98 results about "Expandable microsphere" patented technology

The invention relates to the technical field of polymer microspheres, in particular to a thermal expansion microsphere and a preparation method and application thereof. The thermal expansion microsphere comprises a polymer shell and an inner core coated in the shell, the inner core comprises a foaming agent, and the thermal expansion microsphere is characterized in that the polymer shell is formed by polymerization reaction of a monofunctional monomer and a cross-linking agent under the initiation of an initiator; wherein the difference value between the 10-hour half-life period temperature of the initiator and the peak exothermic temperature of the cross-linking agent is 60-81 DEG C. By controlling the decomposition activity of the initiator and the reaction activity of the cross-linking agent to be matched in a specific temperature difference range, construction of a uniform cross-linked network between shell polymer chain segments is achieved, and the obtained thermal expansion microspheres have a wide expansion temperature range, good heat resistance, stable expansion behavior and high expansion rate.

Methods, kits fand photothermal compositions for removing nail coatings are described. The nail coatings include a thermally responsive material, such as thermally expandable microspheres, and a nail product to be removed (e.g. nail polish, gel, dip, nail art, and / or artificial nail. Optionally, a bottom coating, such as lipoic acid, is in contact with the nail surface. The method includes (ii) applying a removal stimulus to a removal layer containing a photothermal additive to induce heat generation and cause at least partial expansion, shape change, and / or phase change of the thermally responsive material or partial detachment of the nail product. Optionally the method includes applying the photothermal nail composition on top of a nail coating prior to step (ii).

The present invention relates to tannin-based heat-expandable microspheres, and also to a process for their preparation. The heat-expandable microspheres comprise a thermoplastic shell surrounding a hollow core, wherein the hollow core comprises a blowing agent, and the thermoplastic shell comprises tannin.

Intumescent composition comprising an acid donor (A), a carbon donor (B), a binder polymer (C) and a blowing agent (D). The acid donor (A) is selected from the group consisting of ammonium polyphosphate, ammonium dihydrogen phosphate, ethylenediamine phosphate, ammonium pentaborate, guanylurea phosphate, diguanidine phosphate and mixtures thereof. The carbon donor (B) is selected from the group consisting of glucose, arabinose and other monosaccharides, lactose, maltose and other disaccharides, starch, cellulose, dextrin and other polysaccharides, sorbitol, erythritol, pentaerythritol, dipentaerythritol, mannitol and other polyhydric alcohols and mixtures thereof. The blowing agent is provided in the form of microsphere particles comprising a thermoplastic polymer shell encapsulating a propellant, which microsphere particles are expandable microspheres.

The present invention relates to a foamable polymer composition containing a polymer selected from the group consisting of polyolefins (PO),polyolefin elastomers (POE), polyolefin block co-polymers (OBC), ethylene vinyl acetate copolymers (EVA), EVA / PO copolymers, EVA / OBC copolymers, polyvinylchloride (PVC), polymers of styrene, natural and synthetic rubbers, polyamides, polyimides, and combinations thereof, a functionalized particulate bicarbonate, and thermally expandable microspheres, to methods for manufacturing a foamed polymer using such foamable polymer composition, and the use of said foamed polymers.

A coating composition, a preparation method therefor and use thereof are provided. The coating composition includes at least 60% heat-expandable microspheres having a wall thickness of less than or equal to 5 μm, a water-based thermoplastic resin, a water-based thermosetting resin, and a hot-melt filling resin. Thin-shell spheres can be quickly softened and ruptured within a short time in the heat-expansion process, and with the volatilization of an organic solvent, the coating composition cross-links with a resin matrix in the coating to form a cross-linked network structure, thus strengthening the gap support of the coating, and enabling the coating to achieve stepped expansion. After expansion, some polymer materials wrap an airbag and harden to form a stable hollow structure. Therefore, the expanded coating can be used for the fixation of high temperature-resistant parts, and can maintain adhesive stability when placed in a high-temperature environment (140-180° C.) for a long time.

The invention relates to a composition comprising at least one thermoplastic polyamide, wherein the average carbon content of the repeating units of said at least one thermoplastic polyamide is greater than or equal to 7; from 0.1 to 6.0 % by weight of expandable microspheres, based on the total weight of the composition; and optionally at least one additional thermoplastic polymer; wherein the composition has a melt flow index lower than or equal to 150 g / 10 min. The invention also relates to a method for preparing such a composition, to an expanded composition obtainable from such a composition and to a method for producing said expanded composition.

An electronic device manufacturing method comprising: a step for preparing a structure (100) including an adhesive film (10) that is provided with a base material layer (A) and an adhesive resin layer (C), and a workpiece (20) that is temporarily fixed to the adhesive resin layer (C); and a step for processing the workpiece (20) temporarily fixed to the adhesive resin layer (C), wherein the adhesive resin layer (C) includes thermally expandable microspheres, and the sphericity R of the thermally expandable microspheres as calculated by a prescribed formula is 0.93 or more.

To provide alternative thermoplastic expandable microspheres whose thermoplastic polymeric shell is at least partially derived from a sustainable source, a method for preparing the microspheres, and use of the microspheres.SOLUTION: There are provided thermally expandable microspheres comprising a polymeric shell surrounding a hollow core, wherein the hollow core comprises a blowing agent, and the polymeric shell comprises isolated lignin. The isolated lignin preferably comprises Kraft lignin such as acetylated Kraft lignin. A method for preparing thermally expandable microspheres comprising a polymeric shell surrounding a hollow core comprises the steps of (i) preparing a mixture comprising the isolated lignin and the blowing agent in a solvent, and (ii) spray-drying the mixture obtained in step (i) to obtain thermally expandable microspheres.SELECTED DRAWING: Figure 1

The application relates to the field of functional fabric technology and discloses a one-way moisture absorption and sweat releasing double-sided warm-keeping fabric and application thereof. The one-way moisture absorption and sweat releasing double-sided warm-keeping fabric is formed by multi-dimensional weaving of hydrophilic fibers and hydrophobic fibers, the hydrophobic fibers are the inner layer, and the hydrophilic fibers are the surface layer; the hydrophilic fibers are polyester fibers, nylon fibers, spandex or bamboo fibers, and the hydrophobic fibers are heat-sensitive closed-cell foaming fibers. The heat-sensitive closed-cell foaming fibers are prepared by the following method: a glue agent is added into a solvent, dissolved at 70-90 DEG C, and stirred to obtain a resin solution; expandable microspheres, titanium dioxide and silica aerogel are added into the resin solution, and stirred to obtain foaming slurry; the matrix fibers are subjected to surface treatment, then the foaming slurry is coated, and then foaming treatment is carried out to obtain the heat-sensitive closed-cell foaming fibers. The fabric has the one-way moisture absorption and sweat releasing warm-keeping and heat insulation functions through the moisture gradient structure existing in the hydrophilic side and the hydrophobic side, has excellent warm-keeping and heat insulation and air and moisture permeation functions, and can be applied to the field of clothes.

This invention discloses a tearable shielded railway digital signal cable and its manufacturing method. The cable, from the inside out, comprises a cable core, an inner sheath, a shielding layer, and an outer sheath. The shielding layer includes: a functional composite layer, which is an integrated film containing a polyolefin matrix, conductive filler, and adhesive modifier; a structural carrier layer, which is a fiber-reinforced layer with a tensile strength greater than its transverse tensile strength along the cable length; and an outer sheath comprising an adhesive inner layer and a foamed outer layer. The adhesive inner layer contains dispersed thermally expandable microspheres; the structural carrier layer has openings. During the molding process of the outer sheath, the thermally expandable microspheres expand under heat and are squeezed into the openings of the structural carrier layer. After cooling, the adhesive inner layer and the structural carrier layer interlock. The cable of this invention possesses stable shielding layer peel performance, a uniform and lightweight foamed sheath structure, and reliable interlayer bonding, comprehensively improving construction convenience, electromagnetic shielding effectiveness, flexibility, and long-term reliability.

The present application provides a kind of thermal expansion microsphere with core-shell structure and its preparation method, the thermal expansion microsphere includes core and shell layer, the core includes foaming agent, the shell layer includes thermoplastic polymer, and the preparation monomer of the thermoplastic polymer includes conjugated diene monomer;By selecting thermoplastic polymer as the shell layer material of thermal expansion microsphere, and limiting the preparation monomer of the thermoplastic polymer includes conjugated diene monomer, the obtained thermal expansion microsphere with core-shell structure not only has lower initial expansion temperature, higher expansion degree, but also has excellent solvent resistance, and application field is more extensive.

Provided are methods of making a three-dimensional object that include (a) producing an intermediate object from a polymerizable liquid that includes heat expandable microspheres by additive manufacturing; (b) optionally, cleaning the intermediate object; and (c) moisture curing the intermediate object to form the three-dimensional object, said moisture curing performed before or after heating the object for a time and at a temperature sufficient to expand the microspheres. Objects produced by the methods are also provided.

This invention relates to a protective article comprising first and second walls. Each of the walls includes superimposed plies enclosing an expansion space therebetween, and an expandable composite disposed in the expansion space. The expandable composite includes a biodegradable matrix, and a plurality of cellulose-based expandable microspheres. The expandable microspheres are configured to cause the biodegradable matrix to expand upon activation of the expandable microspheres. The invention further relates to an expandable web comprising a first ply, second ply and an expandable composite deposited between the first ply and the second ply. The invention further relates to a method for making an expandable protective article.

An adhesive film (10) comprising a substrate layer (A) and an adhesive resin layer (C), wherein the adhesive resin layer (C) contains thermally expandable microspheres, and the number of pieces of foreign matter observed by a predetermined method is less than 10.

The application belongs to the technical field of clothing and textile, and provides a warm-keeping clothing material and a preparation method thereof, which comprises the following steps: mixing polyimide powder, foaming powder, adhesive, cross-linking agent and solvent to prepare foaming slurry; the foaming powder is thermoplastic expandable microsphere foaming powder; the foaming slurry is applied to one surface of clothing fabric by printing or coating; after high-temperature baking, foaming printed fabric is obtained; the printed and coated surface of the foaming printed fabric is treated by three-dimensional embossing to form a certain depth of concave-convex structure, and the warm-keeping clothing material is obtained. The textile fabric prepared by the application has excellent temperature-locking and warm-keeping performance, thereby significantly improving the warm-keeping experience of the wearer of the clothing.

A method for manufacturing an electronic device, comprising the steps of: preparing a structure (100) including an adhesive film (10) having a base layer (A) and an adhesive resin layer (C), and a workpiece (20) temporarily fixed to the adhesive resin layer (C); and processing the workpiece (20) temporarily fixed to the adhesive resin layer (C), wherein the adhesive resin layer (C) includes thermally expandable microspheres, and the ratio (Ra2 / Ra1) of the arithmetic mean roughness Ra2 of the adhesive film (10) after a predetermined treatment by a predetermined method 2 to the arithmetic mean roughness Ra1 of the adhesive film (10) after a predetermined treatment by a predetermined method 1 is 0.40 or more.

The application relates to the field of flame-retardant technology, and particularly discloses a flame-retardant thermal expansion type foaming microsphere and a preparation method thereof. The thermal expansion type foaming microsphere has a core-shell structure and sequentially comprises a capsule core, an inner layer capsule wall and an outer layer flame-retardant capsule wall from inside to outside. Raw materials of the outer layer flame-retardant capsule wall include a phosphazene flame retardant, cobalt naphthenate and cyclohexanone peroxide. The flame-retardant thermal expansion type foaming microsphere provided by the application is coated with the phosphazene flame retardant which does not contain halogen, and the combination and coating rate of the phosphazene flame retardant and the foaming microsphere are improved through the cobalt naphthenate and the cyclohexanone peroxide, so that the flame-retardant efficiency and the flame-retardant stability of the foaming microsphere are significantly improved. In addition, the cobalt naphthenate and the cyclohexanone peroxide can promote the phosphazene flame retardant to degrade rapidly when a fire occurs, so that a dense carbon layer is rapidly formed on the surface of the foaming microsphere, and good flame-retardant and ablation-resistant effects are achieved. Therefore, the foaming microsphere has good foaming performance and flame-retardant performance, and has a wide application prospect.

Provided is a method for manufacturing an electronic device that includes a step for preparing a structure (100) that includes an adhesive film (10) provided with a substrate layer (A), an adhesive resin layer (B), and an adhesive resin layer (C), a workpiece (20) temporarily fixed to the adhesive resin layer (B), and a support member (30) temporarily fixed to the adhesive resin layer (C), and a step for processing the workpiece (20) temporarily fixed to the adhesive resin layer (B), wherein the substrate layer (A) is positioned between the adhesive resin layer (B) and the adhesive resin layer (C), the adhesive resin layer (C) contains thermally expandable microspheres, and the number of foreign substances of the adhesive film (10) is less than 10, as observed according to a predetermined method.

A method of debonding first and second substrates bonded together by a cured product of a cationically curable composition is disclosed. The composition comprises an epoxy component, expandable microspheres, and a cationic polymerisation initiator, wherein the microspheres contain an expanding agent that expands under heat, thus causing the microspheres to expand. The method comprises heating the cured product to cause thermal expansion of the microspheres, thereby reducing the tensile strength of the bond formed by the cured product by ≥50% and leading to at least partial debonding of the substrates. The microspheres may be 2-80 microns in diameter and may contain silica and a gas, especially an alkane gas like isobutane. The epoxy component may be 2-vinyloxyethylglycidyl ether and the initiator may comprise (4-isopropylphenyl)(4-methylphenyl)iodonium tetrakis(pentafluorophenyl)borate or an ammonium salt of tetrakis(pentafluorophenyl)boric acid. Preferably, the first substrate is an electronic component and the second substrate is a printed circuit board.

The invention discloses modified silica sol capable of being used for thermal expansion microspheres and a preparation method and application of the modified silica sol. A silane coupling agent and an anionic polymer are jointly grafted to silicon dioxide under the alkaline condition, and then the modified silica sol is obtained through acidification. The modified silica sol has the effect of Pickering emulsion, when thermoplastic microspheres are prepared, silicon dioxide particles can be spontaneously dispersed on an oil-water interface, after emulsion polymerization reaction is finished, the silicon dioxide particles are mutually gathered and densely arranged on the shell layers of the microspheres, and the shell layer strength and expansion performance of the microspheres are improved. The thermal expansion microspheres prepared by the method are high in expansion rate and low in deslagging rate, and silicon dioxide particles on the surfaces of the microspheres are dispersed compactly.

This method for producing an electronic device comprises: a step for preparing a structure (100) including a pressure-sensitive adhesive film (10) that has a substrate layer (A) and a pressure-sensitive adhesive resin layer (C) and an object (20) to be processed that has been temporarily fixed to the pressure-sensitive adhesive resin layer (C); and a step for processing the object (20) to be processed that has been temporarily fixed to the pressure-sensitive adhesive resin layer (C). The pressure-sensitive adhesive resin layer (C) contains thermally expandable microspheres. The number of foreign particles observed in the pressure-sensitive adhesive film (10) in accordance with a given method is less than 10.

The invention discloses a transformer insulation structure and a preparation method thereof, and relates to the technical field of transformers, the transformer insulation structure comprises an insulation coating material and an air bag, the insulation coating material comprises at least two layers of polymer films, the edges of the two layers of polymer films are connected with each other to form an annular gap, and the air bag is arranged in the annular gap. The two layers of polymer films are used for wrapping a magnetic core or a transformer coil, an expansion microsphere layer is arranged in an annular gap between the two layers of polymer films, the air bag is used for storing inert gas, the air bag is provided with a communicating pipe, and the communicating pipe is communicated with the annular gap. In the application, when the temperature of the transformer rises, the expansion microsphere layer is expanded, so that the annular gap between the two polymer films is enlarged, inert gas is sucked into the annular gap from the air bag, and the insulation effect of the insulation structure is enhanced.

To provide a composition capable of reducing generation of deposit in the production of a foamed molding employing thermally expandable microspheres and a thermoplastic elastomer.SOLUTION: There is provided a composition comprising the following components (A) to (C): component (A) thermally expandable microspheres; component (B) at least one selected from an olefin-based polymer (b1) having an acid group, a viscosity of 3000 mPa s or less at 200°C as measured at a shear rate of 10(1 / s), and a melting point of 50°C or higher, and a fatty acid (b2) having 20 or more carbon atoms; and component (C) a matrix component comprising a thermoplastic elastomer.SELECTED DRAWING: None

The invention belongs to the technical field of powder coatings, and provides a thermal insulation powder coating and a preparation method thereof, and the thermal insulation powder coating sequentially comprises a thermal insulation layer, a stable layer and a decorative layer from bottom to top; the mass ratio of the thermal insulation layer to the stable layer to the decorative layer is (1-20): (80-96): (75-90); the thickness of the heat preservation powder paint coating ranges from 100 micrometers to 500 micrometers. The thermal insulation powder coating provided by the invention has the following technical advantages: 1, the expandable microspheres are used for the thermosetting powder coating in a multi-layer spraying manner, so that the technical characteristics are obviously different from those of materials such as hollow glass beads and the like; 2, the decorative performance is excellent, the decorative performance of the powder coating can be adjusted by selecting the third decorative layer, and the thermal insulation powder coating with a flat surface is obtained; the heat preservation effect is remarkable, the heat conduction speed is low, and the heat preservation characteristic is excellent.

The invention relates to a composition comprising at least one copolymer comprising polyamide blocks and polyether blocks having a number average molecular weight of from 20 000 to 100 000 g / mol, preferably from 25 000 to 80 000 g / mol and wherein the mass ratio of the polyamide blocks relative to the polyether blocks of the copolymer is more than 1; from 0.1 to 6.0 % by weight of expandable microspheres, based on the total weight of the composition; optionally at least one UV stabilizer and / or UV absorber; and optionally at least one additional thermoplastic polymer. The invention also relates to a method for preparing such a composition, to an expanded composition obtainable from such a composition and to a method for producing said expanded composition.

The application belongs to the technical field of polymer microsphere preparation, and relates to a high-temperature-resistant heat-induced expansion microsphere and a preparation method and application thereof. By using aerogel particles as stabilizers, the aerogel particles are firmly adsorbed on the surface of the heat-induced expansion microsphere, and the high-temperature-resistant heat-induced expansion microsphere is prepared by using the high heat insulation performance of the aerogel particles to improve the temperature resistance of the heat-induced expansion microsphere. The high-temperature-resistant heat-induced expansion microsphere has a hollow structure, a diameter of 5-50 mu m, and a large number of aerogel particles adsorbed on the surface of the microsphere, and the coverage rate is 55-90%. The initial expansion temperature is 210-250 DEG C, and the maximum expansion temperature is 260-290 DEG C, so as to match the current use scene with a higher processing temperature, for example, the resin foaming of polypropylene, polymethyl methacrylate, polybutylene terephthalate, nylon, polycarbonate and other resins with a processing temperature of more than 250 DEG C, so as to prepare lightweight high-performance plastics and help make a new breakthrough in the lightweight of the rubber and plastic industry.

The invention provides boron-free clay stirring equipment which is characterized in that a stirring part is arranged at the end, close to the ground, of a rack, the stirring part is arranged at the bottom of the rack, a feeding end is arranged on the upper portion of the rack, a crushing part is arranged on one side of a feeding port, and the crushing part is arranged in the feeding end and arranged on the lower side of the feeding port; a lower pipe is arranged at one end of the crushing part, boron-free clay is prepared from 8%-12% of polyvinyl alcohol, 6%-10% of chitosan, 1%-10% of citral, 0.5%-6% of modified calcium carbonate, 5%-15% of expandable microspheres, glycerin and water, the materials need to be crushed before being stirred, the microspheres are powdery but need to be stored for a long time, and the possibility of internal condensation can be generated; the situation that part of expanded microspheres are partially solidified due to incomplete separation, congelation blocks exist in subsequent ultra-light clay, and defective products are caused is avoided.

This method for manufacturing an electronic device includes: a step for preparing a structure (100) which comprises an adhesive film (10) that is provided with a base material layer (A), an adhesive resin layer (B), and an adhesive resin layer (C), an object (20) to be processed that is provisionally fixed to the adhesive resin layer (B), and a support member (30) that is provisionally fixed to the adhesive resin layer (C); and a step for processing the object (20) to be processed that is provisionally fixed to the adhesive resin layer (B). The base material layer (A) is positioned between the adhesive resin layer (B) and the adhesive resin layer (C), and the adhesive resin layer (C) includes thermally expandable microspheres that contain a thermosetting resin.

This electronic device manufacturing method includes a step for preparing a structure (100) including an adhesive film (10) provided with a base material layer (A) and an adhesive resin layer (C), and an object to be processed (20) temporarily fixed to the adhesive resin layer (C), and a step for processing the object to be processed (20) temporarily fixed to the adhesive resin layer (C). The adhesive resin layer (C) includes thermally expandable microspheres. The tack force of the adhesive film (10) according to a predetermined measurement method is 5 gf or lower.