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Packaging structure and method for electromagnetic shielding of chip

A technology of electromagnetic shielding and packaging method, which is applied to circuits, electrical components, electrical solid devices, etc., and can solve the problems of large volume, high difficulty and high preparation cost of the packaging body.

Inactive Publication Date: 2019-05-28
NAT CENT FOR ADVANCED PACKAGING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of this, the embodiments of the present invention provide a packaging structure and method for implementing electromagnetic shielding on chips, so as to solve the problem of poor reliability of electromagnetic shielding structures in the prior art, high manufacturing costs, high difficulty, and packaging after electromagnetic shielding is provided. the larger problem

Method used

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  • Packaging structure and method for electromagnetic shielding of chip
  • Packaging structure and method for electromagnetic shielding of chip
  • Packaging structure and method for electromagnetic shielding of chip

Examples

Experimental program
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Embodiment 1

[0033] Embodiments of the present invention provide a packaging structure for implementing electromagnetic shielding on chips, such as Figure 5G As shown, the package structure for realizing electromagnetic shielding of chips includes a chip to be shielded 50 , a molding layer 70 , at least one conductive bridge 60 , and a conductive layer 30 .

[0034] The molding layer 70 covers the sidewall of the chip to be shielded 50 and exposes the pad of the chip to be shielded 50 .

[0035] The conductive bridge 60 includes at least one conductive metal structure, the conductive bridge 60 penetrates the molding layer 70 , and the two ends of the conductive metal structure in the conductive bridge 70 are respectively exposed on both sides of the molding layer 70 . The conductive bridge 60 can be a separate conductive metal wire or a conductive metal sheet (this situation is not shown in the accompanying drawings of the present application; based on the limitation of the manufacturing ...

Embodiment 2

[0044] figure 1 A flow chart of a packaging method for implementing electromagnetic shielding for a chip according to an embodiment of the present invention is shown, and the packaging method can be used to manufacture the packaging structure described in Embodiment 1 or any optional implementation manner thereof. Such as figure 1 As shown, the method includes the following steps:

[0045] S101: attaching the chip to be shielded on the first surface of the carrier board.

[0046] S102: Attach at least one conductive bridge on the first surface of the carrier board at a position corresponding to each sidewall of the chip to be shielded; the conductive bridge includes at least one conductive metal structure.

[0047] Such as Figure 5D As shown, 10 is a carrier board, and 50 is a chip to be shielded. In this step S101, the method of attaching the chip 50 to be shielded can be as follows Figure 5A and Figure 5D Shown: (In one embodiment, Figure 5A and Figure 5D The co...

Embodiment 3

[0060] figure 2 A flow chart of another packaging method for implementing electromagnetic shielding for chips according to an embodiment of the present invention is shown, and the packaging method can be used to manufacture the packaging structure described in Embodiment 1 or any optional implementation manner thereof. Such as figure 2 As shown, the method includes the following steps:

[0061] S201: Disposing a conductive layer on the first surface of the carrier.

[0062] Such as Figure 5A As shown, 10 is a carrier board, and 30 is a conductive layer. For details, refer to step S104 in the third embodiment.

[0063] S202: attaching the chip to be shielded on the surface of the conductive layer, wherein the pads of the chip to be shielded face away from the carrier board.

[0064] S203: Attach at least one conductive bridge on the surface of the conductive layer at a position corresponding to each sidewall of the chip to be shielded; the conductive bridge includes at ...

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Abstract

The invention discloses a packaging structure and method for realizing electromagnetic shielding of a chip. The structure comprises a chip to be shielded, a mold sealing layer, at least one conductivebridge, and a conductive layer. The side wall of the chip to be shielded is coated with the mold sealing layer, and a bonding pad of the chip to be shielded is exposed. The conductive bridge comprises at least one conductive metal structure. The conductive bridge penetrates through the mold sealing layer, and the two ends of the conductive metal structure in the conductive bridge are exposed outof the surfaces of the two sides of the mold sealing layer respectively. The plurality of conductive bridges are positioned around the chip to be shielded. The conductive layer is arranged on one sideof the mold sealing layer, and the conductive layer is electrically connected with the conductive metal structure. The packaging structure prepared according to the scheme of the invention can realize complete electromagnetic shielding on the chip, and is small in size, the embedded shielding loop is not easily affected by the environment to lose the electromagnetic shielding function, and the embedded shielding loop does not fall off, and is high in reliability. The packaging method for realizing electromagnetic shielding of the chips can also realize independent electromagnetic shielding ofeach chip in a plurality of chip integration, so that mutual interference among the chips in one packaging body is avoided.

Description

technical field [0001] The invention relates to the technical field of advanced packaging of integrated circuits, in particular to a packaging structure and method for realizing electromagnetic shielding of chips. Background technique [0002] In the field of electronic devices, there are many integrated circuit chips (English: Integrated Circuit, abbreviated as IC, which are referred to as chips in this application) that are sensitive to electromagnetic interference, such as radio frequency chips, especially high frequency radio frequency chips. These chips must be electromagnetically shielded before they can work. [0003] In the prior art, the electromagnetic shielding of the chip is often done by placing a metal shell around the package body of the chip, or forming a metal film on the package body of the chip by means of vacuum sputtering. [0004] However, the inventors found that installing the metal case increases the volume of the chip packaging structure, and at th...

Claims

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Application Information

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IPC IPC(8): H01L23/31H01L23/29H01L23/552H01L21/50H01L21/56
CPCH01L2224/18H01L2224/04105H01L2224/12105H01L2924/3025
Inventor 姚大平
Owner NAT CENT FOR ADVANCED PACKAGING
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