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Adhesive compositions and use thereof

A technology of adhesives and polymers, applied in the direction of adhesives, film/sheet adhesives, non-polymer adhesive additives, etc., can solve the problem of reduced heat resistance of adhesives

Active Publication Date: 2013-07-24
HENKEL KGAA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the disadvantage of this method is that the heat resistance of the adhesive may also be reduced

Method used

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  • Adhesive compositions and use thereof
  • Adhesive compositions and use thereof
  • Adhesive compositions and use thereof

Examples

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Embodiment

[0102] Thermal stress is defined as the temperature at which stress adhesion fails. The following thermal stresses or the ability of hot melts to withstand high temperatures under tearing forces (here also tear thermal stresses) are used in the examples to determine the heat resistance.

[0103] Values ​​for heat resistance were determined as described in US 2009 / 0203847.

[0104] 1. Cut four pieces of cardboard 75mm x 25mm and 75mm x 50mm from corrugated cardboard with grooves parallel to the long sides. Draw a line 22mm from the end on both sides of each board, such as figure 1 shown in .

[0105] 2. Heat approximately 100 g of hot melt in a small metal container at an application temperature of 180°C - 185°C.

[0106] 3. Stir the adhesive with a spatula to ensure even heat distribution; then remove the spatula from the adhesive to create a stream of adhesive in the container. Repeat this method for each sample.

[0107] 4. Pass the 50mm board through the adhesive stre...

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Abstract

The invention provides adhesives comprising at least one polymer component which contains at least 65 weight percent propylene, at least one nucleator and at least one functionalized wax. The inventive adhesives have increased heat resistance and decreased set-time, making them particularly well suited for assembly and packaging applications.

Description

[0001] Cross References to Related Applications [0002] This application claims priority to US Provisional Patent Application Serial No. 61 / 415,501, filed November 19, 2010, the contents of which are incorporated herein by reference. technical field [0003] The present invention relates to adhesives comprising a polymeric component, at least one nucleating agent, and at least one functionalized wax. More specifically, the present invention relates to adhesives with increased heat resistance and reduced cure time, making these adhesives particularly suitable for assembly and packaging applications. Background technique [0004] Adhesives can be applied to substrates and are used in a wide variety of commercial and industrial applications, such as product assembly and packaging. [0005] Hot melt adhesives are widely used in the packaging industry to seal cartons, trays and cartons. Some packaging applications require the adhesive to adhere strongly to the substrate despit...

Claims

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Application Information

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IPC IPC(8): C09J123/10C09J11/00C09J5/00
CPCC09J123/10C09J11/06C09J123/142C08K5/0083C08K5/01C08L23/0869C08L23/0876C08L23/16C08L51/003C08L51/06C09J7/35C09J7/22C09J7/30C09J5/00C09J2301/304
Inventor R·埃利斯C·W·保罗D·卡斯珀P·帕杜尔舍尔A·K·奥戴斯
Owner HENKEL KGAA
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