Double-wafer integrated silicon-based super-thin micro-hemispherical resonator gyroscope and preparation method thereof

A hemispherical resonant gyroscope, an integrated technology, is used in instruments, microstructure technology, semiconductor devices, etc., and can solve the problems of limiting the production and application of micro-hemispherical resonant gyroscopes, low level of micromachining technology, etc. Low power consumption

Inactive Publication Date: 2013-09-25
SOUTHEAST UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] However, at present, corresponding to the broad development prospects of micro-hemispherical resonant gyroscopes, my country's micro-processing technology is relatively low, and ther...

Method used

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  • Double-wafer integrated silicon-based super-thin micro-hemispherical resonator gyroscope and preparation method thereof
  • Double-wafer integrated silicon-based super-thin micro-hemispherical resonator gyroscope and preparation method thereof
  • Double-wafer integrated silicon-based super-thin micro-hemispherical resonator gyroscope and preparation method thereof

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Experimental program
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Embodiment 1

[0039] Such as Figure 1-3 A double-chip integrated silicon-based ultra-thin micro-hemispheric resonant gyroscope is shown, including a first silicon chip, a second silicon chip, a micro-hemispherical shell, a driving electrode and a detection electrode, and the micro-hemispherical shell is arranged on the first silicon chip and the second silicon chip, the bottom of the micro-hemispherical shell is fixedly connected with the second silicon chip, and the upper edge of the micro-hemispherical shell is in contact with the lower surface of the first silicon chip; the driving electrodes are arranged on the first silicon chip and the second silicon chip. One end of the driving electrode is fixedly connected to the second silicon chip, and the other end is movably connected to the first silicon chip; one end of the detection electrode is fixedly connected to the first silicon chip, and the other end is connected to the micro hemispherical shell. Inner wall articulation.

[0040] ...

Embodiment 2

[0054] Basically the same as embodiment 1, the difference is:

[0055] In step (6) of the processing method of the above-mentioned double-chip integrated silicon-based ultra-thin micro-hemispheric resonant gyroscope, the micro-hemispherical structure is prepared by deposition method, and the structural material deposited on the upper surface is removed by chemical mechanical polishing (CMP), so that the The single crystal silicon is exposed for subsequent release of the spherical shell.

Embodiment 3

[0057] Basically the same as embodiment 1, the difference is:

[0058] In the step (7) of the processing method of the above-mentioned double-chip integrated silicon-based ultra-thin micro-hemispherical resonant gyroscope: use TMAH wet etching to release the spherical shell structure, and then use hydrofluoric acid or BOE to remove the silicon dioxide on the electrode surface so that Expose the polysilicon electrodes.

[0059] Working principle: Each chip of the micro-hemispherical resonant gyroscope is assembled using the flip chip technology (Flip chip, that is, the flip-chip packaging method), and its alignment error can be precisely controlled below 1 micron, and because the driving electrode has been aligned with the micro-hemispheric The shell is integrated on the same silicon wafer, so only one inversion method is needed to assemble the two silicon wafers where the detection electrode and the micro-hemispherical shell are located, and finally perform vacuum packaging. ...

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Abstract

The invention discloses a double-wafer integrated-form silicon-based ultrathin micro-hemispherical resonator gyroscope. The double-wafer integrated-form silicon-based ultrathin micro-hemispherical resonator gyroscope comprises a first silicon wafer, a second silicon wafer, a micro-hemisphere casing, driving electrodes and detecting electrodes. The micro-hemispherical casing is arranged between the first silicon wafer and the second silicon wafer. The casing bottom of the micro-hemispherical casing is fixedly connected with the second silicon wafer, and the upper edge of the micro-hemispherical casing is in contacted with the lower surface of the first silicon wafer. The driving electrodes are arranged on the periphery of the micro-hemispherical casing and between the first silicon wafer and the second silicon wafer. One ends of the driving electrodes are fixedly connected with the second silicon wafer, and the other ends of the driving electrodes are movably connected with the first silicon wafer. One ends of the detecting electrodes are fixedly connected with the first silicon wafer, and the other ends of the detecting electrodes are movably connected with the inner wall of the micro-hemispherical casing. The double-wafer integrated-form silicon-based ultrathin micro-hemispherical resonator gyroscope has the advantages of small volume, light weight, low cost, high reliability, low power consumption, mass production and the like, is expected to be widely used in the fields of aerospace, automobile, medical treatment, photography, electronics consumption and the like, and has very broad application prospects.

Description

technical field [0001] The invention relates to the design field of micro-electromechanical gyroscopes, in particular to a double-chip integrated silicon-based ultra-thin micro-hemisphere resonant gyroscope and a preparation method thereof. Background technique [0002] Since the 1950s, the development of gyroscopes has roughly gone through stages such as liquid floating gyroscopes, power-tuned gyroscopes, ring laser gyroscopes, fiber optic gyroscopes, and vibrating gyroscopes. (micro-electro-mechanical-system, MEMS) gyroscope. Among these gyroscopes with different forms, structures and principles, the vibrating gyroscope based on vibration theory has simple structure, stable performance, high reliability, large bearing capacity, It is characterized by small size and low cost. Its basic principle is to use the Coriolis effect produced by the high-frequency vibration object when it rotates to measure the angular velocity. At present, there are structural forms such as tunin...

Claims

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Application Information

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IPC IPC(8): G01C19/56B81B7/00B81C1/00
Inventor 夏敦柱孔伦虞成胡异炜
Owner SOUTHEAST UNIV
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