124results about How to "Achieve electromagnetic shielding" patented technology

The invention discloses a modularized power cabinet which comprises a control box, an auxiliary circuit, a reactor, a phase module, a cabinet body, a low-inductance busbar A, a busbar, a low-inductance busbar B, a support capacitor, a water outlet pipeline and a water inlet pipeline, wherein the cabinet body is divided into a high-voltage region and a low-voltage region, the low-voltage region and the high-voltage region are isolated by a metal plate, the high-voltage region comprises the phase module, the reactor and the support capacitor, the phase module and the reactor are distributed in the cabinet body from top to bottom, the low-voltage region comprises the control box and the auxiliary circuit, the control box of the low-voltage region is connected with a power device of the phasemodule of the high-voltage region through an optical fiber, the auxiliary circuit can realize connection of all the parts by wiring in the cabinet body, and a water cooling pipeline comprising a water outlet pipe and a water inlet pipe is distributed at the upper end and the lower end of the cabinet body. The power cabinet described by the implementation way is strong in universality and high in degree of integration, and can realize rectification and the inversion function, simultaneously effectively integrates a power unit and a control unit, solves the problems that the power cabinet is bulky so as to be unfavorable for transportation and installation, and is more convenient and reliable for wiring and debugging.

The invention relates to test system and method, which can be used for testing a unit to be tested with signal pins at two surfaces. The test system comprises a testing platform and a picking and placing device, wherein the testing platform comprises an electromagnetic shielding cavity and a testing environment module, the electromagnetic shielding cavity is provided with an opening, the testing environment module is arranged in the electromagnetic shielding cavity; the picking and placing device is movably arranged above the testing platform and comprises an electromagnetic shielding upper cover and a signal conducting structure, when the picking and placing structure places the unit to be tested on the testing environment module, the electromagnetic shielding upper cover is matched with the electromagnetic shielding cavity of the testing platform to form an electromagnetic shielding space for isolating the unit to be tested; meanwhile, the signal pins positioned on the upper surface of the unit to be tested can be electrically connected with the testing environment module through the signal conducting structure.

A surface acoustic wave device which hardly causes short- circuit between mounting electrodes in mounting of an elastic surface wave element, even devised to be miniaturized, and facilitates checking the formation of fillets of a conductive bond in mounting, thus reducing the cost, with the element being mounted on a board and sealed with a resin-sealing layer. The surface acoustic wave device 1 has a surface acoustic wave element 3, which is mounted on a multilayer board 2 by the face down method using bumps 19a, 19b and sealed with a resin-sealing layer 4. Electrode lands 16, 17 on the upper side 2a of the multilayer board 2 connected to the bumps 19a, 19b are connected to inner electrodes 22, 23 via electrodes 20a, 20b, and the inner electrodes 22, 23 are electrically connected to mounting electrodes 24, 25 on the lower side of the board 2 and to end-face wiring electrodes 26, 27.

The invention discloses a shielding keyboard used in a shield with an opening. The shielding keyboard comprises: a basal board, which is provided with a circuit board with elastic keycaps; keys, which are arranged corresponding to the elastic keycaps; a shielding board used for sealing the opening of the shield; and a fixing device for fixing the basal board on the shielding board. The shielding board is provided with a wave guide which is internally provided with an insulation rod, one end of which is connected with the keys and the other end of which is contacted with the elastic keycaps. The shielding board is also provided with a guide board, which is provided with a guide hole containing the wave guide. The keys are provided with a guide part matched with the guide hole in shape. The shielding board and the basal board of the shielding keyboard of the invention do not form a shielding case but seal the opening of the shield so that electromagnetic waves generated by electronic elements of the keyboard in the shield are shielded by the shield. Therefore, electromagnetic shielding is realized very easily; in addition, the structure of the shielding keyboard is simple.

The invention provides a nanometer enhanced paper plastic material and a preparation method thereof. Well mixing, granulation, extrusion moulding and other steps are carried out for waste paper powder, high density polyethylene, a filling material, an anti-oxidant, a coupling agent, a lubricant and nanometer cellulose and other materials; and the nanometer enhanced paper plastic material which can be applied to the fields of outdoor floors, plank roads, corridors, packages and the like is obtained. Granular materials which have good dispersibility and are suitable for continuous industrial production are prepared by using reclaimed waste paper materials, nanometer cellulose is added, so that the material has higher mechanical properties, and application fields of paper plastic composite materials are enlarged; nanometer cellulose with modified functions is added for realization of electromagnetic shielding, antibiosis or luminescence and other additional effects; added values of paper plastic composite materials are increased, and at the same time, the material has important meanings for reducing environmental pollution.

The invention discloses active antenna units and antenna unit for a base station. An active antenna unit for the base station comprises a shell, a power amplifier board and a filter assembly. A storage cavity of which one end is opened is defined by the shell. The power amplifier board is set in the storage cavity. The filter assembly is set in the storage cavity and covers the power amplifier board, thereby carrying out electromagnetic shielding on the power amplifier board. In the mode, the electromagnetic shielding can be carried out on the power amplifier board through utilization of the filter assembly and a shielding case does not need to be set additionally, so a structure of the active antenna unit can be effectively simplified, and an integration level of the active antenna unit is improved.

The invention discloses a system-in-package method and device. The system-in-package method comprises the steps of forming a first electromagnetic shielding layer on a non-functional surface and a side surface adjacent to the non-functional surface of a chip, wherein the first electromagnetic shielding surface is electrically connected with a first grounding pad on a functional surface of the chip; mounting at least one chip on the first surface of a substrate in an inverted manner, wherein the functional surface faces towards the first surface, the first surface is provided with an exposed second grounding pad, the substrate is internally provided with a grounding layer, and the second grounding pad is electrically connected with the grounding layer; and forming a conductive connecting piece on the first surface, wherein one end of the conductive connecting piece is electrically connected with the first electromagnetic shielding layer, and the other end of the conductive connecting piece is electrically connected with the second grounding pad. The manufacturing process for realizing the electromagnetic shielding between chips can be simplified according to the method.

The invention relates to a radio frequency multi-chip circuit electromagnetic shielding structure, and the structure comprises a substrate (1) and a substrate (2), which are connected. A substrate electromagnetic interference shielding layer (3) is attached to the lower surface of the substrate (2). The substrate (1), the substrate (2) and the substrate electromagnetic interference shielding layer (3) form a bottom first circuit assembly electromagnetic shielding structure. The housing (4) is disposed on the substrate (1), and a housing electromagnetic interference shielding layer (5) is attached to the internal surface of the housing (4). The substrate (2) is disposed in the housing (4). The substrate (2), the housing (4) and the housing electromagnetic interference shielding layer (5) form an upper second circuit assembly electromagnetic shielding structure. Therefore, the structure provided by the invention can achieve the internal and external electromagnetic shielding of a multi-chip high-density package at the same time.

A manufacturing method of a package substrate comprises: fabricating a hollowed-out elongated slot on the periphery of each package substrate unit on a substrate; metallizing the sidewalls of the hollowed-out elongated slot; etching off a copper foil layer at the central area of each package substrate unit; and fabricating, at the central area where the copper foil layer is etched off, a hollowed-out square groove for securing an electronic element. Further provided are a corresponding package substrate unit and a substrate assembly. In the technical solution of the present invention, sidewalls on the periphery of the package substrate unit are metallized to form a metal shielding layer, which easily and reliably implements electromagnetic shielding on the electronic element without the need of adding a shielding hood; in this way, the thickness of the package substrate is not increased, the universality of the product is not reduced, and the structure is reliable, thereby reducing the ineffectiveness risk; moreover, the cost is low.

The invention belongs to the related technical field of energy conservation and emission reduction of engines, and discloses an experimental device for fuel combustion and soot generation characteristics under microwave radiation. The experimental device comprises a high-voltage power supply, a signal generator, a magnetron, a tuner, a combustion chamber, an axial flow combustor and a capillary tube, the magnetron is used for generating microwaves, and the tuner is used for adjusting impedance in a circuit; the combustion chamber is a closed metal cavity; the axial flow combustor is used for generating axial flame in the combustion chamber; the capillary tube is arranged in the flame, small holes are formed in the capillary tube, substances in the flame at the position of the capillary tube are sucked into the small holes under the action of negative pressure and then enter a gas analyzer, components of the substances in the flame are obtained under the analysis of the analyzer, the position of the capillary tube in the flame is adjusted, the analysis of combustion products at different positions is achieved, and the comprehensive detection of the combustion products is achieved. By means of the device, the detection of the intermediate product in the combustion process is achieved, and the device is easy to operate, capable of saving energy, environmentally friendly, safe andreliable.

The invention discloses an electromagnetic shielding telescopic structure and an installation method thereof. The structure includes two vertical columns installed on two sides of an expansion joint on a fixed base. A lower shielding plate, a middle shielding plate and an upper shielding plate which are made of elastic materials and have the function of electromagnetic shielding are orderly installed between the two vertical columns, the lower shielding plate is installed on the expansion joint of the fixed base and is fixedly connected to the middle shielding plate through a front shielding pressing strip and is fixedly connected to the solid base through a back shielding pressing strip, and the middle shielding plate and the upper shielding plate are connected by rivets to form a telescopic shielding unit. According to the electromagnetic shielding telescopic structure, the horizontal cross-section shapes of the lower shielding plate, the middle shielding plate and the upper shielding plate are stretched Pi shapes, the shielding plates can be installed adaptively according to the sizes of different expansion joints during installation, and the versatility is high. According to different requirements, holes can be made in the middle shielding plate and the upper shielding plate to reduce a structural weight and air resistance.

The invention provides a curved surface FSS radar cover preparation method based on a metal mask plate and a thermal spraying technology. The preparation method comprises a FSS curved surface mask plate; the mask plate comprises a hollow structure matched with a radar cover surface FSS layer in design shape; the inner wall of the mask plate and the surface of a radar cover are the same in shape; when a curved surface FSS radar cover is prepared, the FSS curved surface mask plate covers the surface of the radar cover to form a combination body; the surface of the combination body is sprayed bythermal spraying equipment; and a FSS layer containing a metal material and with an accordant shape is formed on the surface of the radar cover at the hollow part of the mask plate. The method can quickly prepare the FSS layer on the surface of the complicated curved surface radar cover.

The invention provides a case with a safety lock. The case comprises a case and a top cover which is closed on the upper part of the case. At least two open pins are arrange at that side of the case;the opening pin extends in the direction of the axial top cover closure; the top cover is provided with the same number of safety locking fasteners as the opening pin shaft; the setting position of the safety lock is matched with the setting position of the opening pin shaft of the case; the safety locks cooperate with the opening pin shaft to detachably connect the case to the top cover. The safety lock is installed on the top of the case and can be used with the opening pin inside the case to realize the function of assisting opening. The opening structure has no screws, so that the problemsare solved that the screw is liable to cause mesh failing after being dismantled for many time, or the screws cannot be closely matched with the screw holes, thus leading to loose closure of the boxbody and the cover of the box, and affecting shielding electromagnetic radiation. The safety lock is helpful to open and close the function, can realize the electromagnetic shielding, the operation issimple, is suitable for has the electromagnetic compatibility request in the case.

The invention relates to a wireless power distribution system applied between joints of a reconfigurable space mechanical arm. The system comprises wireless energy receiving ends and wireless energy transmitting ends which are disposed in joints of the reconfigurable space mechanical arm and are connected to each other, a first joint is only provided with a wireless energy transmitting end, and alast joint is only provided with a wireless energy receiving end. The wireless energy transmitting ends perform high voltage transformation based on the high frequency inverter technology and providehigh frequency energy to the wireless energy receiving ends, the wireless energy receiving ends receives the high frequency energy and performs voltage adjustment by using the rectification technologyto realize the voltage regulation control of the rectification and signal acquisition. The wireless energy transmitting end of a previous joint and a wireless energy receiving end of a next joint intwo adjacent joints perform wireless electric energy transmission through electromagnetic inductive coupling while performing data exchange through wireless communication, therefore, the electric energy transmission and data exchange are performed through a wireless mode between the joints, the access of a plug-in is not needed, the space mechanical arm is easily reconstructed, and the flexibilityof the mechanical arm joints is improved.

The invention discloses a fault data recording method and apparatus based on avionics devices, and relates to the technical field of avionics devices. The method includes the following steps: 1. a control device transmitting a work mode and a power-on time to a processor A through a communication string; 2. the processor A generating a data recording control command based on the work mode and transmitting the power-on time to a logic processor B; 3. the logic processor B starting logic control, processing serial port data and discrete data and saving sample data and transmitting an interruption to the processor A; and 4. the processor A receiving the interruption and reading the sample data through a bus, and saving the sample data to a storage device for recording the data. Current faultdata recording apparatuses often use computer system platforms which are too large in sizes, and often use systems which fail to independently and temporarily establish simple platforms. As a result,data recording is difficult and universality lever is low. The method and the apparatus greatly reduce the size and weight of an apparatus and can real-timely record data.

The invention relates to a full-power grid voltage inverter welding machine. The full-power grid voltage inverter welding machine comprises a structure of the welding machine and multiple control circuits in the machine; the control circuits consist of multiple circuit boards; the composed circuit boards relate to capacitance boards, IGBT inversion boards, IGBT drive boards, switch power supply boards, control boards, voltage conversion or switching boards and output rectifying boards; a novel cooling air channel is adopted and capable of effectively achieving the effects of preventing the dust, improving the cooling effect and improving the work reliability of the welding machine; meanwhile, both maintenance and assembly are convenient; the welding machine can adopt full-power grid voltage, that is, single-phase 220 V and 380 V and three-phase 380 V power supply voltage is used for supplying electricity; and meanwhile, through arrangement of several control circuits, the work reliability of the welding machine is improved, the digital adjustment and display of welding parameters are realized, and the work reliability and performance are greatly improved compared with several welding machines with the same type.

The invention provides a current transformer and a manufacturing method thereof. The current transformer is formed by assembling an upper magnetic core, a multi-layer PCB and a lower magnetic core, wherein the upper magnetic core comprises a magnetic core upper panel, a middle column located in the center of the upper panel and two side columns which are in the same direction as the middle column,are parallel to the middle column, are arranged in a mirroring mode and are flush with an edge of the magnetic core upper panel, the lower magnetic core comprises a magnetic core bottom column, a middle column located in the middle of the magnetic core bottom column and two side columns which are parallel to the middle column in the same direction and are symmetrically arranged, the middle columnof the upper magnetic core and the middle column of the lower magnetic core are equal in sectional area and equal in width and section, and the magnetic core panel of the upper magnetic core and themagnetic core bottom column of the lower magnetic core are equal in thickness. The current transformer is advantaged in that only combination of the magnetic core and the multi-layer PCB is provided,and process difficulty is low.

The present invention provides a packaging structure. The packaging structure comprises a first shielding layer and a second shielding layer which are positioned between a semiconductor chip and a plastic package layer and between a first plastic package layer and a second plastic package layer; the first shielding layer wraps the non-functional surface and the side wall surface of the semiconductor chip and the side surface of the first plastic package layer, the second shielding layer is positioned between the first shielding layer and the plastic package layer and completely covers the non-functional surface and the side wall of the semiconductor chip and the surface of the first shielding layer on the side surface of the first plastic package layer; the second shielding layer can coverplaces with uneven thickness and poor edge coverage in the first shielding layer, so that the whole shielding layer formed by the first shielding layer and the second shielding layer is complete, andthe shielding effect is improved.

The invention relates to a chip stacking packaging body with an electromagnetic shielding function and a preparation method thereof, belongs to the technical field of integrated circuits, and solves the problem of mutual interference of electromagnetic signals caused by reduction of the distance between microwave / millimeter wave chips. The chip stacking packaging body comprises a microwave / millimeter wave bare chip and a packaging structure used for packaging the microwave / millimeter wave bare chip, and the packaging structure comprises a packaging dielectric layer and a packaging metal wiringlayer which are sequentially arranged on the microwave / millimeter wave bare chip. According to the invention, the size is smaller, the integration degree is higher, and the sensitive microwave / millimeter wave bare chip can be protected from interference of other electromagnetic fields.

The embodiment of the invention provides an electromagnetic shielding module structure and a preparation method of the electromagnetic shielding module structure, and relates to the technical field ofchip packaging. According to the electromagnetic shielding module structure and the preparation method, a plurality of shielding devices are mounted between a first chip and a second chip; a plasticpackaging body wraps the first chip and the second chip; the metal shielding layer covers the plastic package body, and the metal column of each shielding device is electrically connected with the metal shielding layer and the module substrate, so electromagnetic shielding is realized; the shielding devices are directly mounted on the module substrate, complex processes such as grooving and filling are avoided, the process steps are simplified, the packaging difficulty is reduced, and the production efficiency is improved; meanwhile, electromagnetic shielding is achieved through the metal columns and the metal shielding layer, and the shielding effect is good.

The present invention provides a forming method of a packaging structure. The forming method of a packaging structure comprises the steps of: after first plastic packaging layers on the functional faces of a plurality of semiconductor chips are bonded to a carrier plate, forming first shielding layers wrapping the non-functional faces and the side wall surfaces of the semiconductor chips; formingsecond shielding layers on the first shielding layers; forming second plastic packaging layers on the second shielding layer and the carrier plate between the semiconductor chips; stripping the carrier plate to form a pre-sealing panel, and exposing the first plastic packaging layers on the back surface of the pre-sealing panel; removing part of the first plastic packaging layers to expose metal bumps; and forming an external contact structure connected with the metal bumps on the back surface of the pre-sealing panel. According to the invention, the second shielding layers are formed on the first shielding layers, and the second shielding layers can cover places with non-uniform thickness and poor edge coverage in the first shielding layers, so that the whole shielding layer formed by thefirst shielding layers and the second shielding layers is complete, and the shielding effect is improved.

The invention discloses a forming method of a packaging structure. The method comprises the steps of: forming a first shielding layer which wraps the non-functional surfaces and side wall surfaces ofa plurality of semiconductor chips after the functional surfaces of the semiconductor chips are bonded on a carrier plate; forming a second shielding layer on the first shielding layer; forming a plastic package layer on the second shielding layer and the carrier plate between the semiconductor chips; stripping the carrier plate to form a pre-sealing panel, wherein the back surface of the pre-sealing panel exposes the functional surfaces of the semiconductor chips; and forming an external contact structure connected with bonding pads on the back surface of the pre-sealing panel. According to the invention, the second shielding layer is formed on the first shielding layer, and the second shielding layer can cover places with non-uniform thickness and poor edge coverage in the first shielding layer, so that the whole shielding layer formed by the first shielding layer and the second shielding layer is complete, and the shielding effect is improved.

The invention discloses a shielding type high-power microwave waveguide phase shift control device which comprises a control system and an optical fiber feed-through, and the control system is in communication connection with an external upper computer through the optical fiber feed-through. The problems that in the prior art, the electromagnetic compatibility problem in the high-power microwave environment cannot be effectively solved, and the electromagnetic shielding effect is poor are solved.

An embedding and packaging structure for organic substrate integrated with antenna and radio frequency front end comprises a radio frequency front end module, two dielectric layers and an antenna module. The radio frequency front end module comprises a core plate, wherein the interior of the core plate comprises at least one through groove; at least one active chip which is buried in the through groove of the core plate; two dielectric layers which are respectively a first dielectric layer and a second dielectric layer, wherein the first dielectric layer is arranged on the upper surface of thecore plate and is provided with a plurality of first metallized blind holes in a penetrating manner, and the second dielectric layer is arranged on the lower surface of the core plate and is providedwith a plurality of second metallized blind holes in a penetrating manner. A plurality of metallized through holes are formed in the first dielectric layer, the core plate and the second dielectric layer in a penetrating manner. The antenna module comprises at least one antenna unit arranged on the upper surface of the first dielectric layer; a periodic metal structure which is arranged on the upper surface of the core plate; a metal ground plane which is arranged on the lower surface of the second dielectric layer, wherein the metal ground plane and the periodic metal structure jointly serveas an antenna reflection plane.

The invention discloses a packaging structure and method for realizing electromagnetic shielding of a chip. The structure comprises a chip to be shielded, a mold sealing layer, at least one conductivebridge, and a conductive layer. The side wall of the chip to be shielded is coated with the mold sealing layer, and a bonding pad of the chip to be shielded is exposed. The conductive bridge comprises at least one conductive metal structure. The conductive bridge penetrates through the mold sealing layer, and the two ends of the conductive metal structure in the conductive bridge are exposed outof the surfaces of the two sides of the mold sealing layer respectively. The plurality of conductive bridges are positioned around the chip to be shielded. The conductive layer is arranged on one sideof the mold sealing layer, and the conductive layer is electrically connected with the conductive metal structure. The packaging structure prepared according to the scheme of the invention can realize complete electromagnetic shielding on the chip, and is small in size, the embedded shielding loop is not easily affected by the environment to lose the electromagnetic shielding function, and the embedded shielding loop does not fall off, and is high in reliability. The packaging method for realizing electromagnetic shielding of the chips can also realize independent electromagnetic shielding ofeach chip in a plurality of chip integration, so that mutual interference among the chips in one packaging body is avoided.

The invention belongs to the technical field of microwave and millimeter wave rotation and flexible mechanisms, and discloses an anti-wear rotatable broadband electromagnetic shielding structure, a design method and application, a plurality of arc surface metal convex bodies with the same radius are periodically and regularly arranged along the outer cylindrical surface of a cylindrical substrateto form an array structure, and an embedded ball is arranged at the upper part of each metal convex body. A cylindrical cavity is formed in the shielding body, the cylindrical cavity and the cylindrical surface arc of the cylindrical base body are in a concentric circle relation, proper size parameters are determined through specific steps, the arc surface metal convex body array and the embeddedballs are combined and then inserted into the cylindrical cavity of the shielding body, and a contact structure is formed in a clearance fit mode. And the metal convex body array, the embedded balls and the cylindrical cavity jointly form an electromagnetic band gap structure with a wide electromagnetic forbidden band, so that broadband electromagnetic shielding is realized. The electromagnetic shielding structure disclosed by the invention has a rotatable characteristic, has wear resistance under a proper size condition, and realizes broadband electromagnetic shielding of a microwave and millimeter wave circuit and structure during rotation and movement.

The invention provides a thin-film circuit electromagnetic shielding packaging method. The method concretely comprises the steps that step one, the front surface of a substrate completing array arrangement circuit manufacturing is adhered on a high temperature adhesive tape; step two, the solder is covered on the back surface and the side surface of a circuit wafer; step three, the high temperature adhesive tape is removed; step four, a metal seal cover having the corresponding size with that of each circuit sub-wafer is selected, and the metal seal cover is downwardly folded and sealed to be embedded in the through cavity of the substrate so that the sealed external edge is enabled to be aligned with the bottom part of the circuit wafer and the internal wall is enabled to be closely fit with the circuit; and step five, the clamped array structure is overturned so that the bottom solder is enabled to be upward and fixed, and batch soldering and packaging of the metal seal cover and the thin-film circuit wafer can be realized through reflow soldering. Compared with the methods in the prior art, device level radio frequency signal electromagnetic shielding can be realized, the volume weight is reduced for more than 90% and the cost is reduced for more than 20% in comparison with the mechanical processing metal shell packaging mode. Meanwhile, the batch device assembling mode is adopted and automatic assembling can be supported so that the production efficiency can be enhanced for about 20%.

The invention discloses a PCB manufacturing method and a PCB, which relate to the field of printed circuit board manufacturing. The PCB manufacturing method includes the following steps: making a metalized cylindrical cavity at a signal hole to be opened in a multilayer board; removing a metal layer of a part connected with a signal line on the side wall of the cavity at the opening of the cavity;filling the cavity with an insulating material; and making a signal hole coaxial with the cavity. By arranging the signal hole in the metalized cylindrical cavity to realize electromagnetic shieldingof the signal hole, the problem that the electromagnetic leakage of the signal hole cannot be eliminated and the signal quality is thus reduced because there is no space to arrange a shielding hole in a high-density PCB is solved.

The invention discloses a support type electromagnetic shielding tent which comprises a tent body. The tent body is made of electromagnetic shielding composite material, so that electromagnetic shielding is achieved. The electromagnetic shielding composite material is material in the prior art, filling type electromagnetic shielding composite material, surface layer conductive type electromagnetic shielding composite material and the like.