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A RF front-end with high stability

An RF front-end, high-stability technology, applied in the field of RF front-end with high stability, to achieve good performance, large heat dissipation and grounding area, and avoid electromagnetic leakage

Active Publication Date: 2022-03-18
CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the grounding and heat dissipation of the chip still need to be improved

Method used

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  • A RF front-end with high stability
  • A RF front-end with high stability
  • A RF front-end with high stability

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Embodiment Construction

[0029] The embodiments of the present invention are described in detail below. This embodiment is implemented on the premise of the technical solution of the present invention, and detailed implementation methods and specific operating procedures are provided, but the protection scope of the present invention is not limited to the following implementation example.

[0030] Such as figure 1 As shown, this embodiment takes a high-stability radio frequency front-end applied to a millimeter wave as an example, and is applicable to a wireless communication system in this band. This embodiment consists of four components, including a multilayer circuit board 1 , a chip 2 , a vertical transition structure 3 , and a dielectric frame 4 .

[0031] Such as figure 2 As shown, the multilayer circuit board 1 is made of PCB board material, which is a rectangular board. There is a reserved chip mounting groove 5 on the multilayer circuit board 1, which is slightly larger than the size of t...

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Abstract

The invention discloses a radio frequency front end with high stability, which belongs to the field of radio frequency front end technology, and includes a multilayer circuit board, a chip, a vertical transition structure, and a dielectric frame, and realizes the high stability of the radio frequency front end under high frequency and high integration requirements Work. The multi-layer circuit board is a multi-layer dielectric board containing a radio frequency transmission line layer, a control line layer, a power network layer and an isolation ground layer, and is interconnected with the chip through solder balls and a heat dissipation substrate to realize electrical and heat transmission; the chip is a power Amplifiers, LNAs, RF switches, amplitude and phase control chips, power divider chips, etc.; the vertical transition structure is a vertical metal connection hole connected to the strip transmission line, the dielectric frame is the same as the dielectric material of the multilayer circuit board, and there are vertical metal holes around it. The ground hole is prepared on the periphery of the chip cavity to form a certain height of isolation boundary. The invention effectively improves the performance and working stability of the radio frequency front-end module and the application system.

Description

technical field [0001] The invention relates to the technical field of radio frequency front ends, in particular to a radio frequency front end with high stability. Background technique [0002] The RF front-end is an important part of the wireless communication or radar system. It integrates all the functional circuits of the front-end into a whole, including the RF amplifier circuit, amplitude and phase control circuit, switching circuit and power distribution network. When developing an application system, the RF front-end is responsible for signal transmission and reception as well as amplitude and phase control. It is the core module for communication or radar systems to realize functions. Therefore, the performance of the RF front-end has a crucial impact on the performance of the application system. [0003] With the development of technology, the performance requirements of communication, radar and other systems are constantly improving, and the demand for miniaturiz...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H04B1/38
CPCH05K1/0218H05K1/0203H04B1/38
Inventor 窦丙飞段宗明刘莹吕伟戴跃飞
Owner CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST
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