Cooling liquid for diamond wire cutting technology

Abstract

The invention relates to cooling liquid for diamond wire cutting technology, which mainly comprises a lubricant, an emulsifier, an antirust agent, a dispersant, a preservative, and deionized water, wherein the mass percents of the components are 5-50% of the lubricant, 0.05-10% of the emulsifier, 0.1-5% of the antirust agent, 0-10% of the dispersant, 0-5% of the preservative, and the balance being deionized water. The cooling liquid has excellent lubricity and dispersibility, is easy to clean, suitable for cutting of hard and brittle materials such as crystal silicon, sapphire, and the like, can not only meet requirements for diamond wire high-speed cutting, but also realize good surface finish of cut pieces, and can significantly increase product qualified rates.

Description

technical field

[0001] The present invention relates to a cooling liquid, more specifically, the present invention relates to a cutting liquid for cutting hard and brittle material sheets, cubes and blocks, especially for diamond wire cutting, more specifically, a cooling liquid for diamond wire cutting. Background technique

[0002] At present, the multi-wire cutting technology of free abrasives commonly used by hard and brittle material slicing manufacturers can obtain good slicing quality, but because the steel wire drives the mortar to complete the cutting process in the cutting process, many energy transmission steps cause a lot of loss. Therefore, cutting less efficient. The diamond wire cutting technology that has emerged in recent years uses various methods to directly fix the diamond on the surface of the saw wire, so that the energy transmission is reduced to two steps, which improves the cutting efficiency, and because the mortar used for free abrasives is not use...

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