Epoxy resin composition, metal-based copper-clad plate and manufacturing method thereof

A technology of epoxy resin and composition, applied in epoxy resin glue, metal layered products, chemical instruments and methods, etc., can solve the problems of uneven performance, low reliability, poor stability, etc., and achieve high production efficiency , low cost, the effect of improving thermal conductivity

Active Publication Date: 2014-04-02
KINWONG ELECTRONICS TECH LONGCHUAN
View PDF13 Cites 139 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide an epoxy resin composition, a metal-based copper-clad laminate and a manufacturing method thereof, aiming at solving the problem of low ...

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Epoxy resin composition, metal-based copper-clad plate and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0059] Weigh 100 parts by mass of epoxy resin (bisphenol A type epoxy resin), 10 parts by mass of thermoplastic resin / rubber (polyphenylene oxide), 20 parts by mass of curing agent (aliphatic polyamine), 2 Parts by mass of curing accelerator (2-methylimidazole), 2 parts by mass of additives (aluminate coupling agent), 30 parts by mass of thermally conductive filler (magnesium oxide), 5 parts by mass of organic solvent (acetone) in In a clean container, stir and disperse at high speed at room temperature for 5 hours to form a liquid glue with uniform particle size and uniform dispersion. Use imported ultra-precision coating equipment to coat the above glue on the rough surface of the copper foil with a coating thickness of 100 μm, and bake it at a temperature of 70-185°C for 10 minutes to form a semi-cured glue-coated copper foil. Then take a piece of the prepared glue-coated copper foil, laminate its glued surface with the metal substrate, heat and press to make a metal-based ...

Embodiment 2

[0061] Weigh 100 parts by mass of epoxy resin (bisphenol F epoxy resin), 25 parts by mass of thermoplastic resin / rubber (polyamide resin), 20 parts by mass of curing agent (alicyclic polyamine), 2 parts by mass Curing accelerator (2-ethyl-4-phenylimidazole), 5 parts by mass of additive (polyurethane), 170 parts by mass of thermally conductive filler (alumina), 15 parts by mass of organic solvent (methanol) in a clean container In the process, stir and disperse at high speed at room temperature for 8 hours to form a liquid glue with uniform particle size and uniform dispersion. Use imported ultra-precision coating equipment to coat the above glue on the rough surface of the copper foil with a coating thickness of 75 μm, and bake it at a temperature of 80-190°C for 2 minutes to form a semi-cured glue-coated copper foil. Then take a piece of the prepared glue-coated copper foil, laminate its glued surface with the metal substrate, heat and press to make a metal-based copper-clad ...

Embodiment 3

[0063] Weigh 100 parts by mass of epoxy resin (biphenyl type epoxy resin), 45 parts by mass of thermoplastic resin / rubber (nitrile rubber), 20 parts by mass of curing agent (diacetone acrylamide), 2 parts by mass of curing agent Accelerator (imidazole), 8 parts by mass of additive (soluble castor oil), 500 parts by mass of thermally conductive filler (aluminum oxide), 30 parts by mass of organic solvent (toluene) in a clean container, high-speed stirring and dispersion at room temperature for 6 After hours, a liquid glue with uniform particle size and uniform dispersion is formed. Use imported ultra-precision coating equipment to coat the above glue on the rough surface of the copper foil with a coating thickness of 150 μm, bake at 75-160°C for 20 minutes to form a semi-cured glue-coated copper foil, and then Take a piece of the prepared glue-coated copper foil, laminate its glued surface with the metal substrate, heat and press to make a metal-based copper-clad laminate with ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses an epoxy resin composition, a metal-based copper-clad plate and a manufacturing method thereof. The epoxy resin composition comprises the following components by mass: 90-110 parts of epoxy resin, 10-50 parts of thermoplastic resin, 1-100 parts of a curing agent, 0.05-5 parts of a curing accelerant, 1-10 parts of an additive, 20-500 parts of heat conduction filler and 0-30 parts of an organic solvent. The metal-based copper-clad plate has the characteristic that 1, the heat conductivity is high; 2, the insulation property is high as the puncture-withstand voltage is higher than 6KV; 3, the anti-bending property is high, so that the metal-based copper-clad plate can be used for manufacturing a three-dimensional aluminum substrate; 4, the thickness of the insulation layer is uniform, the coating thickness tolerance can be controlled at +/- 2 microns, and the press-fit thickness tolerance can be controlled at +/- 5 microns, so that the performance of a product can be guaranteed; 5, the production efficiency is high; 6, the cost is low and is about 1/4-1/3 of the cost of an imported product.

Description

technical field [0001] The invention relates to the technical field of manufacturing metal-based copper-clad laminates, in particular to a halogen-free, flame-retardant and high-thermal conductivity epoxy resin composition, a metal-based copper-clad laminate and a manufacturing method thereof. Background technique [0002] With the rapid development of electronic products in the direction of light, thin, small, high-density, multi-functional, and microelectronic integration technology, the volume of electronic components and logic circuits has been reduced exponentially, while the operating frequency has increased sharply and power consumption has continued to increase. Large, causing the working environment of components to change to high temperature. The heat dissipation requirements of the PCB substrate are becoming more and more urgent. If the heat dissipation of the substrate is not good, it will cause overheating of the components on the printed circuit board, thereby ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): C08L63/02C08L63/00C08L77/00C08L9/02C08L75/04C08G61/10C08K13/02C08K5/20C08K3/22C08K5/3445C08K5/10C09J163/02C09J163/00C09J7/00B32B15/092B32B37/06
Inventor 陈毅龙邹少泉谭小林
Owner KINWONG ELECTRONICS TECH LONGCHUAN
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap