Single crystal silicon rod cutting-off machine and single crystal silicon rod cutting-off method

Abstract

The invention discloses a single crystal silicon rod cutting-off machine and a single crystal silicon rod cutting-off method. The single crystal silicon rod cutting-off machine comprises a machine base, a material conveying table arranged on the machine base and used for bearing single crystal silicon rods to be cut and driving the single crystal silicon rods to be conveyed in the axial directions of the single crystal silicon rods, and a multi-wire cutting device comprises a machine frame arranged on the machine base and multiple wire cutting units arranged on the machine frame and arranged above the material conveying table through a lifting mechanism in a liftable mode. The multiple wire cutting units synchronously descend to the material conveying table under the control of the lifting mechanism and meanwhile cut the single crystal silicon rods into multiple single crystal silicon sections, and then the multiple single crystal silicon sections formed after cutting are sequentially discharged through the material conveying table. The single crystal silicon rod cutting-off machine can synchronously cut the single crystal silicon rods to be cut into the multiple single crystal silicon sections through the multi-wire cutting device, is high in cutting speed, moves the single crystal silicon sections formed through cutting from the material conveying table to a material receiving table in a sectioned mode for sequential discharge and ensures that the single crystal silicon sections do not bump.

Description

technical field [0001] The invention relates to a multi-wire cutting technology, in particular to a single crystal silicon rod cutting machine and a single crystal silicon rod cutting method. Background technique [0002] Wire cutting technology is a relatively advanced square extraction processing technology in the world at present. Its principle is to rub the workpiece (such as silicon rod, sapphire, or other semiconductor hard and brittle materials) through high-speed moving diamond wire to cut out a square ingot. , so as to achieve the purpose of cutting. During the cutting process of the workpiece, the diamond wire is guided by the guide wheel to form a wire net on the main wire roller, and the workpiece to be processed is fed by the rise and fall of the worktable. Under the action of the pressure pump, the assembly The cooling water automatic spraying device on the equipment sprays the cooling water to the cutting part of the diamond wire and the workpiece, and the re...

AI Technical Summary

Problems solved by technology

[0003] However, there are still deficiencies in the current monocrystalline silicon rod cutting machine. For example, the current single crystal silicon rod cutting machine can only cut one object to be cut at a time. If it is necessary to process multiple workpieces, it can only be performed repeatedly, and the efficiency is very low.

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