Cooling liquid for diamond wire cutting technology

A technology of diamond wire and coolant, which is applied in the field of coolant, can solve problems such as the difficulty in satisfying the lubricity of cutting fluid, and achieve the effects of improving the surface quality and yield of slices, easy cleaning, and excellent lubrication

Active Publication Date: 2013-07-03
LIAONING OXIRANCHEM INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the lubricity of the cutting fluid is difficult to meet the requirements of practical use

Method used

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  • Cooling liquid for diamond wire cutting technology
  • Cooling liquid for diamond wire cutting technology
  • Cooling liquid for diamond wire cutting technology

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0067] Prepare 1000g of cooling liquid, take polyoxyethylene polyoxypropylene butanol ether (number average molecular weight 600) 400g, sulfonated oil 100g, nonylphenol polyoxyethylene ether (NP10) 50g, sodium dodecylsulfonate 50g, acrylic acid - 100 g of maleic acid copolymer (weight average molecular weight: 10,000), 50 g of barium petroleum sulfonate, 25 g of potassium sorbate, and 225 g of water.

[0068] Slowly add the above amounts of polyoxyethylene polyoxypropylene butanol ether, sulfonated oil, nonylphenol polyoxyethylene ether, sodium dodecylsulfonate, acrylic acid-maleic acid copolymer in the water under continuous stirring , barium petroleum sulfonate, and potassium sorbate, and stirred for 30 minutes to obtain diamond wire coolant A. For its performance index, see Tables 1-3 below.

Embodiment 2

[0070] Prepare 1000g cooling liquid, get polyethylene glycol (number average molecular weight 2000) 200g, sodium silicate 80g, cetyltrimethylammonium chloride 30g, sodium molybdate 10g, sodium benzoate 50g, water 630g.

[0071] Slowly add polyethylene glycol, sodium silicate, sodium molybdate, cetyltrimethylammonium chloride, and sodium benzoate in the above-mentioned quantities into water under continuous stirring, and stir for 30 minutes to obtain diamond wire cooling solution B . For its performance index, see Tables 1-3 below.

Embodiment 3

[0073] To prepare 1000g of cooling liquid, take octyldiamine polyoxyethylene ether (number average molecular weight 1000) 300g, isooctyl oleate 100g, octylphenol polyoxyethylene ether (OP10) 100g, polyacrylamide 80g, triethanolamine 30g, water 390g.

[0074] Slowly add the above-mentioned amount of octyldiamine polyoxyethylene ether, isooctyl oleate, octylphenol polyoxyethylene ether, polyacrylamide, and triethanolamine to the water under continuous stirring, and stir for 30 minutes to obtain diamond wire cooling. Liquid C. For its performance index, see Tables 1-3 below.

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Abstract

The invention relates to cooling liquid for diamond wire cutting technology, which mainly comprises a lubricant, an emulsifier, an antirust agent, a dispersant, a preservative, and deionized water, wherein the mass percents of the components are 5-50% of the lubricant, 0.05-10% of the emulsifier, 0.1-5% of the antirust agent, 0-10% of the dispersant, 0-5% of the preservative, and the balance being deionized water. The cooling liquid has excellent lubricity and dispersibility, is easy to clean, suitable for cutting of hard and brittle materials such as crystal silicon, sapphire, and the like, can not only meet requirements for diamond wire high-speed cutting, but also realize good surface finish of cut pieces, and can significantly increase product qualified rates.

Description

technical field [0001] The present invention relates to a cooling liquid, more specifically, the present invention relates to a cutting liquid for cutting hard and brittle material sheets, cubes and blocks, especially for diamond wire cutting, more specifically, a cooling liquid for diamond wire cutting. Background technique [0002] At present, the multi-wire cutting technology of free abrasives commonly used by hard and brittle material slicing manufacturers can obtain good slicing quality, but because the steel wire drives the mortar to complete the cutting process in the cutting process, many energy transmission steps cause a lot of loss. Therefore, cutting less efficient. The diamond wire cutting technology that has emerged in recent years uses various methods to directly fix the diamond on the surface of the saw wire, so that the energy transmission is reduced to two steps, which improves the cutting efficiency, and because the mortar used for free abrasives is not use...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C10M173/02B28D7/02
Inventor 朱建民刘兆斌董振鹏仲崇刚周立明刘炳柱
Owner LIAONING OXIRANCHEM INC
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