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Forming method of packaging structure

A technology of packaging structure and contact structure, which is applied in the manufacturing of electrical components, electric solid-state devices, semiconductor/solid-state devices, etc., can solve the problem that the electromagnetic shielding effect needs to be improved, and achieve the effect of improving efficiency and ensuring integrity.

Active Publication Date: 2019-12-03
NANTONG TONGFU MICROELECTRONICS CO LTD
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  • Abstract
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  • Application Information

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Problems solved by technology

[0004] An existing electromagnetic shielding solution is mainly to set a magnetic field shielding layer on the semiconductor packaging structure to shield the electromagnetic interference between chips, but the effect of the existing electromagnetic shielding still needs to be improved

Method used

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Embodiment Construction

[0039] As mentioned in the background, the effect of existing electromagnetic shielding still needs to be improved.

[0040] The study found that the existing magnetic field shielding layer is generally formed by sputtering process. Since the thickness of the semiconductor package structure is generally thick, and the semiconductor package structure is generally rectangular, the semiconductor package structure has multiple corners and the side wall is relatively steep. When the magnetic field shielding layer covering the semiconductor package structure is formed by sputtering, the thickness of the formed magnetic field shielding layer is likely to be uneven, and the edge of the semiconductor package structure may not be covered, thus making it difficult to guarantee the shielding effect of the magnetic field shielding layer.

[0041] Therefore, the present invention provides a packaging structure and a forming method thereof. In the forming method, after the first plastic seali...

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Abstract

The present invention provides a forming method of a packaging structure. The forming method of a packaging structure comprises the steps of: after first plastic packaging layers on the functional faces of a plurality of semiconductor chips are bonded to a carrier plate, forming first shielding layers wrapping the non-functional faces and the side wall surfaces of the semiconductor chips; formingsecond shielding layers on the first shielding layers; forming second plastic packaging layers on the second shielding layer and the carrier plate between the semiconductor chips; stripping the carrier plate to form a pre-sealing panel, and exposing the first plastic packaging layers on the back surface of the pre-sealing panel; removing part of the first plastic packaging layers to expose metal bumps; and forming an external contact structure connected with the metal bumps on the back surface of the pre-sealing panel. According to the invention, the second shielding layers are formed on the first shielding layers, and the second shielding layers can cover places with non-uniform thickness and poor edge coverage in the first shielding layers, so that the whole shielding layer formed by thefirst shielding layers and the second shielding layers is complete, and the shielding effect is improved.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a method for forming a packaging structure with electromagnetic shielding. Background technique [0002] The rapid development of a new generation of electronic products has promoted the development of integrated circuit packaging in the direction of high density, high frequency, miniaturization, and high integration, and high-frequency chips often generate strong electromagnetic waves, which cause undesirable effects on the inside and outside of the package and the chip. In addition, the density of electronic components is getting higher and higher, and the distance of transmission lines is getting closer and closer, which makes the problem of electromagnetic interference from inside and outside the integrated circuit package more and more serious, and at the same time will reduce the quality and life of integrated circuits. [0003] In electronic equipment and electro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/56H01L21/60H01L23/552H01L23/31
CPCH01L21/561H01L21/568H01L23/3107H01L23/552H01L24/02H01L24/03H01L24/11H01L24/97H01L2224/0231H01L2224/02379H01L2224/0401H01L2224/18
Inventor 陶玉娟
Owner NANTONG TONGFU MICROELECTRONICS CO LTD
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