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Epoxy polyamide adhesive and preparation method thereof

A kind of epoxy polyamide, adhesive technology

Inactive Publication Date: 2015-03-11
山东华亚环保科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage is that the curing speed is slower

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Example 1: The invention provides an epoxy polyamide adhesive, which consists of the following components by weight:

[0037] Epoxy resin E44 22 parts;

[0038] Epoxy resin E51 28 parts;

[0039] 6 parts of stannous chloride;

[0040] 3 parts of stannous octoate;

[0041] 8 parts of propylene oxide phenyl ether;

[0042] 7 parts of diglycidyl ether;

[0043] 5 parts of fumed silica;

[0044] 3 parts aluminum powder;

[0045] 3 parts of polyamide;

[0046] 2 parts of melamine.

[0047] The preparation process of epoxy polyamide adhesive of the present invention is as follows:

[0048] (1) Add epoxy resin, benzoxazine resin, accelerator, filler and diluent to JJ-5 planetary cement mortar mixer in sequence, and stir evenly;

[0049] (2) When using, add the curing agent component and cure for 25 minutes before use.

Embodiment 2

[0050] Example 2: The invention provides an epoxy polyamide adhesive, which consists of the following components by weight:

[0051] Epoxy resin E44 23 parts;

[0052] Epoxy resin E51 29 parts;

[0053] 7 parts of stannous chloride;

[0054] 4 parts of stannous octoate;

[0055] 9 parts of propylene oxide phenyl ether;

[0056] 8 parts of diglycidyl ether;

[0057] 6 parts of fumed silica;

[0058] 4 parts aluminum powder;

[0059] 5 parts of polyamide;

[0060] 3 parts of melamine.

[0061] The preparation process of epoxy polyamide adhesive of the present invention is as follows:

[0062] (1) Add epoxy resin, benzoxazine resin, accelerator, filler and diluent to JJ-5 planetary cement mortar mixer in sequence, and stir evenly;

[0063] (2) When using, add the curing agent component and cure for 30 minutes before use.

Embodiment 3

[0064] Example 3: The invention provides an epoxy polyamide adhesive, which consists of the following components by weight:

[0065] Epoxy resin E44 24 parts;

[0066] Epoxy resin E51 30 parts;

[0067] 8 parts of stannous chloride;

[0068] 5 parts of stannous octoate;

[0069] 12 parts of propylene oxide phenyl ether;

[0070] 11 parts of diglycidyl ether;

[0071] 8 parts of fumed silica;

[0072] 4 parts aluminum powder;

[0073] 6 parts of polyamide;

[0074] 4 parts of melamine.

[0075] The preparation process of epoxy polyamide adhesive of the present invention is as follows:

[0076] (1) Add epoxy resin, benzoxazine resin, accelerator, filler and diluent to JJ-5 planetary cement mortar mixer in sequence, and stir evenly;

[0077](2) When using, add the curing agent component and cure for 35 minutes before use.

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PUM

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Abstract

An epoxy polyamide adhesive and its preparation method belong to the field of adhesives. The epoxy polyamide adhesive is an adhesive prepared by using epoxy resin and polyamide as main materials, has good caking property with materials such as a steel plate, a rubber plate and the like, and can be applied in bonding between a steel plate and a steel plate as well as between a steel plate and a rubber plate. By interaction between an inorganic filling material and organic main materials, adhesive force, strength and toughness of the adhesive are enhanced. The epoxy adhesive prepared by using polyamide as a curing agent has advantages of high peel strength and high strength. By using melamine and polyamide as a composite curing agent, the defect that curing time is long when polyamide is separately used as a curing agent is solved. The epoxy polyamide adhesive has low curing temperature, can be cured at room temperature, and has advantages of simple technology and convenient operation.

Description

technical field [0001] The invention relates to a preparation method of an adhesive, in particular to an epoxy polyamide adhesive and a preparation method thereof. Background technique [0002] Humans have used adhesives for thousands of years. However, epoxy resin adhesives have only been around for 50 years since they appeared around 1950. The in-depth progress of basic research work such as deformation and adhesive failure mechanism has made the performance, variety and application of adhesives develop by leaps and bounds. The continuous emergence of new curing agents and additives has become an important class of adhesives with excellent performance, many varieties and wide adaptability. Due to its high bonding strength and strong versatility, epoxy adhesives were once known as "universal glue" and "super glue". It has been widely used in aviation, aerospace, automobile, machinery, construction, electronics and other industries and daily life. Due to the excellent pe...

Claims

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Application Information

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IPC IPC(8): C09J163/02C09J11/06C09J11/08C09J11/04C08G59/46
Inventor 牟军平朱娜刘晓于春光
Owner 山东华亚环保科技有限公司
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