Inorganic adhesive for artificial board and preparation method thereof

A technology of inorganic adhesives and inorganic adhesives, applied in the direction of inorganic adhesives, adhesives, polymer adhesive additives, etc., can solve the problems of low bending strength and impact strength of wood-based panels, and achieve a simple and easy preparation process , a wide range of sources, the effect of high temperature resistance

Inactive Publication Date: 2010-06-09
北京加林生物科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patented technology provides an improved type of material that makes building products stronger without containing harmful chemicals or other substances like formalin during their formation. It also improves fireproof properties when used inside buildings while maintaining its integrity over time.

Problems solved by technology

This patents discusses various methods for improving the quality of wooden panels without relying heavily upon harmful sources like fossil fuels which can cause health hazards when released indoors due to concerns related to airborne particulate emissions caused by these combustion processes. To address this problem, researchers developed new techniques involving alternative chemistry solutions called acids instead of formaldehydrates. Acidified amino acid compounds were found effective at reducing formaldeylenediaminetriene (FID), while others showed promising results towards enhancing mechanical property values including flexural rigidity, tensile force, thermal stability, and humiliation duration compared to traditional formaldechymoldglutanous adhesants.

Method used

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Examples

Experimental program
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Embodiment 1

[0014] First, heat 50 parts by weight of 20wt% aluminum phosphate solution to 30°C, add 5 parts by weight of polyethylene glycol 400 under stirring, stir well, and after aging for 2 hours, add 2 parts by weight of aluminum oxide whiskers , to obtain the inorganic adhesive of the present invention.

Embodiment 2

[0016] First, heat 300 parts by weight of 80 wt% aluminum phosphate solution to 120°C, add 80 parts by weight of polyethylene glycol 400 to it under stirring, stir well, and after aging for 24 hours, add 60 parts by weight of aluminum oxide whiskers , 60 parts by weight of magnesium oxide to obtain the inorganic adhesive of the present invention.

Embodiment 3

[0018] First, heat 100 parts by weight of 60wt% aluminum phosphate solution to 100°C, add 20 parts by weight of polyethylene glycol 400 to it under stirring, stir well, and after aging for 12 hours, add 30 parts by weight of aluminum oxide whiskers , 15 parts by weight of magnesium oxide to obtain the inorganic adhesive of the present invention.

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PUM

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Abstract

The invention discloses an inorganic adhesive for an artificial board, containing the following raw materials: 50 to 300 parts of inorganic solutions with the weight percentage content of 20 to 80 wt%, 5 to 80 parts of organic assistants, 2 to 60 parts of solidified toughening agent and 0 to 60 parts of inorganic solidifying agents. The inorganic adhesive for the artificial board in the invention has the advantages of extensive sources of the raw materials, no toxin or harm, and environmental protection, and the artificial board prepared from the inorganic adhesive has no release of free formaldehyde. The invention also discloses a method for preparing the inorganic adhesive, comprising the following steps of: firstly heating 50 to 300 parts of 20 to 80 wt% inorganic solutions to 30 to 120 DEG C, adding 5 to 80 parts of organic assistants in the inorganic solutions by stirring, fully and uniformly stirring, and then adding 2 to 60 parts of solidified toughening agent and 0 to 60 parts of inorganic solidifying agents after ageing for 2 to 24 h. The preparation technology of the inorganic adhesive for the artificial board is simple and easy to implement and is suitable for industrial production.

Description

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Claims

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Application Information

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Owner 北京加林生物科技有限公司
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