Inorganic adhesive for artificial board and preparation method thereof
A technology of inorganic adhesives and inorganic adhesives, applied in the direction of inorganic adhesives, adhesives, polymer adhesive additives, etc., can solve the problems of low bending strength and impact strength of wood-based panels, and achieve a simple and easy preparation process , a wide range of sources, the effect of high temperature resistance
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Embodiment 1
[0014] First, heat 50 parts by weight of 20wt% aluminum phosphate solution to 30°C, add 5 parts by weight of polyethylene glycol 400 under stirring, stir well, and after aging for 2 hours, add 2 parts by weight of aluminum oxide whiskers , to obtain the inorganic adhesive of the present invention.
Embodiment 2
[0016] First, heat 300 parts by weight of 80 wt% aluminum phosphate solution to 120°C, add 80 parts by weight of polyethylene glycol 400 to it under stirring, stir well, and after aging for 24 hours, add 60 parts by weight of aluminum oxide whiskers , 60 parts by weight of magnesium oxide to obtain the inorganic adhesive of the present invention.
Embodiment 3
[0018] First, heat 100 parts by weight of 60wt% aluminum phosphate solution to 100°C, add 20 parts by weight of polyethylene glycol 400 to it under stirring, stir well, and after aging for 12 hours, add 30 parts by weight of aluminum oxide whiskers , 15 parts by weight of magnesium oxide to obtain the inorganic adhesive of the present invention.
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