186results about "EMI leakage reduction" patented technology

A junction box used for making electrical connections to a photovoltaic panel. The junction box has two chambers including a first chamber and a second chamber and a wall common to and separating both chambers. The wall may be adapted to have an electrical connection therethrough. The two lids are adapted to seal respectively the two chambers. The two lids are on opposite sides of the junction box relative to the photovoltaic panel. The two lids may be attachable using different sealing processes to a different level of hermeticity. The first chamber may be adapted to receive a circuit board. The junction box may include supports for mounting a printed circuit board in the first chamber. The second chamber is configured for electrical connection to the photovoltaic panel. A metal heat sink may be bonded inside the first chamber. The first chamber is adapted to receive a circuit board for electrical power conversion, and the metal heat sink is adapted to dissipate heat generated by the circuit board.

An electrical connector assembly includes a cage having an upper wall, a lower wall, and side walls that extend from the upper wall to the lower wall. The side walls have exterior sides. The cage includes an interior cavity and a divider that extends between the side walls and divides the interior cavity into at least two internal compartments. The cage includes a front end that is open to the internal compartments. The side walls have front edges at the front end. The internal compartments are configured to receive pluggable modules therein through the front end. An electromagnetic interference (EMI) cover is mounted to the divider such that the EMI cover is engaged with and electrically connected to the divider. The EMI cover includes a flap that wraps around the front edge of a corresponding side wall. The flap overlaps and engages the exterior side of the corresponding side wall.

An easily soldered shield case for electromagnetic-wave shielding comprises: a metal main body in the shape of a box of which the bottom surface is open; a flange which is formed extending integrally outward or inward from the open edge of the main body; a plurality of through holes formed along the flange or a plurality of recesses formed along the rear surface of the flange; and a solder member which is stably placed on the through holes or the recesses and projects in the thickness direction of the flange, wherein the shield case is mounted on a printed circuit board and the solder member is electrically and mechanically joined to the printed circuit board by means of soldering.

An EMI collar is provided that is configured to be secured about a housing of a pluggable optical transceiver module. The configuration of the EMI collar and the method by which the collar is attached to the housing of the transceiver module ensures that the collar will not be damaged when the transceiver module housing is inserted into a cage. Ensuring that the collar will not be damaged during insertion ensures that electrically conductive contact points on the collar will not be eliminated by insertion of the housing into a cage. In addition, dimples, or indentations, formed on the spring fingers of the EMI collar result in additional electrically conductive contact points on the fingers that result in a reduction in the size of the maximum EMI aperture dimension of the collar. Reducing the maximum EMI aperture dimension of the collar greatly improves the ability of the collar to attenuate EMI signals, even EMI signals having high frequencies.

A modular system of plastic walls having embedded and coextensive electrically conductive components configured to electrically connect with each other when the walls are mated. The walls have joining edges that form joint seams with other walls when joined together to create an enclosure. When enough walls are used to surround a storage space, a Faraday cage is created. The walls additionally have portions of tortuous paths at each joining edge that mate with a complementary portion of a tortuous path of another wall when the walls are joined together. A torturous path seal is thereby created at each joint seam. The plastic walls can be configured in a multiplicity of combinations to create various enclosures necessary for RFID-enabled storage and tracking of medical articles. Containers, enclosures, cabinets, and drawers of differing heights and sizes can be made and they may be stacked or otherwise assembled.

An electrical device has a housing that includes a main body and a lid both of which are electrically conductive. The lid is fastened to a top surface of a sidewall of the main body so as to cover the main body. On at least one of a bottom surface of the lid and the top surface of the sidewall of the main body, there are formed a plurality of protrusions at predetermined positions; each of the protrusions abuts against that one of the bottom surface of the lid and the top surface of the sidewall which is opposed to the protrusion. Except at those predetermined positions where the protrusions are formed, there is provided, between the bottom surface of the lid and the top surface of the sidewall of the main body, a gap via which the internal and external spaces of the housing communicate with each other.

A printed circuit board and an electronic product are disclosed. In accordance with an embodiment of the present invention, the printed circuit board includes a first board, which has an electronic component mounted thereon, and a second board, which is positioned on an upper side of the first board and covers at least a portion of an upper surface of the first board and in which an EBG structure is inserted into the second board such that a noise radiating upwards from the first board is shielded. Thus, the printed circuit board can readily absorb various frequencies, be easily applied without any antenna effect and be cost-effective in manufacturing.

The charging device and the charging system include a storage space for storing plate-like electronic apparatuses having power-receiving coils mounted on the end portion, and power-supplying coils which are provided on a surface facing the end portion and generate inductive currents in the power-receiving coils of the electronic apparatuses stored in the storage space.

A cage assembly is provided for receiving a pluggable module. The cage assembly includes a cage having a front end, a mounting side, and an internal compartment. The front end is open to the internal compartment of the cage. The internal compartment is configured to receive the pluggable module therein through the front end. A heat sink is mounted to the mounting side of the cage. The heat sink has a module side that is configured to thermally communicate with the pluggable module. An electromagnetic interference (EMI) gasket extends along at least a portion of an interface between the mounting side of the cage and the module side of the heat sink.

An electro-conductive contact structure for sealing the interior of an enclosure from interference includes first and second electro-conductive contact surfaces. In one embodiment, the first electro-conductive contact surface includes a plurality of projections, and the second electro-conductive contact surface includes a plurality of slots. The projections are configured for insertion into the slots to form an electro-conductive interface between the first and second portions of the enclosure. In another embodiment, the electro-conductive contact structures are formed on first and second housing parts, respectively. In another embodiment, the electro-conductive contact surfaces each include a series of fingers and a plurality of pockets between the fingers.

Provided is a solderable elastic electric contact terminal. The elastic electric contact terminal includes an insulating elastic core including a non-foam rubber having a tube shape, an insulating non-foam rubber coating layer adhered to the insulating elastic core such that the insulating non-foam rubber coating layer encloses the insulating elastic core, and a heat resistant polymer film having one side adhered to the insulating non-foam rubber coating layer such that the heat resistant polymer film encloses the insulating non-foam rubber coating layer and another side on which a metal layer is integrally formed.

The present invention provides a configuration of an electronics enclosure, including a computer chassis in which three-dimensional shapes that may be in the form of a partial or quarter-sphere or cube or other periodic ''patterns'' may be stamped, molded, cut, or extruded into a lid and a five-sided ''box'' to provide improved EMI shielding, such that the need for gaskets is reduced or eliminated.

An apparatus for reducing EMI at the micro-electronic-component level includes a substrate having a ground conductor integrated therein. A micro-electronic component such as an integrated circuit is mounted to the substrate. An electrically conductive lid is mounted to the substrate, thereby forming a physical interface with the substrate. The electrically conductive lid substantially covers the micro-electronic component. A conductive link is provided to create an electrical connection between the electrically conductive lid and the ground conductor at the physical interface.

A wire harness includes first to third electric wires, a braid shield that covers the first to third electric wires, and a tube-shaped electromagnetic wave absorber having a through hole that allows the first to third electric wires to be inserted therethrough, the electromagnetic wave absorber absorbing electromagnetic waves emitted from the first to third electric wires. The braid shield covers an outer circumferential surface and two axial end surfaces of the electromagnetic wave absorber to restrict movement of the electromagnetic wave absorber in an axial direction. The braid shield satisfies 1≦n≦15 and 10≦m≦50 where the number of carriers of the braid shield is denoted by n and the number of ends of the braid shield is denoted by m.

The present invention provides a configuration of a computer-chassis containment or other electromagnetic device method for manufacture in which a “one-hit” solution may be implemented to provide adequate electromagnetic interference shielding (EMC shielding) and is configured such that shielding gaskets, “spoons” or other excessive structures may be reduced or eliminated completely. Two sheets of conductive material are formed into two and three-dimensional “patterns” and channels with contact points that are stamped, molded, cut, or extruded into one or more sides of a “box” providing sufficient EMI shielding.

The present invention provides a configuration of a computer-chassis containment or other electromagnetic device method for manufacture in which a “one-hit” solution may be implemented to provide adequate electromagnetic interference shielding (EMC shielding) and is configured such that shielding gaskets, “spoons” or other excessive structures may be reduced or eliminated completely. Patterned sinusoidal “patterns” that are stamped, molded, cut, or extruded into one or more sides of a “box” provide sufficient EMI shielding, such that the need for gaskets is reduced or eliminated.

A cage assembly is provided for receiving a pluggable module. The cage assembly includes a cage having a front end, a mounting side, and an internal compartment. The front end is open to the internal compartment of the cage. The internal compartment is configured to receive the pluggable module therein through the front end. A heat sink is mounted to the mounting side of the cage. The heat sink has a module side that is configured to thermally communicate with the pluggable module. An electromagnetic interference (EMI) gasket extends along at least a portion of an interface between the mounting side of the cage and the module side of the heat sink.

Electrical components in an electronic device are mounted on substrates such as printed circuits. Printed circuits contain signal paths formed from metal traces. The signal lines in the signal paths of the printed circuits are coupled together using electrical connection structures such as printed circuit board-to-board connectors, contacts joined by anisotropic conductive film, or contacts joined using solder. Electrical connection structures may be surrounded by conductive resilient ring-shaped structures such as conductive foam structures or spring structures. The conductive foam structures may be provided with a metal layer with which the conductive foam structures are soldered to a ring of metal on a printed circuit. Strain relief structures may be formed from an elastomeric ring that surrounds the electrical connection structures or an overmolded plastic structure. Coating layers and conductive plastic may be used in providing strain relief structures with electromagnetic interference shielding capabilities.

An electrical connector assembly includes a cage having an upper wall, a lower wall, and side walls that extend from the upper wall to the lower wall. The side walls have exterior sides. The cage includes an interior cavity and a divider that extends between the side walls and divides the interior cavity into at least two internal compartments. The cage includes a front end that is open to the internal compartments. The side walls have front edges at the front end. The internal compartments are configured to receive pluggable modules therein through the front end. An electromagnetic interference (EMI) cover is mounted to the divider such that the EMI cover is engaged with and electrically connected to the divider. The EMI cover includes a flap that wraps around the front edge of a corresponding side wall. The flap overlaps and engages the exterior side of the corresponding side wall.

An EMI collar is provided that is configured to be secured about a housing of a pluggable optical transceiver module. The configuration of the EMI collar and the method by which the collar is attached to the housing of the transceiver module ensures that the collar will not be damaged when the transceiver module housing is inserted into a cage. Ensuring that the collar will not be damaged during insertion ensures that electrically conductive contact points on the collar will not be eliminated by insertion of the housing into a cage. In addition, dimples, or indentations, formed on the spring fingers of the EMI collar result in additional electrically conductive contact points on the fingers that result in a reduction in the size of the maximum EMI aperture dimension of the collar. Reducing the maximum EMI aperture dimension of the collar greatly improves the ability of the collar to attenuate EMI signals, even EMI signals having high frequencies.

Disclosed is an easily soldered shield case for electromagnetic-wave shielding. The shield case comprises: a metal main body in the shape of a box of which the bottom surface is open; a flange which is formed extending integrally outward or inward from the open edge of the main body; a plurality of through holes formed along the flange or a plurality of recesses formed along the rear surface of the flange; and a solder member which is stably placed on the through holes or the recesses and projects in the thickness direction of the flange, wherein the shield case is mounted on a printed circuit board and the solder member is electrically and mechanically joined to the printed circuit board by means of soldering.

A filter design configured to operate in the medium voltage range of 1000 to 5000 volts, provides protection against Electromagnetic Pulse / High Altitude Electromagnetic Pulse (EMP / HEMP) intentional electromagnetic interference pulses. The filter utilizes no oil filled components to preclude the catastrophic failures (explosions) during operation. Many of the components incorporated in the present design are suited to absorbing harmonics without failing. In addition to mitigating E1 and E2 pulses, the filter is resistant to line harmonics which have proved to cause filter failure in past designs. The filter provides EMP / HEMP conducted pulse protection for downstream electronics inside hardened shelters for medium and high voltage applications.

An enclosure that has an interior space sized to receive a portable electronic device. The enclosure has a shielding layer that can shield and prevent communications between the interior space and the outside world in a first configuration. In a second configuration, communication is allowed. A signal transfer element is attached to the enclosure housing that can be moved between an isolation configuration and a communication configuration.

An electronic circuit module includes a circuit board on which electronic components are mounted, and a metal cover covering the circuit board. The metal cover includes a top plate disposed so as to face the circuit board, side plates, and mounting legs. The circuit board has lands to which the mounting legs are joined. The mounting legs each have a bent portion located on the outer periphery of the top plate of the metal cover, and a mounting leg fixing portion in contact with the lands of the circuit board. When seen from the upper surface of the circuit board, the position of the bent portion is on the inner side of the position of the mounting leg fixing portion, and the width of the bent portion is greater than the width of the mounting leg fixing portion.

Provided is an electromagnetic-shielding film which, even when used in a part which frequently undergoes flexing or sliding, such as the hinge or the like of a cellphone, etc., retains the effect of shielding electromagnetic waves over a long period. Also provided is a process for producing a substrate, the process including using this film to form an electromagnetic-shielding layer. The electromagnetic-shielding film comprises a conductive layer comprising (A) metal particles and (B) a binder resin and a protective layer superposed on the conductive layer. The conductive layer is a layer formed from a conductive paste containing (a) flaky metal particles having an average thickness of 50-300 nm and an average diameter of 3-10 [mu]m and (b) acicular or dendritic metal particles having an average diameter of 3-10 [mu]m.

An electro-conductive contact structure for sealing the interior of an enclosure from interference includes first and second electro-conductive contact surfaces. In one embodiment, the first electro-conductive contact surface includes a plurality of projections, and the second electro-conductive contact surface includes a plurality of slots. The projections are configured for insertion into the slots to form an electro-conductive interface between the first and second portions of the enclosure. In another embodiment, the electro-conductive contact structures are formed on first and second housing parts, respectively. In another embodiment, the electro-conductive contact surfaces each include a series of fingers and a plurality of pockets between the fingers.

A corrosion resistant Faraday cage assembly includes an electrically conductive cover and a coated die cast housing having a ledge extending around the perimeter of the housing. A fence is positioned adjacent to the ledge and a track is positioned between the ledge and the fence. A plurality of serrated contact points are positioned on the fence and are used for making electrical contact with the electrically conductive cover extending over the track. The contact points are either masked prior to the protective coating process or they are mechanically or chemically modified afterward to expose a plurality of electrically-conductive surfaces to be in contact with the electrically-conductive cover.