6results about "Screening metallic containers" patented technology

The present invention discloses an EMC wave-filter shielding structure including an EMC filter board; a lower shield cover that is installed on one side of the EMC filter board, and connected with the EMC filter board around to form a shielding cavity; a X capacitor, a Y capacitor, a first filter inductor and a second filter inductor that are all arranged in the shielding cavity and correspondingly connected with the EMC filter board, respectively; and an upper shield cover that is installed on the other side of the EMC filter board backing toward the shielding cavity, and directly opposite to the lower shield cover. The present invention increases the distance between an electromagnetic interference source and a control signal, and enhancing quality of control signals.

A modular field device which, in spite of a plastic housing, fulfills EMC requirements and is easy to manufacture includes a sensor module for determining a process variable. For the purpose of EMC-protection, a conductive enclosure is secured in an inner space of the housing and surrounds a first inner region. A first end region of the enclosure is oriented toward a passageway of the housing. An opposite, second end region of the enclosure is closed by a circuit board such that the inner region is electromagnetically shielded. Accordingly, also the evaluation module connected with the sensor module and serving for communication is EMC protected since it is arranged in the protected inner region on a surface of the circuit board facing the inner region.

The present disclosure relates to a housing assembly for accommodating printed circuit boards (PCBs). The housing assembly comprises a first housing portion configured to accommodate a first PCB, a second housing portion configured to accommodate a second PCB, and a separating portion for separating the first housing portion from the second housing portion. The separating portion comprises a first separating region in which the first housing portion and the second housing portion overlap and a second separating region that extends beyond the second housing portion and covers the first housing portion. The second separating region comprises one or more convection openings.

The present invention provides a magnetic device with a shielding layer and a method for manufacturing an inductor. The magnetic device has a body, wherein a shielding layer is formed on the body to prevent magnetic field leakage to the outside of the magnetic device, thereby reducing electromagnetic interference and the size of the magnetic device.

An electronic assembly includes a first printed circuit board (PCB) having a first ground plane and a second PCB having a second ground plane separated by a gap. A metal frame is positioned in the gap having an upper surface facing the first PCB and a lower surface facing the second PCB. The assembly includes a first conductive seal contacting the upper surface of the first ground plane and a second conductive seal contacting the lower surface of the second ground plane. In some embodiments, the metal frame extends around or adjacent to the periphery of both PCBs. In other embodiments, the metal frame is a partial metal frame that partially surrounds the connector.

A housing for electronic components and to a brake device having such a housing. The housing is characterized here by a high level of electromagnetic compatibility. The housing includes a cover and a base, wherein the cover and the base form a cavity for receiving and holding at least one electronic component, preferably a circuit board, including: a housing part as part of a wall of the housing, and an electronic component, which is held within the cavity. The housing part includes at least one first contact surface. The electronic component includes a second contact surface with electrical contacts. In the mounted position, the first contact surface and the second contact surface are arranged in a mutually corresponding or opposite manner, and the air gap between the first contact surface and the second contact surface is preferably 2 mm or less.