Epoxy resin composition, metal-based copper-clad plate and manufacturing method thereof

Abstract

The invention discloses an epoxy resin composition, a metal-based copper-clad plate and a manufacturing method thereof. The epoxy resin composition comprises the following components by mass: 90-110 parts of epoxy resin, 10-50 parts of thermoplastic resin, 1-100 parts of a curing agent, 0.05-5 parts of a curing accelerant, 1-10 parts of an additive, 20-500 parts of heat conduction filler and 0-30 parts of an organic solvent. The metal-based copper-clad plate has the characteristic that 1, the heat conductivity is high; 2, the insulation property is high as the puncture-withstand voltage is higher than 6KV; 3, the anti-bending property is high, so that the metal-based copper-clad plate can be used for manufacturing a three-dimensional aluminum substrate; 4, the thickness of the insulation layer is uniform, the coating thickness tolerance can be controlled at + / - 2 microns, and the press-fit thickness tolerance can be controlled at + / - 5 microns, so that the performance of a product can be guaranteed; 5, the production efficiency is high; 6, the cost is low and is about 1 / 4-1 / 3 of the cost of an imported product.

Description

technical field [0001] The invention relates to the technical field of manufacturing metal-based copper-clad laminates, in particular to a halogen-free, flame-retardant and high-thermal conductivity epoxy resin composition, a metal-based copper-clad laminate and a manufacturing method thereof. Background technique [0002] With the rapid development of electronic products in the direction of light, thin, small, high-density, multi-functional, and microelectronic integration technology, the volume of electronic components and logic circuits has been reduced exponentially, while the operating frequency has increased sharply and power consumption has continued to increase. Large, causing the working environment of components to change to high temperature. The heat dissipation requirements of the PCB substrate are becoming more and more urgent. If the heat dissipation of the substrate is not good, it will cause overheating of the components on the printed circuit board, thereby ...

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Problems solved by technology

[0006] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide an epoxy resin composition, a metal-based copper-clad laminate and a manufacturing method thereof, aiming at solving the problem of low reliability, poor stability, and uneven performance of existing metal-based copper-clad laminates. Qi, especially in terms of thermal conductivity, insulation, bending resistance, and uniformity of insulating layer thickness, there are still many deficiencies.

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