Packaging structure for three-dimensional integration of radio frequency system and design method thereof

Abstract

The invention discloses a packaging structure for three-dimensional integration of a radio frequency system and a design method thereof. The structure comprises a silicon-based adapter plate and at least two supporting interconnection adapter plates which are alternately and longitudinally stacked from bottom to top, wherein a cavity is formed between the at least two supporting interconnection adapter plates; each of the silicon-based adapter plate and the supporting interconnection adapter plates comprises a silicon substrate, a through silicon via (TSV), micro bumps and an RDL wiring layer.The TSV penetrates the silicon substrate; the RDL wiring layers are arranged on the upper surface and the lower surface of the silicon substrate; the micro bumps are arranged on the two RDL wiring layers; the TSV, the RDL wiring layers, and the micro bumps are connected with one another. The structure has the effects of vertical interconnection and structural support, three-dimensional vertical stacking of radio frequency chips can be achieved, and the problem of electromagnetic compatibility during three-dimensional stacking of the radio frequency chips can be solved through flexible design.

Description

technical field [0001] The invention belongs to the technical field of radio frequency system packaging, and in particular relates to a packaging structure for three-dimensional integration of radio frequency systems and a design method thereof. Background technique [0002] In the complex electromagnetic environment of the battlefield, how to better play the role of electronic information equipment and achieve good combat effectiveness has become more difficult, which puts forward higher requirements for the intelligence, miniaturization and light weight of electronic information equipment, and also This puts forward higher requirements for RF system integration. [0003] The common existing RF system integration methods include three-dimensional integration, that is, multiple chips are placed side by side on the substrate, connected by wire bonding, etc., and then packaged in the package; and 2.5D integration that further reduces the volume: multiple Chips are placed side...

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Problems solved by technology

[0004] In view of the above-mentioned shortcomings in the prior art, the packaging structure and design method for three-dimensional integration of radio frequency systems provided by the present invention solve the problem of wirelessly realizing three-dimensional integration of heterogeneous chips in traditional radio frequency systems

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