Holding table
A workbench and workpiece technology, applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as unusable, device quality degradation, device damage, etc., to reduce charge, suppress static electricity, and suppress electrostatic damage Effect
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[0027] Next, an embodiment of the present invention will be described.
[0028] [1] Cleaning device
[0029] figure 1 The cleaning device 10 to which the holding table 30A of one embodiment is applied is shown. This cleaning device 10 is preferable as a device for cleaning a thin-plate-shaped workpiece subjected to predetermined processing with a processing device not shown. figure 2 The number 1 of the indicates the artifact here. The workpiece 1 is a disc-shaped semiconductor wafer on the surface of which a large number of rectangular-shaped devices 2 having electronic circuits are formed.
[0030] Examples of processing devices for the workpiece 1 include cutting (scribing) (including cutting with a cutting tool or cutting by laser irradiation), drilling with a laser, grinding, lapping, expanding ( エキスビンド: expand) A processing device such as split processing. The cleaning device 10 of the present embodiment is attached to the processing device described above, or is se...
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