Aluminum oxide particle and polishing composition containing the same

A technology of alumina particles and polishing compositions, which is applied in the field of polishing compositions, and can solve the problems of reduced substrate polishing rate, difficulty in removing alumina particles, and decreased ease of use

Active Publication Date: 2011-06-22
FUJIMI INCORPORATED
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, even in the case of a polishing composition containing alumina particles, the polishing rate of a substrate polished using the polishing composition generally decreases as the particle size of the alumina particles decreases
In addition, as the particle size of the alumina particles decreases, it becomes difficult to remove the alumina particles adhering to the surface of the substrate after polishing by washing (that is, the ease of washing off the alumina particles decreases)

Method used

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  • Aluminum oxide particle and polishing composition containing the same
  • Aluminum oxide particle and polishing composition containing the same
  • Aluminum oxide particle and polishing composition containing the same

Examples

Experimental program
Comparison scheme
Effect test

example 1 to 17 and comparative example 1 to 6

[0056] In Examples 1 to 17 and Comparative Examples 1 to 5, aluminum compound particles represented by "A" to "P" in Table 1 were mixed with water and aluminum nitrate nonahydrate or aluminum chloride hexahydrate (polishing accelerator), Tetrasodium glutamic acid diacetate (cleaning accelerator) and hydrogen peroxide (oxidizing agent) were mixed to prepare a polishing composition. In Comparative Example 6, aluminum nitrate nonahydrate, tetrasodium glutamate diacetate, and hydrogen peroxide were mixed with water to prepare a polishing composition. The types and contents of aluminum compound particles contained in the polishing compositions of Examples and Comparative Examples and the types and contents of polishing accelerators are shown in Table 2 under the titles "Types of Aluminum Compound Particles", "Content of Aluminum Compound Particles" and "Aluminum Compound Particles". content", "type of polishing accelerator", and "content of polishing accelerator". In addition, in ...

example 21 to 24 and comparative example 21 and 22

[0070] A polishing composition was prepared by mixing any aluminum compound particles represented by "A", "B", "D", "Q", "S", and "T" in Table 1 with water. Table 4 shows the types and contents of aluminum compound particles contained in the polishing compositions of Examples and Comparative Examples and the pH values ​​of the polishing compositions of Examples and Comparative Examples.

[0071] The surface of the acrylic resin substrate for the display panel was polished under the conditions shown in Table 5 using the polishing composition of each example and comparative example. The polishing rate was determined based on the difference in substrate weight before and after polishing. The results are shown in Table 4 in the column entitled "Polishing Rate".

[0072] The substrates polished with the polishing compositions of the respective examples and comparative examples were washed with pure water. Subsequently, the arithmetic mean roughness Ra of the surface of the substr...

example 31 and 32 and comparative example 31

[0080] The aluminum compound particles represented by "A" and "R" in Table 1 were mixed with water and hydrochloric acid (polishing accelerator), potassium chloride (polishing accelerator), and hydrogen peroxide (oxidizing agent) to prepare a polishing composition things. Table 6 shows the types and contents of the aluminum compound particles contained in the polishing compositions of the respective examples and comparative examples, and the pH values ​​of the polishing compositions of the respective examples and comparative examples. In addition, for each polishing composition, the hydrochloric acid content, potassium chloride content, and hydrogen peroxide content in the polishing compositions of the respective examples and comparative examples were 1.2 g / L, 18.8 g / L, and 34.2 g / L, respectively.

[0081] Using the polishing composition of each example and comparative example, the surface of the semiconductor device substrate dotted with pads composed of palladium having a si...

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Abstract

Disclosed are aluminum oxide particles wherein primary particles have a hexahedral shape and an aspect ratio of 1-5. The average primary particle diameter of the aluminum oxide particles is preferably 0.01-0.6 [mu]m. The a-particle ratio in the aluminum oxide particles is preferably 5-70%. The average secondary particle diameter of the aluminum oxide particles is preferably 0.01-2 [mu]m, and the value obtained by dividing the 90% particle diameter of the aluminum oxide particles by the 10% particle diameter is preferably 3 or less. The aluminum oxide particles are used as abrasive grains for polishing semiconductor device substrates, hard disk substrates or display substrates.

Description

technical field [0001] The present invention relates to alumina particles consisting of aluminum oxides, including alumina (such as alpha-alumina and transition alumina) and hydrated alumina ( such as boehmite). Background technique [0002] Alumina particles are useful, for example, as abrasive grains for polishing substrates for electronic components such as semiconductor device substrates, display substrates, hard disk substrates, and sapphire substrates for light-emitting diodes. Since these substrates are required to have high smoothness and low defects, the alumina particles used should have a relatively small particle diameter (for example, see Patent Documents 1 and 2). In general, polishing compositions containing alumina particles as loose abrasive particles have higher substrate polishing rates (removal rates) than polishing compositions containing colloidal silica as loose abrasive particles. However, even in the case of a polishing composition containing alumi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/00C09K3/14H01L21/304C01F7/02C01F7/441
CPCC01F7/02C01P2004/54C01P2004/52C01P2004/03C01P2004/39C01F7/441C01P2004/61C01P2004/45C01P2004/38C01P2004/62B24D3/00C09K3/1409Y10T428/2982C09K3/14B24B37/20H01L21/304
Inventor 森永均田原宗明松波靖
Owner FUJIMI INCORPORATED
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