Adhesive layer composition for in-mold decoration
Patent Information
- Authority / Receiving Office
- US · United States
- Current Assignee / Owner
- WANG XIAOJIA
- Publication Date
- 2006-01-26
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
[0001] This application claims the priorities under 35 USC 119(e) of U.S. Provisional Application No. 60 / 589,708 filed on Jul. 20, 2004. The whole content of the priority application is incorporated herein by reference in its entirety.FIELD OF THE INVENTION
[0002] This invention relates to compositions suitable for the formation of an adhesive layer used for in-mold decoration. BACKGROUND OF THE INVENTION
[0003] In-mold decoration processes involve decorating objects as they are formed, in mold, of a heated plastic material being injected into a mold cavity. Usually a tape or strip of a decorating or protective material is automatically or manually advanced, pre-fed and positioned in the mold cavity at each molding cycle, interfacing therein with the plastic material as it is filled into the mold cavity, under heat and pressure. As the object is formed, the decorating material forms on the surface of the object and becomes an integral and permanent part of the object, through therma...