8results about How to "Avoid electrostatic damage" patented technology

The utility model discloses a DTU test clamp, and belongs to the technical field of wireless communication equipment detection. The DTU test fixture comprises a base, a plurality of test units are arranged on the base, the test units are uniformly distributed along the length direction of the base, and each test unit comprises an antenna adapter, a fixing groove for fixing a DTU, a probe needle cylinder and a push-pull clamp which are sequentially arranged along the width direction of the base; a sliding block is arranged at the bottom of the probe needle cylinder, sliding guide rails are oppositely arranged on the base, and the sliding block is in sliding connection with the sliding guide rails; a fixing support is arranged at the bottom of the push-pull clamp, and the telescopic end of the push-pull clamp is connected with the side wall of the probe needle cylinder. Stable connection of the DTU equipment and the related test parts can be achieved, and the problem that existing test equipment cannot effectively fix the DTU equipment and the related test parts is solved.

The embodiment of the present application discloses a method for inhibiting integrated circuit from static damage, comprising: providing a first chip, and arranging an integrated circuit on the first chip; providing a second chip, and arranging an electrostatic protection circuit on the second chip, the electrostatic protection circuit comprising: a first output port, a second output port and a first resistor; wherein, when an electrostatic pulse flows through the first resistor, the resistance of the first resistor increases; connecting the first output port with an output port of the integrated circuit, so that the electrostatic protection circuit can inhibit the integrated circuit from static damage. Moreover, the electrostatic protection circuit is arranged on the second chip, and the integrated circuit is arranged on the first chip, so that the integrated circuit and the electrostatic protection circuit are arranged on different chips, avoiding the problem that the integrated circuit cannot be designed for electrostatic protection due to the limitation of the base material of the chip on which the integrated circuit is arranged, and realizing the electrostatic protection of the integrated circuit of new material.

The utility model relates to the field of optoelectronic packaging test technology, concretely relates to a kind of low-cost TO package high-power semiconductor laser aging tool, including cabinet, air cooling water temperature control component and semiconductor refrigerator temperature control component;Air cooling water temperature control component includes multiple numerical control adjustable constant-current constant-voltage direct current module, double-refrigerator water-cooled head, heat insulation TEC water-cooled head compression plate and polyurethane foam heat shield;Semiconductor refrigerator temperature control component includes semiconductor refrigerator, TEC hot surface aluminum profile heat sink and TEC temperature control fan;The device structure adopts "air cooling water temperature control+semiconductor refrigerator temperature control" combined water-cooled heat dissipation system, and structure simplification, small volume, low energy consumption;In addition, the device solves the modular design problem of multiple digital display constant-current constant-voltage driver, and the design problem of low-cost, temperature control, multi-point positioning manual optical power test module in aging test, improves the efficiency of aging work.

The utility model provides an anti-static packaging box for an integrated circuit. The anti-static packaging box comprises a box body, a partition assembly and a sealing cover plate. The box body comprises a side plate and a bottom plate, the side plate is in a square frame shape, the bottom plate is fixedly connected to the bottom side of the side plate, the side plate comprises a polyvinyl chloride plate, a first tin foil piece and a first wear-resistant coating layer, the polyvinyl chloride plate is fixedly connected with the bottom plate, the first tin foil piece is fixedly connected to the inner side of the polyvinyl chloride plate, and the first wear-resistant coating layer is fixedly connected to the bottom plate. The first wear-resistant coating layer is arranged on the inner side of the first tin foil sheet; the separation assembly is fixedly connected to the inner side of the side plate, and the separation assembly is perpendicular to the bottom plate; according to the utility model, the interior of the box body is divided into a plurality of parts through the separation assemblies, the box body and the separation assemblies are both provided with the tin foil sheets, and the tin foil sheets block static electricity, so that external static electricity can be prevented from being introduced and accumulated on the integrated circuits, and static electricity damage caused by friction between the internal integrated circuits can be avoided; and the electrostatic protection effect is further improved.

The utility model discloses a light emitting diode. The light emitting diode comprises a substrate; the epitaxial layer comprises a first semiconductor layer, a light-emitting layer and a second semiconductor layer which are sequentially formed on one surface of the substrate; the edge of the epitaxial layer is provided with a step structure exposing the first semiconductor layer; a transparent conductive layer on a surface of the second semiconductor layer; the transparent conductive layer is provided with a plurality of through holes exposing the second semiconductor layer; a metal layer on the surface of the transparent conductive layer, at least for ohmic contact with the second semiconductor layer and for current expansion; the metal layer covers the side walls and the bottoms of the plurality of through holes and is electrically connected with the second semiconductor layer in the plurality of through holes; the metal layer exposes the edge part of the transparent conductive layer; the electrode layer comprises a first electrode and a second electrode; the first electrode is located at the bottom of the step structure and electrically connected with the first semiconductor layer; the second electrode is located on the surface of the metal layer and electrically connected with the metal layer. The light-emitting diode provided by the utility model has the advantages of low working voltage and high ESD (Electro-Static Discharge) performance.

This utility model discloses a robotic arm for handling vacuum gauge sensing components, comprising: a base plate with a control board and an operator; a first servo motor with a rotating disk on its upper part; a first rocker arm hinged to the rotating disk, with a second servo motor mounted on the first rocker arm; a second rocker arm hinged to the first rocker arm, with a third servo motor mounted at the hinge point; and a gripper located at the end of the second rocker arm. The base plate, first rocker arm, second rocker arm, and gripper are all made of non-metallic materials. The gripper includes a support plate, a toothed swing arm, a clamping arm, and a connecting arm. The toothed swing arms are rotatably mounted on the support plate, and the two toothed swing arms mesh with each other. One of the toothed swing arms is connected to a fourth servo motor. One end of the connecting arm is hinged to the support plate, and the other end of the connecting arm is hinged to the clamping arm. The toothed swing arm and the clamping arm are also hinged. The use of non-metallic materials provides excellent insulation and anti-static properties, effectively preventing electrostatic damage and improving operational safety when handling electrostatically sensitive components.

The utility model relates to the technical field of chip carriers, in particular to a storage chip carrier which comprises a placing disc, a plurality of placing cavities are formed in the middle of the upper end of the placing disc, a plurality of protective cover plates are movably connected to the upper end of the placing disc, and the positions of the protective cover plates correspond to the positions of the placing cavities. Bases are fixedly connected to the four corners of the upper end of the placing disc, supporting insertion rods are fixedly connected to the four corners of the lower end of the placing disc, the positions of the four supporting insertion rods correspond to the positions of the four bases, notches are formed in the upper portions of the rear groove walls of the multiple placing cavities, and holes are formed in the left groove walls and the right groove walls of the multiple notches. A plurality of square grooves which are through up and down are formed in the lower groove walls of the plurality of placing cavities, and anti-static pads are fixedly connected to the inner walls of the plurality of placing cavities. According to the storage chip carrier, the protection effect on the chip is improved, the chip is prevented from being damaged by pressure, and the chip can be prevented from being affected with damp and making contact with static electricity.