USB connecting wire in use under high and low temperature, and acid or alkali environment, and fabricating technique

A connection line, high and low temperature technology, applied in the field of data transmission lines, can solve the problems of low service life, high failure rate, and inability to resist internal electromagnetic interference, etc., and achieve high tensile strength, high transmission speed, and round shape.

Inactive Publication Date: 2007-05-09
李明斌
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, two of the power lines will also generate internal electromagnetic interference. Obviously, such a structure cannot solve the problem of anti-internal electromagnetic interference
[0004] Computer USB cables used for microcomputer equipment in chemical, metallurgical, aviation, shipbuilding and other enterprises are mostly harsh due to high temperature from 100°C to 200°C or low temperature from -40°C to -100°C, as well as oil pollution or acid and alkali. , resulting in high failure rate and low service life

Method used

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  • USB connecting wire in use under high and low temperature, and acid or alkali environment, and fabricating technique
  • USB connecting wire in use under high and low temperature, and acid or alkali environment, and fabricating technique
  • USB connecting wire in use under high and low temperature, and acid or alkali environment, and fabricating technique

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Embodiment Construction

[0029] As shown in Figure 3 and Figure 4, the conductors 21 and 11 of the power line 2 and the data signal line 1 and the ground wire 4 are all copper wires with a nominal diameter of 0.37 mm and made of seven wires with a nominal diameter of 0.12 mm and each twisted equally. Core; of course, the nominal diameter of each copper core can be less than 0.12mm, and the corresponding nominal diameter after stranding is also less than 0.37mm. The insulation material of the power line 2 and the data signal line 1 is FEP (perfluoroethylene). The data signal line 1 and the ground line 4 are arranged in parallel, and are wrapped with an inner single-sided aluminum foil layer 5 . After two power lines 2 and two glass fiber fillers 3 are twisted with the structure wrapped in the inner single-sided aluminum foil layer 5, the single-sided aluminum foil layer 6 is wrapped around it, and the side with the aluminum coating faces outward. Then wrap the tin-plated copper braid 7, and finally ex...

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Abstract

Technical scheme is as following: single sided aluminum foil layer wraps on two pieces of power line and two pieces of data signal line of the USB connection wire; metallic braid layer wraps the said aluminum foil layer; and plastic outer covering layer wraps the metallic braid layer; two pieces of data signal line, and ground wire setup in parallel are wrapped inside single sided aluminum foil layer; two pieces of fiber glass packing is in same layer of the two pieces of power line outside the single sided aluminum foil layer. The fore mentioned structures are inter twisted each other. Material of insulating layer for power lines and data signal lines is FEP. Material of plastic outer covering layer is fire resistant. Fabricating steps: inner wrapping; inter twisting; outer wrapping; weaving metal layer; sending out. Features are: high transmission rate and anti-electromagnetic interference, useable to high/low temperature, and acid/alkali condition.

Description

technical field [0001] The present invention relates to a data transmission line for the interconnection or transmission of information or other signals between memory, input / output devices or central processing units and its production process, especially to a USB connection that can be used in high and low temperature and acid-base environments Wire and its manufacturing process. Background technique [0002] The USB standard has undergone an upgrade from USB1.0 to USB1.1 to USB2.0, and the transmission speed has also increased to 480Mbps, which reflects that people's desire to continuously obtain higher transmission speeds is endless. Micro USB is the latest achievement of the transmission speed up to 5Gbps under this background. [0003] As shown in FIG. 1 and FIG. 2 , it is a schematic diagram of a three-dimensional structure of an existing USB connection cable. It includes two power lines and data signal lines 04 parallel to each other, which are covered with a singl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B11/00H01B11/06H01B7/17H01B3/30H01B13/00
Inventor 李明斌
Owner 李明斌
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