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Radio frequency front end with high stability

An RF front-end, high-stability technology, applied in the field of RF front-end with high stability, to achieve the effect of easy size control, large heat dissipation and grounding area, and good performance

Active Publication Date: 2021-03-02
CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the grounding and heat dissipation of the chip still need to be improved

Method used

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  • Radio frequency front end with high stability
  • Radio frequency front end with high stability
  • Radio frequency front end with high stability

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Embodiment Construction

[0029] The embodiments of the present invention are described in detail below. This embodiment is implemented on the premise of the technical solution of the present invention, and detailed implementation methods and specific operating procedures are provided, but the protection scope of the present invention is not limited to the following implementation example.

[0030] Such as figure 1 As shown, this embodiment takes a high-stability radio frequency front-end applied to a millimeter wave as an example, and is applicable to a wireless communication system in this band. This embodiment consists of four components, including a multilayer circuit board 1 , a chip 2 , a vertical transition structure 3 , and a dielectric frame 4 .

[0031] Such as figure 2 As shown, the multilayer circuit board 1 is made of PCB board material, which is a rectangular board. There is a reserved chip mounting groove 5 on the multilayer circuit board 1, which is slightly larger than the size of t...

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Abstract

The invention discloses a radio frequency front end with high stability, and belongs to the technical field of radio frequency front ends. The radio frequency front end comprises a multi-layer circuitboard, chips, a vertical transition structure and a dielectric enclosure frame, and realizes the high-stability work of the radio frequency front end under high-frequency and high-integration requirements. The multi-layer circuit board is a multi-layer dielectric plate comprising a radio frequency transmission line layer, a control line layer, a power supply network layer and an isolation groundlayer, and is connected with the chips through solder balls and a heat dissipation substrate to realize electrical and thermal transmission. The chips are a power amplifier, an LNA, a radio frequencyswitch, an amplitude-phase control chip, a power divider chip and the like. The vertical transition structure is a vertical metal connecting hole connected with a strip-shaped transmission line, the dielectric material of the dielectric enclosure frame is the same as that of the multi-layer circuit board, vertical metal grounding holes are formed in the periphery of the dielectric enclosure frame,and the dielectric enclosure frame is prepared on the periphery of a chip cavity to form an isolation boundary with a certain height. According to the invention, the performance and the working stability of the radio frequency front-end module and the application system are effectively improved.

Description

technical field [0001] The invention relates to the technical field of radio frequency front ends, in particular to a radio frequency front end with high stability. Background technique [0002] The RF front-end is an important part of the wireless communication or radar system. It integrates all the functional circuits of the front-end into a whole, including the RF amplifier circuit, amplitude and phase control circuit, switching circuit and power distribution network. When developing an application system, the RF front-end is responsible for signal transmission and reception as well as amplitude and phase control. It is the core module for communication or radar systems to realize functions. Therefore, the performance of the RF front-end has a crucial impact on the performance of the application system. [0003] With the development of technology, the performance requirements of communication, radar and other systems are constantly improving, and the demand for miniaturiz...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H04B1/38
CPCH05K1/0218H05K1/0203H04B1/38
Inventor 窦丙飞段宗明刘莹吕伟戴跃飞
Owner CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST
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