179results about How to "Material removal" patented technology

A method of etching exposed silicon-and-nitrogen-containing material on patterned heterogeneous structures is described and includes a remote plasma etch formed from a fluorine-containing precursor and an oxygen-containing precursor. Plasma effluents from the remote plasma are flowed into a substrate processing region where the plasma effluents react with the exposed regions of silicon-and-nitrogen-containing material. The plasmas effluents react with the patterned heterogeneous structures to selectively remove silicon-and-nitrogen-containing material from the exposed silicon-and-nitrogen-containing material regions while very slowly removing other exposed materials. The silicon-and-nitrogen-containing material selectivity results partly from the presence of an ion suppression element positioned between the remote plasma and the substrate processing region. The ion suppression element reduces or substantially eliminates the number of ionically-charged species that reach the substrate. The methods may be used to selectively remove silicon-and-nitrogen-containing material at more than twenty times the rate of silicon oxide.

Methods are described herein for selectively etching titanium nitride relative to dielectric films, which may include, for example, alternative metals and metal oxides lacking in titanium and/or silicon-containing films (e.g. silicon oxide, silicon carbon nitride and low-K dielectric films). The methods include a remote plasma etch formed from a chlorine-containing precursor. Plasma effluents from the remote plasma are flowed into a substrate processing region where the plasma effluents react with the titanium nitride. The plasma effluents react with exposed surfaces and selectively remove titanium nitride while very slowly removing the other exposed materials. The substrate processing region may also contain a plasma to facilitate breaking through any titanium oxide layer present on the titanium nitride. The plasma in the substrate processing region may be gently biased relative to the substrate to enhance removal rate of the titanium oxide layer.

A laser-based system for processing target material within a microscopic region without causing undesirable changes in electrical or physical characteristics of at least one material surrounding the target material, the system includes a seed laser, an optical amplifier, and a beam delivery system. The seed laser for generating a sequence of laser pulses having a first pre-determined wavelength. The optical amplifier for amplifying at least a portion of the sequence of pulses to obtain an amplified sequence of output pulses. The beam delivery system for delivering and focusing at least one pulse of the amplified sequence of pulses onto the target material. The at least one output pulse having a pulse duration in the range of about 10 picoseconds to less than 1 nanosecond. The pulse duration being within a thermal processing range. The at least one focused output pulse having sufficient power density at a location within the target material to reduce the reflectivity of the target material and efficiently couple the focused output into the target material to remove the target material.

A structure and method for polishing a device include oscillating a carrier over an abrasive surface (the carrier bringing a polished surface of the device into contact with the abrasive surface, the oscillating allowing a portion of the polished surface to periodically oscillate off the abrasive surface), optically determining a reflective measure of a plurality of locations of the polished surface as the portion of the device oscillates off the abrasive surface and calculating depths of the locations of the polished surface based of the reflective measure.

An improved method for determining endpoint of a time division multiplexed process by monitoring an identified region of a spectral emission of the process at a characteristic process frequency. The region is identified based upon the expected emission spectra of materials used during the time division multiplexed process. The characteristic process frequency is determined based upon the duration of the steps in the time division multiplexed process. Changes in the magnitude of the monitored spectra indicate the endpoint of processes in the time division multiplexed process and transitions between layers of materials.

Local plasma density, e.g., the plasma density in the vicinity of the substrate, is increased by providing an ion extractor configured to transfer ions and electrons from a first region of magnetically confined plasma (typically a region of higher density plasma) to a second region of plasma (typically a region of lower density plasma). The second region of plasma is preferably also magnetically shaped or confined and resides between the first region of plasma and the substrate. A positively biased conductive member positioned proximate the second region of plasma serves as an ion extractor. A positive bias of about 50-300 V is applied to the ion extractor causing electrons and subsequently ions to be transferred from the first region of plasma to the vicinity of the substrate, thereby forming higher density plasma. Provided methods and apparatus are used for deposition and resputtering.

Embodiments of the invention provide a method and an apparatus for in situ chuck cleaning, which advantageously reduces downtime to restore flatness. In one embodiment, a method of cleaning a chuck in situ comprises providing a cleaning layer on a substrate, the cleaning layer comprising a deformable material; positioning the substrate to place the cleaning layer in contact with a chuck surface of the chuck in situ, the chuck surface having thereon a material to be removed from the chuck surface; pressing the cleaning layer against the chuck surface with a sufficient pressure to allow the material on the chuck surface to be attached to the cleaning layer; and removing the substrate with the cleaning layer and the material attached thereto from the chuck.

The present invention is directed to a rotary mining apparatus. The apparatus includes an elongated housing with a leading end and an opposite trailing end. The apparatus also includes a compression device coupled to the housing. The apparatus further includes a plurality of cables extending along the housing. Each of the cables has an end connected to the compression device. The apparatus also includes a plurality of cutting devices attached to the cables at ends of the cables opposite the ends connected to the compression device. The present invention is also directed to a method of removing subterranean material. The method includes the step of inserting a rotary mining device having radially extendable cutting devices into a subterranean shaft. The method also includes the steps of rotating the mining device such that the cutting devices contact the sides of the shaft and extending the cutting devices into the sides of the shaft.

A chemical mechanical planarization solution is useful for removing tantalum barrier materials. The solution includes by weight percent 0 to 25 oxidizer, 0 to 15 inhibitor for a nonferrous metal and 0 to 20 complexing agent for the nonferrous metal, 0.01 to 12 tantalum removal agent selected from the group consisting of formamidine, formamidine salts, formamidine derivatives, guanidine derivatives, guanidine salts and mixtures thereof, 0 to 5 abrasive, 0 to 15 total particles selected from the group consisting of polymeric particles and polymer-coated coated particles and balance water. The solution has a tantalum nitride to TEOS selectivity of at least 3 to 1 as measured with a microporous polyurethane polishing pad pressure measure normal to a wafer less than 20.7 kPa.

The present invention is made to provide a carbon catalyst capable of preventing the coarsening of particles of nanoshell structure of carbon which causes reduction in activity for oxygen reduction reaction. The carbon catalyst is produced by the steps of: preparing a carbon precursor polymer; mixing a transition metal or a compound of the transition metal into the carbon precursor polymer; spinning the mixture of the carbon precursor polymer and the transition metal or the compound of the transition metal into fibers; and carbonizing the fibers.

A cluster mill blank includes a framework constructed to cooperate with a blank holder of an existing CAD/CAM system, and a plurality of sub-blanks attached to the framework forming an addressable matrix or cluster blank. CAD/CAM systems including such a framework, as well as associated methods are described.

A sunroof assembly with a composite water management assembly having side rails with a water trough connected at one end to end caps and to a pair of corners at the other, which connect to a front rail at substantially right angles to the side rails. This composite assembly can be connected by vibration welding. A reinforcement bar can be connected at substantially right angles to the rearward end of vertically oriented slide tracks snap fitted into substantially the length of the side rails. A pair of mirror slide mechanisms with vertically oriented mounts are retained, but free to slide, within a channel of the slide track and outboard of the water trough. A movable panel such as a glass sunroof are attached to the slide mechanism. A sunshade can be added that also combines water shedding ribs to channel water to the water trough.

A multi-purpose cutting device for removing the spinal cord and spinal meninx lining of the spinal cord of a slaughtered animal which has been longitudinally cut in two along the length of the spinal cord. The cutting device comprises a rotary cutting tool having a hub with radially outwardly projecting cutting fingers equidistantly spaced apart around the hub. The cutting fingers have blunt ends and are of substantially uniform length. A pair of circular saw blades are rigidly secured to opposite faces of the cutting tool. The saw blades have a circumference that approximately matches the effective circumference of the working ends of the cutting fingers. In use, when the cutting device is powered by a drive motor, the cutting fingers and saw blades rotate in unison. The cutting fingers rotate to remove the spinal cord and spinal meninx from the carcass while the saw blades cut into bone along opposite sides of the meninx. The saw blades assist the cutting fingers in dislodging regions of bone material in which the spinal cord or meninx materials may be lodged.