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Chip stacking packaging body with electromagnetic shielding function and preparation method thereof

A chip stacking and electromagnetic shielding technology, applied in the direction of electric solid devices, circuits, electrical components, etc., can solve the problems of unable to guarantee microwave/millimeter wave bare chips, unable to meet the packaging requirements of microwave/millimeter wave bare chips, etc., and achieve circuit layout Reduced space, improved integration, and small size

Active Publication Date: 2020-05-08
航天科工微系统技术有限公司
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  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

When the chips are densely arranged, there is no guarantee that there will be no interference from other electromagnetic fields around the area above the microwave / millimeter wave bare chip
Existing chip packaging methods cannot meet the packaging requirements of microwave / millimeter wave bare chips. Therefore, it is necessary to provide a chip stack package with electromagnetic shielding function and its preparation method

Method used

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  • Chip stacking packaging body with electromagnetic shielding function and preparation method thereof
  • Chip stacking packaging body with electromagnetic shielding function and preparation method thereof
  • Chip stacking packaging body with electromagnetic shielding function and preparation method thereof

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Embodiment 2

[0051] Another specific embodiment of the present invention discloses a method for preparing a chip stack package with electromagnetic shielding function in Embodiment 1, which specifically includes the following steps:

[0052] Step 1: setting a packaging dielectric layer 107 on the surface of the microwave / millimeter wave bare chip 101 to be packaged.

[0053] The surface of the microwave / millimeter wave bare chip 101 to be packaged is cleaned, and a layer of packaging medium layer 107 is coated on the surface of the microwave / millimeter wave bare chip 101 with a glue spreader, such as figure 2 shown. The material of the packaging dielectric layer 107 is polyimide, and the thickness of the packaging dielectric layer 107 is 8-10um, preferably 9um. This thickness parameter setting overcomes the performance of the microwave / millimeter wave bare chip 101 when the thickness of the packaging dielectric layer 107 is too thin. Defects that cause deterioration, excessive thickness ...

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PUM

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Abstract

The invention relates to a chip stacking packaging body with an electromagnetic shielding function and a preparation method thereof, belongs to the technical field of integrated circuits, and solves the problem of mutual interference of electromagnetic signals caused by reduction of the distance between microwave / millimeter wave chips. The chip stacking packaging body comprises a microwave / millimeter wave bare chip and a packaging structure used for packaging the microwave / millimeter wave bare chip, and the packaging structure comprises a packaging dielectric layer and a packaging metal wiringlayer which are sequentially arranged on the microwave / millimeter wave bare chip. According to the invention, the size is smaller, the integration degree is higher, and the sensitive microwave / millimeter wave bare chip can be protected from interference of other electromagnetic fields.

Description

technical field [0001] The invention relates to the technical field of integrated circuits, in particular to a chip stack package with electromagnetic shielding function and a preparation method thereof. Background technique [0002] As the electronic industry continues to reduce the size of electronic components and continue to increase functions on electronic components, the functions and complexity of integrated circuits continue to increase. This trend also drives the packaging technology of integrated circuit components to develop towards a direction of small size and high integration, and conforms to predetermined industrial standards. [0003] At present, microwave / millimeter wave chips generally adopt the assembly and integration method of bare chip bonding to form a multi-chip module (MCM). However, when using this method, in order to improve the integration of the module, it is necessary to reduce the distance between the chips. When the distance between the chip...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/29H01L23/31H01L23/552H01L25/065
CPCH01L23/29H01L23/3157H01L23/552H01L25/0657
Inventor 狄隽王升旭王志明王强济岳超许兰锋
Owner 航天科工微系统技术有限公司
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