Test system and method

Abstract

The invention relates to test system and method, which can be used for testing a unit to be tested with signal pins at two surfaces. The test system comprises a testing platform and a picking and placing device, wherein the testing platform comprises an electromagnetic shielding cavity and a testing environment module, the electromagnetic shielding cavity is provided with an opening, the testing environment module is arranged in the electromagnetic shielding cavity; the picking and placing device is movably arranged above the testing platform and comprises an electromagnetic shielding upper cover and a signal conducting structure, when the picking and placing structure places the unit to be tested on the testing environment module, the electromagnetic shielding upper cover is matched with the electromagnetic shielding cavity of the testing platform to form an electromagnetic shielding space for isolating the unit to be tested; meanwhile, the signal pins positioned on the upper surface of the unit to be tested can be electrically connected with the testing environment module through the signal conducting structure.

Description

technical field [0001] The invention relates to a test system and a test method, in particular to a test system and a test method with electromagnetic shielding effect. Background technique [0002] With the continuous evolution of semiconductor technology, the four important processes of design, manufacturing, packaging and testing required for the production of chip components have formed their own professional fields. As the structure of chip components becomes more complex, the functions are more diverse, and the requirements are more precise, the integration of various active / passive components to form a miniaturized chip module, and its testing process technology has also become an important part of the electronics industry to ensure production quality and speed up production processes. important technical key. [0003] In the known technology, when the integrated component module is tested, there is usually a dedicated test equipment for fixing the module, measuring ...

AI Technical Summary

Problems solved by technology

However, the traditional test system can only test the unit under test with single-sided pins. If it is applied to the unit under test with double-sided pins, the test process may need to be repeated twice to ensure the signal of the pins on different surfaces. Correct action

In this way, the traditional test system will increase the extra test process because the signal pins are located on different surfaces of the unit under test, which will reduce the efficiency of the overall test system

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