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Packaging structure

A technology of encapsulation structure and contact structure, applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problem that the electromagnetic shielding effect needs to be improved, and achieve the effect of improving the shielding effect and improving the shielding effect.

Active Publication Date: 2019-11-19
NANTONG TONGFU MICROELECTRONICS CO LTD
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AI Technical Summary

Problems solved by technology

[0004] An existing electromagnetic shielding solution is mainly to set a magnetic field shielding layer on the semiconductor packaging structure to shield the electromagnetic interference between chips, but the effect of the existing electromagnetic shielding still needs to be improved

Method used

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Embodiment Construction

[0030] As mentioned in the background, the effect of existing electromagnetic shielding still needs to be improved.

[0031] The study found that the existing magnetic field shielding layer is generally formed by sputtering process. Since the thickness of the semiconductor package structure is generally thick, and the semiconductor package structure is generally rectangular, the semiconductor package structure has multiple corners and the side wall is relatively steep. When the magnetic field shielding layer covering the semiconductor package structure is formed by sputtering, the thickness of the formed magnetic field shielding layer is likely to be uneven, and the edge of the semiconductor package structure may not be covered, thus making it difficult to guarantee the shielding effect of the magnetic field shielding layer.

[0032] Therefore, the present invention provides a packaging structure and a forming method thereof. In the forming method, after the first plastic seali...

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Abstract

The present invention provides a packaging structure. The packaging structure comprises a first shielding layer and a second shielding layer which are positioned between a semiconductor chip and a plastic package layer and between a first plastic package layer and a second plastic package layer; the first shielding layer wraps the non-functional surface and the side wall surface of the semiconductor chip and the side surface of the first plastic package layer, the second shielding layer is positioned between the first shielding layer and the plastic package layer and completely covers the non-functional surface and the side wall of the semiconductor chip and the surface of the first shielding layer on the side surface of the first plastic package layer; the second shielding layer can coverplaces with uneven thickness and poor edge coverage in the first shielding layer, so that the whole shielding layer formed by the first shielding layer and the second shielding layer is complete, andthe shielding effect is improved.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a packaging structure with electromagnetic shielding. Background technique [0002] The rapid development of a new generation of electronic products has promoted the development of integrated circuit packaging in the direction of high density, high frequency, miniaturization, and high integration, and high-frequency chips often generate strong electromagnetic waves, which cause undesirable effects on the inside and outside of the package and the chip. In addition, the density of electronic components is getting higher and higher, and the distance of transmission lines is getting closer and closer, which makes the problem of electromagnetic interference from inside and outside the integrated circuit package more and more serious, and at the same time will reduce the quality and life of integrated circuits. [0003] In electronic equipment and electronic products, electro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/552H01L23/31H01L21/56
CPCH01L23/552H01L23/3107H01L21/561H01L21/568H01L2224/96H01L2924/3025
Inventor 陶玉娟
Owner NANTONG TONGFU MICROELECTRONICS CO LTD
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