Three-dimensional tile type microwave assembly

A microwave component and tile-type technology, which is applied in the microwave field, can solve the problems of poor reliability and difficulty in assembling three-dimensional tile-type microwave components, and achieve reliable performance and simple assembly

Inactive Publication Date: 2019-06-21
SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] In order to solve the problems of difficult assembly and poor reliability of existing three-dimensional tile-type microwave components, the present invention

Method used

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  • Three-dimensional tile type microwave assembly
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  • Three-dimensional tile type microwave assembly

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Embodiment Construction

[0023] All features disclosed in this specification, or steps in all methods or processes disclosed, may be combined in any manner, except for mutually exclusive features and / or steps.

[0024] Any feature disclosed in this specification, unless specifically stated, can be replaced by other alternative features that are equivalent or have similar purposes. That is, unless expressly stated otherwise, each feature is one example only of a series of equivalent or similar features.

[0025] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relative relationship between the components in a certain posture (as shown in the accompanying drawings). If the positional relationship, movement conditions, etc. change, the directional indicator will also change accordingly.

[0026] In addition, the technical solutions of the various embodiments of the present inventio...

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Abstract

The invention discloses a three-dimensional tile type microwave assembly which comprises a metal structural part, a radio frequency insulator, a feed insulator, a circuit piece and a micro-rectangularelectric connector, wherein the metal structural part plays a role in fixedly supporting the microwave assembly, the radio frequency insulator, the feed insulator, the circuit piece and the micro-rectangular electric connector; the radio frequency insulator and the circuit piece realize high-performance and high-reliability transmission of microwave signals in the vertical direction; the micro-rectangular electric connector, the feed insulator and the circuit piece realize transmission from the vertical direction to the horizontal direction of a power supply and control signals. The three-dimensional tile type microwave assembly depends on the traditional micro-assembly process, and realizes the vertical transmission of microwave and power control signals based on the radio frequency insulator and the micro-rectangular electric connector. Compared with the prior art, except for the vertical transition structure of the upper and lower end surface radio frequency insulators and the micro-rectangular electric connector, other circuits in the microwave assembly can be realized in single-side horizontal transmission, and the three-dimensional tile type microwave assembly is simple to assemble and reliable in performance.

Description

technical field [0001] The invention relates to the field of microwave technology, in particular to a three-dimensional tile-type microwave component. Background technique [0002] With the continuous improvement of the integration density of electronic equipment in the fields of radar, communication and electronic warfare, their requirements for microwave components, especially volume and weight, are getting higher and higher. Microwave components are gradually developing from traditional two-dimensional plane integration to three-dimensional integration. The tile-type microwave components developed on the basis of three-dimensional high-density integration technology have incomparable advantages in reducing volume and weight. The key difficulty in the integrated design of 3D tiled microwave components is to reliably realize the high-performance transmission of microwave signals and power control signals in the vertical direction based on the existing micro-assembly process...

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Application Information

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IPC IPC(8): H01P1/00
Inventor 余雷姚瑞林王超杰吴昌勇杜立新揭海周丽
Owner SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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