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Antistatic heat-conducting organosilicon adhesive

An organic silica gel and antistatic technology, applied in the field of materials, can solve problems such as poor thermal conductivity, achieve the effect of improving thermal conductivity, wide industrial application prospects, and good antistatic properties

Active Publication Date: 2017-01-04
上海颐行高分子材料有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Specifically, first of all, to solve the problem of poor thermal conductivity of a single particle, use different particle sizes, shapes, and types of thermal conductive materials to mix and fill them, so that they can achieve a higher degree of packing in the silica gel and improve thermal conductivity.

Method used

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  • Antistatic heat-conducting organosilicon adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Add 100 parts of α, ω-dihydroxy polydimethylsiloxane (mass ratio: 1:1) with viscosities of 5000mPa·s and 20000mPa·s into the planetary mixer, 50 parts of nano-calcium carbonate, particle size of 40μm 600 parts of spherical alumina, after vacuuming and removing water at room temperature for 20 minutes, add 2.5 parts of cross-linking agent methyl tributylketoximosilane, 12.5 parts of vinyl tributylketoximosilane, continue to vacuumize and remove water and stir for 10 minutes Then add 3.5 parts of the adhesion promoter N-(β-aminoethyl)-γ-aminopropylmethyldimethoxysilane and 1 part of the catalyst dibutyltin dilaurate, and continue to stir for 10 minutes to obtain a single-component thermal conductivity Silicone adhesive.

Embodiment 2

[0035] The difference from Example 1 is that the thermally conductive filler is made by mixing 40 μm spherical alumina and 10 μm quasi-spherical alumina at a mass ratio of 4:1.

Embodiment 3

[0037] The difference from Example 1 is that the thermally conductive filler is made by mixing 40 μm spherical alumina, 10 μm spherical alumina, and 2 μm quasi-spherical alumina at a mass ratio of 2:2:1.

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Abstract

The invention discloses an antistatic heat-conducting organosilicon adhesive which exists in a single-component form. The adhesive is composed of organopolysiloxane with hydrolyzable groups at two ends, heat-conducting filler, crosslinking agent, catalyst and other additives, and the heat-conducting filler contains graphene with the surface treated, so that after a small amount of the heat-conducting filler is added, heat conductivity of the adhesive is increased substantially, and the adhesive has antistatic performance. After being added with a large amount of the filler, the single-component antistatic heat-conducting organosilicon adhesive still has high operability and thixotropic performance, can be used for adhesion of materials different in thermal expansivity, can prevent electronic devices from being damaged by static electricity due to antistatic performance and has wide industrial application prospect.

Description

technical field [0001] The invention belongs to the field of materials, and in particular relates to an antistatic and thermally conductive silicone adhesive. Background technique [0002] There are usually some gaps between the electronic components and the heat sink, and these gaps prevent the heat of the electronic components from being dissipated in a timely and effective manner, resulting in failures. Thermal pads can effectively fill these gaps and improve heat dissipation efficiency. Therefore, thermal pads are key components for heat dissipation of electronic components. At present, most thermal pads are made of silica gel as the main material, and thermal conductive particles are added to it. However, a single particle has the problem of poor thermal conductivity. [0003] In addition, the silicone gasket has the disadvantage of being easy to absorb dust. The existence of dust will not only affect the service life of electronic components, but also affect its heat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/06C09J9/02C09J11/04
CPCC08K3/04C08K3/22C08K3/26C08K7/00C08K7/18C08K7/24C08K9/06C08K13/04C08K13/06C08K2003/2227C08K2003/265C08K2201/011C08K2201/017C09J9/02C09J11/04C09J183/06
Inventor 李卫东赵志国张逸瑾白永平李夏倩殷晓芬
Owner 上海颐行高分子材料有限公司
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