The application discloses a high-density multi-channel Ku-band
radio frequency channel integrated micro module, and belongs to the technical field of
radio frequency micro systems. The micro module adopts a three-dimensional stacking architecture, and comprises a four-channel transceiving front end IP, a transceiving
frequency conversion IP, a
local oscillator source IP and a high-density integrated PCB substrate, and the three IPs are
silicon-based packages; a received input
signal enters the four-channel transceiving front end IP, is subjected to amplitude and
phase control, is transmitted to the transceiving
frequency conversion IP through the high-density integrated PCB substrate, is subjected to
radio frequency frequency gating filtering, is mixed and frequency-converted to an
intermediate frequency output. A transmitted input
signal enters the transceiving
frequency conversion IP, is subjected to
frequency mixing and up-conversion, is subjected to radio frequency frequency gating filtering, is transmitted to the four-channel transceiving front end IP through the high-density integrated PCB substrate, is subjected to amplitude and
phase control, and is amplified and output through a power
amplifier chip. The application adopts a
chip preset grounding ring, a
silicon substrate independent cavity and an IP shielding cavity, and solves the complex
electromagnetic compatibility problem during communication.