Preparation method of room temperature cured high temperature tolerant flexible epoxy adhesive

Abstract

The invention discloses a preparation method of room temperature cured high temperature tolerant flexible epoxy adhesive, wherein the adhesive comprises a binding component and a hardening component, wherein the binding component includes flexibilizing constituent, heatproof constituent and plasticity agent, the hardening constituent comprises main hardening agent and hardening accelerating agent. The epoxy adhesive provided by the present invention has good tenacity and high binding strength.

Description

1. Technical field [0001] The invention relates to the technical field of adhesives, and more specifically relates to an epoxy adhesive prepared by mixing and preparing an adhesive component and a curing component when using epoxy resin as a base material and a preparation method thereof. 2. Background technology [0002] Epoxy adhesives with epoxy resin as the main component have high bonding strength and can be used for bonding between metal, ceramic, glass, wood, plastic and other material components. In the prior art, various epoxy adhesives with different properties have been developed according to the different use environments of the bonding parts, which have contributed to social and economic construction. However, the performance of epoxy adhesives in the prior art is not ideal enough, that is, some have good flexibility and high impact strength, but poor temperature resistance, and can only be used in the environment of 100-150 ° C, and cannot be used in the enviro...

AI Technical Summary

Problems solved by technology

However, the performance of epoxy adhesives in the prior art is not ideal enough, that is, some have good flexibility and high impact strength, but poor temperature resistance, and can only be used in the environment of 100-150 ° C, and cannot be used in the environment. Long-term use at high temperatures; on the contrary, some have better high temperature resistance and can be used in high temperature environments, but the flexibility is very poor, and the impact strength at room temperature is less than 20MPa, which cannot meet the strength requirements. The flexibility is ok, but it cannot be cured at room temperature (25±5°C)

Therefore the epoxy adhesive of prior art can't be suitable for carrying out bonding operation at normal temperature, and the environment that service temperature and impact resistance requirements are relatively high, as many civil structures, train rail signal shielding, aerospace vehicle Component bonding in the fields of structure, drilling rig brake pads, etc.