38results about How to "Reduce polishing rate" patented technology

A chemical mechanical polishing apparatus includes: a polishing disk for holding a polishing pad; a carrier for holding a substrate against the polishing surface of the polishing pad during a polishing process; a polishing liquid distributor having a polishing liquid port positioned above the polishing disk to deliver polishing liquid onto the polishing pad; a temperature control system includes: a coolant fluid reservoir for containing a coolant fluid; a thermal controller configured to control a temperature of the coolant fluid within the coolant fluid reservoir; and a first dispenser having an opening in fluid connection with the coolant fluid reservoir, the opening positioned to be configured to spray atomized coolant directly onto the polishing pad; and a second distributor having a coolant port in fluid connection with the coolant fluid reservoir, the coolant port positioned above the polishing disk and configured to flow a flow of coolant directly onto the polishing pad.