High-temperature resisting adhesive and preparation method thereof

A high-temperature-resistant adhesive and formulation technology, applied in the direction of non-polymer adhesive additives, adhesive types, adhesives, etc., can solve problems such as unfavorable marketing

Inactive Publication Date: 2011-10-19
DONGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, the adhesive can only be used in some special fields, which is not conducive to market promotion

Method used

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  • High-temperature resisting adhesive and preparation method thereof
  • High-temperature resisting adhesive and preparation method thereof
  • High-temperature resisting adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0063]33.60 grams (0.1 moles) of 3,5-bis(4-aminophenoxy)benzoic acid, 1.08 grams (0.01 moles) of 1,3-diaminobenzene and 560 milliliters of N-methyl-2-pyrrolidone strongly polar Put the aprotic organic solvent into the reactor, at room temperature, after stirring and dissolving completely, add 34.10 grams (0.11 moles) of 3,3',4,4'-tetracarboxylic diphenyl ether dianhydride aromatic dibasic acid anhydride powder, After stirring and reacting at room temperature for 2-3 hours, a homogeneous transparent viscous resin solution was obtained; 56.10 grams (0.55 moles) of acetic anhydride dehydrating agent and 5.56 grams (0.055 moles) of triethylamine catalyst were added, at 90°C-110°C After 4-5 hours of high-speed stirring reaction within the temperature range, 5600 ml of ethanol precipitant was added to precipitate solid powder, filtered, washed with acetone 2-3 times, and vacuum-dried within the temperature range of 120°C-150°C to obtain 63.52 Gram (theoretical output: 64.82 grams) c...

Embodiment 2

[0070] 3.36 grams (0.01 moles) of 3,5-bis(4-aminophenoxy)benzoic acid, 292 grams (0.1 moles) of 1,3-bis(3-aminophenoxy)benzene, 300 milliliters of N,N- Dimethylformamide and 310 milliliters of N, N-dimethylacetamide strong polar aprotic organic solvent are put into reaction kettle, at room temperature, after stirring and dissolving completely, add 35.42 grams (0.11 moles) 3, 3 ', 4, the aromatic dibasic acid anhydride powder of 4'-tetracarboxylic benzophenone dianhydride, after stirring and reacting at room temperature for 2-3 hours, obtain a homogeneous transparent viscous resin solution; add 112.2 grams (11 moles) of ethyl alcohol Acid anhydride dehydrating agent, 5.56 grams (0.055 moles) of triethylamine and 4.34 grams (0.055 moles) of pyridine catalyst, after 4-5 hours of high-speed stirring reaction in the temperature range of 90°C-110°C, add 2050 milliliters of ethanol and 1000 milliliters of methanol Precipitating agent, precipitated solid powder, filtered, washed 2-3 t...

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Abstract

The invention relates to a high-temperature resisting adhesive and a preparation method thereof; the adhesive is formed by the following ingredients: carboxyl contained polyimide resin powder, epoxide resin, curing agent and organic solvent with weight ratio of 1:10-20:0.1-2:20-30. The preparation method of the high-temperature resisting adhesive comprises the following steps: adding the carboxylcontained polyimide resin powder, the epoxide resin and the curing agent into a reaction kettle, heating the reaction kettle to 80-90 DEG C for carrying out stirring reaction for 0.5-1.5 hours, and then adding the organic solvent continuously, and stirring the mixture uniformly at room temperature, thus obtaining the high-temperature resisting adhesive. The preparation method has simple process and low cost and is environment-friendly, the preparation process can be carried out in a general device, thereby being suitable for industrial production.

Description

technical field [0001] The invention belongs to the technical field of adhesives, in particular to a high-temperature-resistant adhesive and a preparation method thereof. Background technique [0002] With the development of aerospace, electronic and electrical industries, the demand for high temperature resistant adhesives is increasing. The traditional epoxy resin adhesive system has excellent bonding performance, but its heat resistance is far inferior to that of polyimide adhesive, and it is more brittle. Therefore, a lot of research work has been done to improve the heat resistance and toughness of epoxy adhesive systems. [0003] Polyimide resin and polyetherimide resin containing imide ring structure have excellent heat resistance, low temperature resistance, organic solvent resistance, flame retardancy, radiation resistance and excellent mechanical properties and dielectric properties. Electrical properties have been widely used in high-tech fields such as aerospac...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/06C09J179/08C08G73/10
Inventor 虞鑫海陈梅芳
Owner DONGHUA UNIV
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