the electronic device antenna and a second area besides the first area, wherein the first area is a metal shell. The electronic device antenna is arranged in the first area of the shell and coupled with the metal shell of the first area. The metal shell of the first area and the electronic device antenna form an integral radio frequency structure piece. The electronic device is mainly applied to the field of communication.