The invention discloses an electromagnetic-thermal-stress collaborative optimization
power module packaging device, which belongs to the technical field of
electromagnetic compatibility and thermal management of power modules and comprises a cover plate and a five-surface
metal shell. The cover plate is a PCB and is composed of a
solder mask layer, a first insulating layer, a first shielding
metal layer, a second insulating layer, a second shielding
metal layer, a third insulating layer and a weldable metal layer which are sequentially stacked from top to bottom. The weldable metal layer is laid on the edge of the PCB. The weldable metal layer of the PCB is fixedly connected with the milling groove in the end face of the metal base through high-frequency induction
tin soldering to form a totally-closed
electromagnetic shielding cavity. The cover plate is a high-thermal-
conductivity ceramic substrate, heat dissipation through holes are formed between the metal
layers, the cover plate is in heat conduction connection with the end face of the five-face metal shell through the heat dissipation through holes, and efficient
heat management is achieved. The invention has the advantages of excellent
electromagnetic shielding performance,
high heat dissipation efficiency, strong
assembly reliability, compact structure and the like, and can be applied to the fields of communication base stations,
aerospace and the like with strict requirements on electromagnetic environments.