289results about "Screening metallic containers" patented technology

The invention provides an electromagnetically shielded enclosure for personal electronic device security, comprising a lower enclosure having a receiving space for at least one electronic devices disposed on a base portion of the lower enclosure. An upper lid is structurally engaging with the whole lower enclosure to form an electromagnetically shielding structure. A wireless charging element is configured on the lower enclosure for wirelessly charging to provide power to at least one electronic device.

A computer or microchip comprising an outer chamber and at least one inner chamber inside the outer chamber. The outer chamber and the inner chamber being separated at least in part by an internal sipe, and at least a portion of a surface of the outer chamber forming at least a portion of a surface of the internal sipe. The internal sipe has opposing surfaces that are separate from each other and therefore can move relative to each other, and at least a portion of the opposing surfaces are in contact with each other in a unloaded condition. The outer chamber including a Faraday Cage. A computer, comprising an undiced semiconductor wafer having a multitude of microchips. The multitude of microchips on the wafer forming a plurality of independently functioning computers, each computer having independent communication capabilities.

A floating heatsink is disclosed for components mounted within an electromagnetic enclosure. The floating heatsink includes an aperture within the enclosure wall against which a floating heatsink is disposed on the interior of the enclosure. The floating heatsink is dimensioned to overlap the enclosure around the aperture. A resilient bias member is disposed along the overlap between the floating heatsink and the enclosure. The resilient bias member acts as an electromagnetic gasket while urging the floating heatsink against the component. In certain embodiments the component is replaceable via a second aperture in the enclosure. The floating heatsink is particularly useful for overcoming the need for thermal compounds of heatsinks using the enclosure known in the art.

An electrical component with conductive material(s) that is suitable for use within the electromagnetic field path of a wireless power transfer system. The electronic component includes conductive materials that are sufficiently thin to absorb no more than an acceptable amount of the electromagnetic field, yet thick enough to remain sufficiently conductive to perform the desired electrical function. In embodiments in which the wireless power supply delivers up to 20 watts of power, the conductive materials are not substantially thicker than about 1 / 10 the skin depth of the material at the anticipated wireless power frequency. The electrical component may be disposed at any location between the wireless power supply transmitter and the remote device receiver. The present invention permits the use of a wide rang of electrical components in the field path, such as a display, a sensor or a component capable of selectively operating as both.

A field hardened industrial device is described with a housing of the device having electrically conductive walls surrounding a cavity with an open end. An electronics assembly is adapted to fit within the cavity. The device includes a circuit card assembly, which is a multi-layered printed wiring board with pass-through electrical connections and an embedded ground plane electrically coupled to the housing to shield the electronics assembly from electromagnetic interference and to provide environmental protection to the electronics assembly.

Embodiments of the present invention describe a device and method of mitigating radio frequency interference (REI) in an electronic device. The electronic device comprises a housing, and a thermal energy storage material is formed in the housing. By increasing the loss tangent parameter of the thermal energy storage material, the REI of the electronic device is reduced.

A field hardened industrial device is described with a housing of the device having electrically conductive walls surrounding a cavity with an open end. An electronics assembly is adapted to fit within the cavity. The device includes a circuit card assembly, which is a multi-layered printed wiring board with pass-through electrical connections and an embedded ground plane electrically coupled to the housing to shield the electronics assembly from electromagnetic interference and to provide environmental protection to the electronics assembly.

An electronic device includes a substrate, a structure arranged near the substrate and includes at least one electronic component, a conductive structure provided in the electronic device, and a conductor arranged in the structure, grounding the conductive structure to a ground of the substrate. Electronic components spaced within the electronic device are electrically connected to each other using the existing structure to be installed, so that a mounting space for preparing an electrical connector is prevented from being wasted, thereby making the electronic device slim. The embodiments according to the present disclosure can reduce the number of assembling processes and manufacturing costs.

Embodiments of the present invention describe a device and method of mitigating radio frequency interference (REI) in an electronic device. The electronic device comprises a housing, and a thermal energy storage material is formed in the housing. By increasing the loss tangent parameter of the thermal energy storage material, the REI of the electronic device is reduced.

In a receptacle cage, a front EMI fingers in a tubular shape serving as a first shield member is provided on the entire periphery of a substantially rectangular module slot. In addition, a gap between outer peripheral surfaces of an upper case as well as a lower plate of an optical module connected to a receptacle connector in a receptacle connector accommodating portion and an inner surface of the cage is shielded by a top EMI fingers serving as a second shield member and side EMI fingers serving as third shield members. Moreover, the lower plate comes into contact with a bottom wall portion which is grounded.

A magnetically shielded fluorescent lamp ballast case for shielding human beings from the negative effects of magnetic fields emanating from a fluorescent lamp ballast is made of a ferromagnetic alloy, or lined on the inside or the outside of the fluorescent lamp ballast case with such foil alloys. The ferromagnetic alloy for the magnetically shielded fluorescent lamp ballast case is a soft magnetic material. The soft magnetic material is a metal alloy containing one or more than one of the following elements: iron, nickel, or cobalt. The fluorescent lamp ballast case can be made of steel or aluminum, and lined on the inside or the outside of the ballast case with a ferromagnetic foil alloy which is attached to the steel or aluminum by adhesive. The magnetically shielded fluorescent lamp ballast case for a fluorescent lamp ballast can be employed for core coil fluorescent lamp ballasts or for electronic solid state fluorescent lamp ballasts. There is a substantial attenuation of the magnetic component of the electromagnetic field, particularly of frequencies up to about 100 Kilohertz.

An optoelectronic transceiver module. The optoelectronic module is a monolithic, one-piece module shell that includes a top portion, a bottom portion, a first side portion, a second side portion, and a front portion. The top portion, bottom portion, first side portion, second side portion and the front portion define a cavity configured to enclose electro-optical circuitry. In addition, the top portion and the bottom portion are configured such that the top portion is not separable from the bottom portion. Further, the front portion defines at least one of an optical transmit port or an optical receive port.

The present invention provides a configuration of a computer-chassis containment or other electromagnetic device method for manufacture in which a “one-hit” solution may be implemented to provide adequate electromagnetic interference shielding (EMC shielding) and is configured such that shielding gaskets, “spoons” or other excessive structures may be reduced or eliminated completely. Two sheets of conductive material are formed into two and three-dimensional “patterns” and channels with contact points that are stamped, molded, cut, or extruded into one or more sides of a “box” providing sufficient EMI shielding.

In a receptacle cage, a front EMI fingers in a tubular shape serving as a first shield member is provided on the entire periphery of a substantially rectangular module slot. In addition, a gap between outer peripheral surfaces of an upper case as well as a lower plate of an optical module connected to a receptacle connector in a receptacle connector accommodating portion and an inner surface of the cage is shielded by a top EMI fingers serving as a second shield member and side EMI fingers serving as third shield members. Moreover, the lower plate comes into contact with a bottom wall portion which is grounded.

In a receptacle cage, a front EMI fingers in a tubular shape serving as a first shield member is provided on the entire periphery of a substantially rectangular module slot. In addition, a gap between outer peripheral surfaces of an upper case as well as a lower plate of an optical module connected to a receptacle connector in a receptacle connector accommodating portion and an inner surface of the cage is shielded by a top EMI fingers serving as a second shield member and side EMI fingers serving as third shield members. Moreover, the lower plate comes into contact with a bottom wall portion which is grounded.

A wireless sensor device (10) for a high-voltage environment, which device (10) comprises a housing (12), a control unit (18) for monitoring one or more variable(s) (T) and a power supply unit (20), wherein the housing (12) is designed such that an electric field (E) is minimized and the communication unit (16) is arranged partly inside the housing (12).

A dielectric waveguide for propagating electromagnetic signals includes a cladding and an electrically conductive shield. The cladding has a body composed of a first dielectric material. The body defines a core region therethrough that is filled with a second dielectric material different than the first dielectric material. The cladding further includes at least two ribs extending from an outer surface of the body to distal ends. The shield engages the distal ends of the ribs and peripherally surrounds the cladding such that air gaps are defined radially between the outer surface of the body and an interior surface of the shield.

An electronic device includes: a metal housing with an opening; a metal lid that is attached to the housing so as to cover the opening; a first substrate fixed in the housing and spread facing and parallel to the opening; two connectors that are fixed in the housing at a position facing and closer to the opening than the first substrate and are spread facing and parallel to the opening, the two connectors extending parallel to each other such that there is a predetermined space between the two connectors, the two connectors each being capable of receiving a second substrate that is inserted therein toward the space; and a metal plate member disposed in the space so that the metal plate member is fastened to the housing and resiliently contacts a surface of the first substrate, thereby electrically connecting a ground of the first substrate to the housing.

A system and method of constructing an electronic assembly. A structural component is identified as a candidate for forming as a combined construction of a metal element and a polymer element. A minimum material thickness required of the metal element for achieving a required electromagnetic shielding property is determined. A minimum area required of the metal element for achieving a required electrical bonding property is determined. A maximum polymer element proportion of the structural component that meets a required structural property and a required thermal property is determined. The structural component is designed with the metal element having the minimum material thickness and the minimum area and with the polymer element having the maximum polymer element proportion. The structural component is manufactured from the polymer element and the metal element to meet the mechanical and electrical properties, and the structural component in the electronic assembly.

Exemplary embodiments are disclosed of shielding apparatus or assemblies having a frame with drawn latching features or portions that are configured for removably attaching a cover to the frame. In an exemplary embodiment, there is a shielding apparatus suitable for use in providing electromagnetic interference shielding for one or more electrical components on a substrate. In this example, the shielding apparatus generally includes a cover and a frame. The cover includes one or more openings. The frame includes a top surface and sidewalls configured to be disposed generally about one or more electrical components on a substrate. The frame is partly drawn in construction such that the frame includes one or more drawn latching features or portions configured to be engaged within the one or more openings of the cover to thereby releasably attach the cover to the frame. The invention also relates to a method for manufacturing the frame of the electromagnetic interference shielding apparatus.

An enclosure that has an interior space sized to receive a portable electronic device. The enclosure has a shielding layer that can shield and prevent communications between the interior space and the outside world in a first configuration. In a second configuration, communication is allowed. A signal transfer element is attached to the enclosure housing that can be moved between an isolation configuration and a communication configuration.

An electronic circuit module includes a circuit board on which electronic components are mounted, and a metal cover covering the circuit board. The metal cover includes a top plate disposed so as to face the circuit board, side plates, and mounting legs. The circuit board has lands to which the mounting legs are joined. The mounting legs each have a bent portion located on the outer periphery of the top plate of the metal cover, and a mounting leg fixing portion in contact with the lands of the circuit board. When seen from the upper surface of the circuit board, the position of the bent portion is on the inner side of the position of the mounting leg fixing portion, and the width of the bent portion is greater than the width of the mounting leg fixing portion.

The embodiment discloses a method for manufacturing an electric device and a shielding member. The electric device includes a metal member, a circuit board and the shielding member. A through hole or a groove is opened on the metal member. The metal member is a metal punching member or a metal press forging member. The circuit board is arranged opposite to the metal member and is provided with electric devices. The shielding member is fixed on the metal member. The shielding member includes a blocking part and a sealing part. THe blocking part is made of conductive plastic materials. The sealing part is made of metal or conductive plastic materials. The blocking part is used for blocking the through hole or the groove. The sealing part surrounds the electric devices, and one end is electrically connected to the metal member, and the other end is electrically connected to the circuit board. The metal member, the blocking part, the shielding part and the circuit board form shielding space, and the electric devices are arranged in the shielding space.

A housing for the scan unit printhead of an imaging device. The housing is substantially bowl shaped having a plurality of mounting surfaces extending inwardly toward a central region of the housing. The housing is constructed from a metal composition. The scan unit includes a plurality of light sources and an optical assembly operatively coupled thereto. The housing mounting surfaces support components of the optical assembly using an adhesive, without additional mounting hardware.

Provided is a print circuit board including: a ground conductor layer; a pair of strip conductors extending along a first orientation; a first resonator conductor three-dimensionally intersecting with the pair of strip conductors along a second orientation; a pair of first via holes connecting the first resonator conductor and the ground conductor layer; and a dielectric layer including the first resonator conductor therein, and being disposed between the ground conductor layer and the pair of the strip conductors. A distance H1 between the pair of strip conductors and the ground conductor layer is twice or more a distance H2 between the pair of strip conductors and the first resonator conductor, and a line length L of the first resonator conductor is 0.4 wavelength or more and 0.6 wavelength or less at a frequency corresponding to the bit rate.

An electronic circuit module includes a circuit board on which electronic components are mounted, and a metal cover covering the circuit board. The metal cover includes a top plate disposed so as to face the circuit board, side plates, and mounting legs. The circuit board has lands to which the mounting legs are joined. The mounting legs each have a bent portion located on the outer periphery of the top plate of the metal cover, and a mounting leg fixing portion in contact with the lands of the circuit board. When seen from the upper surface of the circuit board, the position of the bent portion is on the inner side of the position of the mounting leg fixing portion, and the width of the bent portion is greater than the width of the mounting leg fixing portion.