Binding head assembly, eutectic equipment and chip mounting method

Abstract

The invention relates to the technical field of eutectic, in particular to a binding head assembly, eutectic equipment and a chip mounting method.The binding head assembly comprises a driving assembly, a suction nozzle assembly and a visual assembly, and the suction nozzle assembly is arranged at the output end of the driving assembly and comprises a suction nozzle base, a suction nozzle, a first transparent part and a second transparent part; a through hole is formed in the suction nozzle seat, and the visual assembly is aligned with the through hole; the suction nozzle is arranged at one end of the through hole, and the first transparent part is arranged at the other end of the through hole and seals a port of the through hole; a penetrating adsorption channel is formed in the suction nozzle and communicated with the through hole, and an air path connecting hole is formed in the inner wall of the through hole; the suction nozzle is further provided with a perspective observation window, the observation window and the adsorption channel are arranged in a spaced mode, projection is conducted in the axial direction of the through hole, and the projection of the observation window is located in the projection of the through hole. The binding head assembly provided by the invention can be used for carrying out high-precision positioning on a plurality of chips in the eutectic mounting process.

Description

Technical Field

[0001] The present invention relates to the field of eutectic technology, and in particular to a header binding component, a eutectic device and a chip mounting method. Background Art

[0002] When performing placement, existing eutectic equipment usually only calibrates the current chip, which results in poor position and angle accuracy between chips when multiple chips need to be placed on the same substrate. Summary of the invention

[0003] In order to solve the problem that the position and angle accuracy between chips are poor when the existing eutectic equipment mounts multiple chips on the same substrate, the present invention provides a head binding assembly, a eutectic equipment and a chip mounting method.

[0004] In order to solve the above-mentioned technical problems, the present invention provides the following technical solutions: a head binding assembly, the head binding assembly includes a driving assembly, a nozzle assembly and a visual assembly, the nozzle assembly is arranged at the output end of the driving assembly, the nozzle assembly includes a nozzle seat, a nozzle, a first transparent part and a second transparent part, the nozzle seat is provided with a through hole, and the visual assembly is aligned with the through hole; the nozzle is provided at one end of the through hole, the first transparent part is provided at the other end of the through hole and closes the port of the through hole; the nozzle is provided with a through adsorption channel, the adsorption channel is connected to the through hole, and an air path connecting hole is provided on the inner wall of the through hole; the nozzle is also provided with a transparent observation window, the observation window is spaced apart from the adsorption channel, and is projected along the axial direction of the through hole, and the projection of the observation window is located within the projection of the through hole.

[0005] Preferably, the observation window comprises an observation hole and a second transparent member closing the observation hole.

[0006] Preferably, the driving assembly includes a hollow motor, the suction nozzle assembly is arranged at the output end of the hollow motor, the hollow motor is provided with a penetrating hollow channel, and the hollow channel is aligned with the through hole; when projected along the axial direction of the through hole, the projection of the through hole is located within the projection of the hollow channel, or the projection of the through hole overlaps with the projection of the hollow channel.

[0007] Preferably, an installation groove is provided at one end of the nozzle holder away from the nozzle and corresponds to the through hole, and the first transparent member is arranged in the installation groove.

[0008] Preferably, a accommodating space is provided between the suction nozzle and the suction nozzle seat, and the second transparent member is provided in the accommodating space; the second transparent member is arranged to avoid the adsorption channel, or a avoiding hole is provided on the second transparent member corresponding to the adsorption channel.

[0009] In order to solve the above-mentioned technical problems, the present invention provides another technical solution as follows: a eutectic device, comprising a main body and a head binding assembly as described above which is movably arranged on the main body; the eutectic device also comprises a transfer table arranged on the main body, the transfer table is provided with at least two vacuum suction holes, and the interval between adjacent vacuum suction holes on the transfer table corresponds to the interval between the observation window and the adsorption channel.

[0010] Preferably, the eutectic equipment further comprises a eutectic table, a eutectic region is arranged on the eutectic table, and at least one vacuum suction hole is arranged on the eutectic region; a heating module is also arranged on the eutectic table for heating the eutectic region.

[0011] Preferably, the eutectic device further comprises an elastic limiting component, on which at least two elastic pressing blocks are provided, and a distance between two adjacent elastic pressing blocks matches a distance between two adjacent eutectic positions.

[0012] Preferably, the elastic limiting assembly also includes a pressure block seat and a cover plate, the pressure block seat is provided with installation channels matching the number of elastic pressure blocks, the cover plate is covered on the pressure block seat to close the installation channels, the elastic pressure block includes a connected elastic member and a pressure block, one end of the elastic member away from the pressure block is connected to the cover plate, and the pressure block is exposed after passing through the installation channel.

[0013] In order to solve the above technical problems, the present invention provides another technical solution as follows: a chip mounting method, in the eutectic mounting process, chip mounting is performed by the binding head assembly as described above; the method comprises the following steps: transferring the substrate to the eutectic table, on which at least two chip mounting positions are provided; transferring the chip to the first chip mounting position by the suction nozzle assembly, when transferring the chip, the visual assembly observes the orientation of the chip through the through hole and the adsorption channel, and adjusts the orientation of the chip according to the observation result; when transferring the chip to other chip mounting positions by the suction nozzle assembly, the suction nozzle takes the corresponding chip and moves it to the top of the chip mounting position corresponding to the substrate, at which time the adsorption channel and the observation window are respectively aligned with the chip mounting position of the mounted chip and the chip mounting position of the chip to be mounted, the visual assembly recognizes the feature points of the two chips by the adsorption channel and the observation window respectively, and at the same time corrects the relative position and angle of the two chips by the driving assembly, thereby completing the mounting.

[0014] Compared with the prior art, the header binding assembly, eutectic equipment and chip mounting method provided by the present invention have the following beneficial effects: 1. A head binding assembly provided by an embodiment of the present invention ensures that multiple chips can be positioned with high precision during the eutectic mounting process by introducing a synchronous visual monitoring and correction mechanism for adjacent chips, thereby solving the problem of poor position and angle accuracy between chips when existing eutectic equipment mounts multiple chips on the same substrate; specifically, the present solution provides a through hole on the nozzle holder so that the nozzle holder itself will not hinder the visual component from observing the chip through the adsorption channel on the nozzle; at the same time, an observation window is provided at intervals on the nozzle so that the visual component can observe adjacent chips through the observation window; and an air path connection hole is provided on the inner wall of the through hole to provide a vacuum adsorption function for the nozzle, and a first transparent member is provided at one end of the through hole so as not to affect the operation of the visual component while maintaining the sealing of the system.

[0015] 2. In the head binding assembly of the embodiment of the present invention, a hole is first opened on the observation window and then sealed with a second transparent member, thereby completing the setting of the observation window in a relatively simple assembly production method; wherein the second transparent member is used to close the through hole without affecting the visual component observing the chip through it.

[0016] 3. In the head binding assembly of the embodiment of the present invention, the hollow channel inside the hollow motor is aligned with the through hole on the nozzle seat or its projection overlaps, ensuring a clear and unobstructed line of sight from the visual component to the chip. This design allows the visual component to directly observe the chip located in the nozzle adsorption channel through the hollow channel and through hole, thereby achieving accurate monitoring of the chip position and posture, that is, in the head binding assembly of this embodiment, the visual component, the hollow motor and the nozzle assembly can be stacked vertically, with a simple structure and small space occupancy.

[0017] 4. In the head binding assembly of the embodiment of the present invention, the mounting groove provides a stable mounting platform, enhances the fixation of the first transparent member, and ensures reliability in long-term use.

[0018] 5. In the head binding assembly of the embodiment of the present invention, the second transparent member is arranged in the accommodating space between the suction nozzle and the suction nozzle seat, which can effectively protect and fix the second transparent member; at the same time, the positional relationship between the second transparent member and the adsorption channel ensures that it will not hinder the normal adsorption of the chip by the suction nozzle.

[0019] 6. The eutectic device provided in the embodiment of the present invention, because it includes the above-mentioned head binding assembly, also has the same beneficial effects as the above-mentioned head binding assembly, which will not be elaborated here.

[0020] 7. In the eutectic equipment of the embodiment of the present invention, the vacuum suction holes and heating module on the eutectic area are key components for achieving efficient and accurate chip mounting; during the eutectic mounting process, the substrate needs to be accurately fixed on the eutectic table to ensure the accuracy of the mounting position. The vacuum suction holes tightly adsorb the substrate on the eutectic table by generating negative pressure to prevent it from shifting during operation; the heating module can accurately control the temperature of the eutectic area to ensure that the appropriate temperature is reached to complete the eutectic process.

[0021] 8. In the eutectic device of the embodiment of the present invention, the elastic pressure block can provide a certain downward pressure for the chip under the eutectic process. The elastic pressure block can automatically adjust the applied pressure according to the chips of different thicknesses to ensure that each chip can be subjected to appropriate pressure and achieve high-precision pressure application. This is not only applicable to chips of standard thickness, but also can handle chips of different thicknesses due to manufacturing tolerances or design requirements. When chips of different specifications need to be processed, the elastic pressure block can respond quickly and adjust to the appropriate working state without frequent hardware replacement or complex recalibration, thereby improving operational efficiency; the interval between two adjacent elastic pressure blocks matches the interval between two adjacent eutectic positions, ensuring that each chip mounting position can be accurately covered, and the elastic pressure block can provide uniform pressure distribution on the entire contact surface, avoiding the problem of excessive or insufficient local pressure, thereby improving the quality and reliability of eutectic mounting.

[0022] 9. In the eutectic device of the embodiment of the present invention, the pressure block seat serves as the basic framework of the entire elastic limit assembly, providing a solid support for all components. It ensures that the elastic pressure block can maintain its position and function unchanged even in a high-frequency operating environment. The cover plate closes the top of the installation channel to prevent external dust, impurities, etc. from entering the interior, protecting the elastic parts and other precision parts from contamination or damage. The installation channel on the pressure block seat provides a precise guide path for each elastic pressure block, ensuring that the pressure block can move in a predetermined direction during operation without lateral displacement. This design ensures that each elastic pressure block can be accurately aligned with the corresponding chip mounting position. The presence of the elastic part enables the pressure block to adaptively adjust when it is against the chip, thereby being compatible with the thickness difference of the chip, and providing high-precision eutectic pressure without frequent hardware replacement or complex recalibration.

[0023] 10. The chip mounting method provided in the embodiment of the present invention also has the same beneficial effects because it adopts the head binding assembly as described above for chip mounting, and thus will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is the main view of the head binding assembly provided by the embodiment of the present invention. Figure 1 .

[0025] Figure 2 It is a cross-sectional view of a nozzle assembly provided in an embodiment of the present invention.

[0026] Figure 3 It is a cross-sectional view of a partial structure of a head binding assembly provided in an embodiment of the present invention.

[0027] Figure 4 This is the main view of the head binding assembly provided by the embodiment of the present invention. Figure 2 .

[0028] Figure 5 It is an exploded schematic diagram of a nozzle assembly provided in an embodiment of the present invention.

[0029] Figure 6 It is a block diagram of a eutectic device provided in an embodiment of the present invention.

[0030] Figure 7 It is a schematic diagram of the coordination of some modules of the eutectic equipment provided in an embodiment of the present invention.

[0031] Figure 8 It is a schematic diagram of the working state of the elastic limiting assembly provided in an embodiment of the present invention.

[0032] Description of the accompanying drawings: 100. Eutectic equipment; 10. Head binding assembly; 1. Drive assembly; 11. Hollow motor; 111. Hollow channel; 12. Ordinary motor; 13. Synchronous belt assembly; 2. Suction nozzle assembly; 21. Suction nozzle seat; 211. Through hole; 2111. Air path connection hole; 212. Mounting groove; 22. Suction nozzle; 221. Adsorption channel; 222. Observation window; 2221. Observation hole; 2222. Second transparent part; 22221. Avoidance hole; 223. Accommodation space; 23. First transparent part; 3. Visual component; 4. Eutectic table; 41. Eutectic area; 42. Vacuum suction hole; 43. Heating module; 5. Elastic limit component; 51. Elastic pressure block; 511. Elastic part; 512. Pressure block; 52. Pressure block seat; 521. Installation channel; 53. Cover plate. DETAILED DESCRIPTION

[0033] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and implementation examples. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0034] In the embodiments provided by the present invention, it should be understood that "B corresponding to A" means that B is associated with A, and B can be determined according to A. However, it should also be understood that determining B according to A does not mean determining B only according to A, and B can also be determined according to A and / or other information.

[0035] It should be understood that the "one embodiment" or "an embodiment" mentioned throughout the specification means that the specific features, structures or characteristics related to the embodiment are included in at least one embodiment of the present invention. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. In addition, these specific features, structures or characteristics can be combined in one or more embodiments in any suitable manner. Those skilled in the art should also be aware that the embodiments described in the specification are all optional embodiments, and the actions and modules involved are not necessarily required for the present invention.

[0036] In various embodiments of the present invention, it should be understood that the size of the serial numbers of the above-mentioned processes does not mean the necessary order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.

[0037] The flow chart and block diagram in the accompanying drawings of the present invention illustrate the possible architecture, function and operation of the system, method and computer program product according to various embodiments of the present application. In this regard, each box in the flow chart or block diagram can represent a module, a program segment or a part of a code, and the module, the program segment or a part of the code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a sequence different from that marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, which is determined based on the functions involved. It should be particularly noted that each box in the block diagram and / or flow chart, and the combination of the boxes in the block diagram and / or flow chart can be implemented by a dedicated hardware-based system that performs a specified function or operation, or can be implemented by a combination of dedicated hardware and computer instructions.

[0038] See also Figure 1 and Figure 2The first embodiment of the present invention provides a head binding assembly 10, which includes a driving assembly 1, a nozzle assembly 2 and a visual assembly 3. The nozzle assembly 2 is arranged at the output end of the driving assembly 1, and the nozzle assembly 2 includes a nozzle seat 21, a nozzle 22, a first transparent member 23 and a second transparent member 2222. The nozzle seat 21 is provided with a through hole 211, and the visual assembly 3 is aligned with the through hole 211; the nozzle 22 is arranged at one end of the through hole 211, and the first transparent member 23 is arranged at the other end of the through hole 211 and closes the port of the through hole 211; the nozzle 22 is provided with a through adsorption channel 221, the adsorption channel 221 is connected to the through hole 211, and an air path connecting hole 2111 is provided on the inner wall of the through hole 211; the nozzle 22 is also provided with a transparent observation window 222, the observation window 222 is spaced apart from the adsorption channel 221, and is projected along the axial direction of the through hole 211, and the projection of the observation window 222 is located within the projection of the through hole 211.

[0039] It can be understood that a head binding component 10 provided in an embodiment of the present invention ensures that multiple chips can be positioned with high precision during the eutectic mounting process by introducing a synchronous visual monitoring and correction mechanism for adjacent chips, thereby solving the problem of poor position and angle accuracy between chips when the existing eutectic equipment 100 mounts multiple chips on the same substrate; specifically, the present solution provides a through hole 211 on the suction nozzle seat 21, so that the suction nozzle seat 21 itself will not hinder the visual component 3 from observing the chip through the adsorption channel 221 on the suction nozzle 22; at the same time, an observation window 222 is provided at intervals on the suction nozzle 22, so that the visual component 3 can observe the adjacent chips through the observation window 222; and an air path connection hole 2111 is provided on the inner wall of the through hole 211 to provide a vacuum adsorption function for the suction nozzle 22, and a first transparent member 23 is provided at one end of the through hole 211, so that the operation of the visual component 3 is not affected while maintaining the sealing of the system.

[0040] It should be noted that the header assembly 10 referred to in this embodiment is generally used in eutectic or eutectic equipment to complete the chip bonding operation.

[0041] It should be noted that, when projecting along the axial direction of the through hole 211 , the projection of the observation window 222 is located within the projection of the through hole 211 , which can ensure that the sight line from the visual component 3 to the observation window 222 is not blocked.

[0042] As an implementation manner, the axial directions of the through hole 211 and the adsorption channel 221 are arranged in parallel.

[0043] As an implementation method, the through hole 211 is coaxial with the adsorption channel 221. The coaxial setting provides a direct and unobstructed observation path for the visual component 3, ensuring that the visual component 3 can directly observe the state of the chip through the through hole 211 and the adsorption channel 221, thereby achieving more accurate position and posture adjustment.

[0044] As an implementation mode, the first transparent member 23 is eutectic connected to the nozzle holder 21. For example, the first transparent member 23 can be fixed to the nozzle holder 21 by gluing or clamping.

[0045] Please continue reading Figure 2 As an implementation manner, the observation window 222 includes an observation hole 2221 and a second transparent member 2222 closing the observation hole 2221 .

[0046] It can be understood that in the head binding assembly 10 of the embodiment of the present invention, a hole is first opened on the observation window 222 and then sealed with the second transparent component 2222, thereby completing the setting of the observation window 222 in a relatively simple assembly production method; wherein, the second transparent component 2222 is used to close the through hole 211 without affecting the visual component 3 observing the chip therethrough.

[0047] It should be noted that the observation window 222 can be arranged in various ways; in other embodiments, a transparent component can be directly arranged on one side of the suction nozzle 22 to form the observation window 222; or the suction nozzle 22 itself can be arranged to be made of a transparent material to form the observation window 222.

[0048] As an implementation manner, the axial direction of the observation hole 2221 is parallel to the axial direction of the through hole 211 .

[0049] As an implementation mode, high-transmittance glass is selected for the first transparent member 23 and the second transparent member 2222. High-transmittance glass has excellent optical properties, can minimize light loss, and ensure that the image quality received by the visual component 3 is higher and clearer.

[0050] See also Figure 3 As an embodiment, the driving assembly 1 includes a hollow motor 11, and the nozzle assembly 2 is arranged at the output end of the hollow motor 11. The hollow motor 11 is provided with a penetrating hollow channel 111, and the hollow channel 111 is aligned with the through hole 211; along the axial direction of the through hole 211 ( Figure 3 The projection of the through hole 211 is located within the projection of the hollow channel 111, or the projection of the through hole 211 overlaps with the projection of the hollow channel 111.

[0051] It can be understood that in the head binding assembly 10 of the embodiment of the present invention, the hollow channel 111 inside the hollow motor 11 is aligned with the through hole 211 on the nozzle seat 21 or its projection overlaps, ensuring a clear and unobstructed line of sight from the visual component 3 to the chip. This design allows the visual component 3 to directly observe the chip located in the adsorption channel 221 of the nozzle 22 through the hollow channel 111 and the through hole 211, thereby achieving accurate monitoring of the chip position and posture, that is, in the head binding assembly 10 of this embodiment, the visual component 3, the hollow motor 11 and the nozzle assembly 2 can be stacked vertically, with a simple structure and a small space occupancy rate.

[0052] See also Figure 4 As a variation, the driving component 1 may also include a common motor 12, which is disposed on the side of the nozzle component 2. The output shaft of the common motor 12 is connected to the nozzle component 2 via a synchronous belt component 13, thereby realizing a transmission connection; the visual component 3 is directly disposed above the nozzle component 2.

[0053] See also Figure 5 As an implementation manner, a mounting groove 212 is provided at one end of the nozzle holder 21 away from the nozzle 22 corresponding to the through hole 211 , and the first transparent member 23 is disposed in the mounting groove 212 .

[0054] It can be understood that in the head binding assembly 10 of the embodiment of the present invention, the mounting groove 212 provides a stable mounting platform, enhances the fixation of the first transparent member 23, and ensures reliability in long-term use.

[0055] Please continue reading Figure 5 As an implementation manner, a receiving space 223 is provided between the suction nozzle 22 and the suction nozzle seat 21, and the second transparent member 2222 is provided in the receiving space 223; the second transparent member 2222 is provided to avoid the adsorption channel 221, or a avoiding hole 22221 is provided on the second transparent member 2222 corresponding to the adsorption channel 221.

[0056] It can be understood that in the head binding assembly 10 of the embodiment of the present invention, the second transparent member 2222 is arranged in the accommodating space 223 between the suction nozzle 22 and the suction nozzle seat 21, which can effectively protect and fix the second transparent member 2222; at the same time, the positional relationship between the second transparent member 2222 and the adsorption channel 221 ensures that it will not hinder the normal adsorption of the chip by the suction nozzle 22.

[0057] It should be noted that the suction nozzle 22 is sealed and connected to the suction nozzle seat 21. After the suction nozzle 22 is installed on the suction nozzle seat 21, the air path connecting hole 2111 is connected to the outside world only through the through hole 211, the avoidance hole 22221 and the adsorption channel 221 in sequence, thereby providing vacuum adsorption capability for the suction nozzle 22.

[0058] See also Figure 6 In order to solve the above technical problems, the present invention provides another technical solution as follows: a eutectic device 100 includes a main body and a head binding assembly 10 as above which is movably arranged on the main body.

[0059] It can be understood that the eutectic device 100 provided in the embodiment of the present invention, because it includes the above-mentioned head binding assembly 10, also has the same beneficial effects as the above-mentioned head binding assembly 10, which will not be elaborated here.

[0060] As an embodiment, the eutectic device 100 further includes a transfer table, on which at least two vacuum suction holes are disposed, and the interval between adjacent vacuum suction holes on the transfer table corresponds to the interval between the observation window and the adsorption channel.

[0061] See also Figure 7 As an embodiment, the eutectic device 100 also includes a eutectic table 4, on which a eutectic region 41 is provided, and on which at least one vacuum suction hole 42 is provided; the eutectic table 4 is also provided with a heating module 43 for heating the eutectic region 41.

[0062] It can be understood that in the eutectic device 100 of the embodiment of the present invention, the vacuum suction holes 42 and the heating module 43 on the eutectic region 41 are key components for achieving efficient and accurate chip mounting; during the eutectic mounting process, the substrate needs to be accurately fixed on the eutectic stage 4 to ensure the accuracy of the mounting position. The vacuum suction holes 42 tightly adsorb the substrate on the eutectic stage 4 by generating negative pressure to prevent it from shifting during operation; the heating module 43 can accurately control the temperature of the eutectic region 41 to ensure that the appropriate temperature is reached to complete the eutectic process.

[0063] See also Figure 8 As an embodiment, the eutectic device 100 further includes an elastic limiting component 5, on which at least two elastic pressing blocks 51 are provided, and the interval between two adjacent elastic pressing blocks 51 matches the interval between two adjacent eutectic positions.

[0064] It can be understood that in the eutectic device of the embodiment of the present invention, the elastic pressing block 51 can provide a certain downward pressure for the chip under the eutectic process. The elastic pressing block 51 can automatically adjust the applied pressure according to the chips of different thicknesses to ensure that each chip can be subjected to appropriate pressure and achieve high-precision pressure application. This is not only applicable to chips of standard thickness, but also can handle chips of different thicknesses caused by manufacturing tolerances or design requirements. When chips of different specifications need to be processed, the elastic pressing block 51 can respond quickly and adjust to the appropriate working state without frequent hardware replacement or complex recalibration, thereby improving operational efficiency; the interval between two adjacent elastic pressing blocks 51 matches the interval between two adjacent eutectic positions, ensuring that each chip mounting position can be accurately covered, and the elastic pressing block 51 can provide uniform pressure distribution on the entire contact surface, avoiding the problem of excessive or insufficient local pressure, thereby improving the quality and reliability of eutectic mounting.

[0065] Optionally, the elastic limit assembly 5 can be installed on the same binding head as the suction nozzle assembly 2, or can be installed on different binding heads respectively. That is, the elastic limit assembly 5 and the suction nozzle assembly 2 can be controlled and moved by the same group of manipulators, or can be controlled and moved by different manipulators respectively. The design selection can be made according to the actual layout and requirements of the machine tool equipment.

[0066] As an embodiment, the elastic limiting assembly 5 also includes a pressure block seat 52 and a cover plate 53. The pressure block seat 52 is provided with installation channels 521 matching the number of elastic pressure blocks 51. The cover plate 53 is covered on the pressure block seat 52 to close the installation channels 521. The elastic pressure block 51 includes a connected elastic member 511 and a pressure block 512. The end of the elastic member 511 away from the pressure block 512 is connected to the cover plate 53, and the pressure block 512 is exposed after passing through the installation channel 521.

[0067] It can be understood that in the eutectic device 100 of the embodiment of the present invention, the pressure block seat 52 serves as the basic framework of the entire elastic limit assembly 5, providing a stable support for all components. It ensures that the elastic pressure block 51 can maintain its position and function unchanged even in a high-frequency operating environment. The cover plate 53 closes the top of the installation channel 521 to prevent external dust, impurities, etc. from entering the interior, and protects the elastic member 511 and other precision components from contamination or damage. The installation channel 521 on the pressure block seat 52 provides a precise guide path for each elastic pressure block 51, ensuring that the pressure block 512 can move in a predetermined direction during operation without lateral displacement. This design ensures that each elastic pressure block 51 can be accurately aligned with the corresponding chip mounting position. The presence of the elastic member 511 enables the pressure block 512 to adaptively adjust when it is against the chip, thereby being compatible with the thickness difference of the chip, and providing high-precision eutectic pressure without frequent hardware replacement or complex recalibration. In order to solve the above technical problems, the present invention provides another technical solution as follows: a chip mounting method, in the eutectic mounting process, the chip is mounted by the above-mentioned head binding assembly; the method comprises the following steps: S1: Transfer the substrate to a eutectic table, where at least two chip mounting positions are provided; S2: The chip is transferred to the first chip mounting position through the nozzle assembly. When the chip is transferred, the visual assembly observes the position of the chip through the through hole and the adsorption channel, and adjusts the position of the chip according to the observation result; S3: When transferring the chip to other chip mounting positions through the suction nozzle assembly, the suction nozzle takes the corresponding chip and moves it to the top of the chip mounting position corresponding to the substrate. At this time, the suction channel and the observation window are respectively aligned with the chip mounting position of the mounted chip and the chip mounting position of the chip to be mounted. The visual component recognizes the feature points of the two chips through the suction channel and the observation window respectively, and at the same time, the relative position and angle of the two chips are corrected through the cooperation of the driving component to complete the mounting.

[0068] It can be understood that the chip mounting method provided in the embodiment of the present invention also has the same beneficial effects because it adopts the above-mentioned head binding assembly for chip mounting, and will not be elaborated here.

[0069] Furthermore, in step S1, after the substrate is transferred to the eutectic table, negative pressure is generated through the vacuum suction holes of the eutectic table to tightly adsorb the substrate on the eutectic table to prevent displacement during operation and ensure the accuracy of the mounting position.

[0070] Furthermore, after step S3, the method further includes: Step S4: The elastic pressing blocks on the elastic limiting assembly are used to synchronously hold the multiple chips on the substrate, and the temperature of the eutectic area is precisely controlled by the heating module on the eutectic table to ensure that the appropriate temperature is reached to complete the eutectic process.

[0071] Compared with the prior art, the header binding assembly, eutectic equipment and chip mounting method provided by the present invention have the following beneficial effects: 1. A head binding assembly provided by an embodiment of the present invention ensures that multiple chips can be positioned with high precision during the eutectic mounting process by introducing a synchronous visual monitoring and correction mechanism for adjacent chips, thereby solving the problem of poor position and angle accuracy between chips when existing eutectic equipment mounts multiple chips on the same substrate; specifically, the present solution provides a through hole on the nozzle holder so that the nozzle holder itself will not hinder the visual component from observing the chip through the adsorption channel on the nozzle; at the same time, an observation window is provided at intervals on the nozzle so that the visual component can observe adjacent chips through the observation window; and an air path connection hole is provided on the inner wall of the through hole to provide a vacuum adsorption function for the nozzle, and a first transparent member is provided at one end of the through hole so as not to affect the operation of the visual component while maintaining the sealing of the system.

[0072] 2. In the head binding assembly of the embodiment of the present invention, a hole is first opened on the observation window and then sealed with a second transparent member, thereby completing the setting of the observation window in a relatively simple assembly production method; wherein the second transparent member is used to close the through hole without affecting the visual component observing the chip through it.

[0073] 3. In the head binding assembly of the embodiment of the present invention, the hollow channel inside the hollow motor is aligned with the through hole on the nozzle seat or its projection overlaps, ensuring a clear and unobstructed line of sight from the visual component to the chip. This design allows the visual component to directly observe the chip located in the nozzle adsorption channel through the hollow channel and through hole, thereby achieving accurate monitoring of the chip position and posture, that is, in the head binding assembly of this embodiment, the visual component, the hollow motor and the nozzle assembly can be stacked vertically, with a simple structure and small space occupancy.

[0074] 4. In the head binding assembly of the embodiment of the present invention, the mounting groove provides a stable mounting platform, enhances the fixation of the first transparent member, and ensures reliability in long-term use.

[0075] 5. In the head binding assembly of the embodiment of the present invention, the second transparent member is arranged in the accommodating space between the suction nozzle and the suction nozzle seat, which can effectively protect and fix the second transparent member; at the same time, the positional relationship between the second transparent member and the adsorption channel ensures that it will not hinder the normal adsorption of the chip by the suction nozzle.

[0076] 6. The eutectic device provided in the embodiment of the present invention, because it includes the above-mentioned head binding assembly, also has the same beneficial effects as the above-mentioned head binding assembly, which will not be elaborated here.

[0077] 7. In the eutectic equipment of the embodiment of the present invention, the vacuum suction holes and heating module on the eutectic area are key components for achieving efficient and accurate chip mounting; during the eutectic mounting process, the substrate needs to be accurately fixed on the eutectic table to ensure the accuracy of the mounting position. The vacuum suction holes tightly adsorb the substrate on the eutectic table by generating negative pressure to prevent it from shifting during operation; the heating module can accurately control the temperature of the eutectic area to ensure that the appropriate temperature is reached to complete the eutectic process.

[0078] 8. In the eutectic device of the embodiment of the present invention, the elastic pressure block can provide a certain downward pressure for the chip under the eutectic process. The elastic pressure block can automatically adjust the applied pressure according to the chips of different thicknesses to ensure that each chip can be subjected to appropriate pressure and achieve high-precision pressure application. This is not only applicable to chips of standard thickness, but also can handle chips of different thicknesses due to manufacturing tolerances or design requirements. When chips of different specifications need to be processed, the elastic pressure block can respond quickly and adjust to the appropriate working state without frequent hardware replacement or complex recalibration, thereby improving operational efficiency; the interval between two adjacent elastic pressure blocks matches the interval between two adjacent eutectic positions, ensuring that each chip mounting position can be accurately covered, and the elastic pressure block can provide uniform pressure distribution on the entire contact surface, avoiding the problem of excessive or insufficient local pressure, thereby improving the quality and reliability of eutectic mounting.

[0079] 9. In the eutectic device of the embodiment of the present invention, the pressure block seat serves as the basic framework of the entire elastic limit assembly, providing a solid support for all components. It ensures that the elastic pressure block can maintain its position and function unchanged even in a high-frequency operating environment. The cover plate closes the top of the installation channel to prevent external dust, impurities, etc. from entering the interior, protecting the elastic parts and other precision parts from contamination or damage. The installation channel on the pressure block seat provides a precise guide path for each elastic pressure block, ensuring that the pressure block can move in a predetermined direction during operation without lateral displacement. This design ensures that each elastic pressure block can be accurately aligned with the corresponding chip mounting position. The presence of the elastic part enables the pressure block to adaptively adjust when it is against the chip, thereby being compatible with the thickness difference of the chip, and providing high-precision eutectic pressure without frequent hardware replacement or complex recalibration.

[0080] 10. The chip mounting method provided in the embodiment of the present invention also has the same beneficial effects because it adopts the head binding assembly as described above for chip mounting, and thus will not be described in detail here.

[0081] The above is a detailed introduction to a head binding component, eutectic equipment and chip mounting method disclosed in an embodiment of the present invention. Specific examples are used in this article to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea; at the same time, for those skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention, and any modifications, equivalent substitutions and improvements made within the principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A head binding assembly, characterized in that: The head binding assembly includes a driving assembly, a nozzle assembly and a visual assembly, wherein the nozzle assembly is arranged at the output end of the driving assembly, the nozzle assembly includes a nozzle seat, a nozzle, a first transparent member and a second transparent member, the nozzle seat is provided with a through hole, and the visual assembly is arranged to align with the through hole; The suction nozzle is arranged at one end of the through hole, and the first transparent member is arranged at the other end of the through hole and closes the port of the through hole; the suction nozzle is provided with a penetrating adsorption channel, the adsorption channel is connected to the through hole, and an air path connecting hole is provided on the inner wall of the through hole; the suction nozzle is also provided with a transparent observation window, the observation window is spaced apart from the adsorption channel, and is projected along the axial direction of the through hole, and the projection of the observation window is located within the projection of the through hole.

2. The head binding assembly according to claim 1, characterized in that: The observation window includes an observation hole and a second transparent member closing the observation hole.

3. The head binding assembly according to claim 1, characterized in that: The driving assembly includes a hollow motor, and the suction nozzle assembly is arranged at the output end of the hollow motor. The hollow motor is provided with a penetrating hollow channel, and the hollow channel is aligned with the through hole; when projected along the axial direction of the through hole, the projection of the through hole is located within the projection of the hollow channel, or the projection of the through hole overlaps with the projection of the hollow channel.

4. The head binding assembly according to claim 1, characterized in that: An end of the nozzle seat facing away from the nozzle is provided with a mounting groove corresponding to the through hole, and the first transparent member is arranged in the mounting groove.

5. The head binding assembly according to claim 1, characterized in that: An accommodating space is provided between the suction nozzle and the suction nozzle seat, and the second transparent member is provided in the accommodating space; the second transparent member is arranged to avoid the adsorption channel, or an avoidance hole is provided on the second transparent member corresponding to the adsorption channel.

6. A eutectic device, characterized in that: It comprises a main body and a head binding assembly as described in any one of claims 1 to 5 which is movably arranged on the main body; the eutectic equipment also comprises a transfer table arranged on the main body, the transfer table is provided with at least two vacuum suction holes, and the interval between adjacent vacuum suction holes on the transfer table corresponds to the interval between the observation window and the adsorption channel.

7. The eutectic device according to claim 6, characterized in that: The eutectic equipment also includes a eutectic table, on which a eutectic region is arranged, and on which at least one vacuum suction hole is arranged; and the eutectic table is also provided with a heating module for heating the eutectic region.

8. The eutectic device according to claim 6, characterized in that: The eutectic device further comprises an elastic limiting component, on which at least two elastic pressing blocks are arranged, and the interval between two adjacent elastic pressing blocks matches the interval between two adjacent eutectic positions.

9. The eutectic device according to claim 8, characterized in that: The elastic limiting assembly also includes a pressure block seat and a cover plate. The pressure block seat is provided with installation channels matching the number of elastic pressure blocks. The cover plate is covered on the pressure block seat to close the installation channels. The elastic pressure block includes a connected elastic member and a pressure block. One end of the elastic member away from the pressure block is connected to the cover plate, and the pressure block is exposed after passing through the installation channel.

10. A chip mounting method, characterized in that: In a eutectic bonding process, chip bonding is performed by using a header assembly as described in any one of claims 1 to 5; The method comprises the following steps: Transferring the substrate to a eutectic table, the substrate being provided with at least two chip mounting positions; The chip is transferred to the first chip mounting position through the nozzle assembly. When the chip is transferred, the visual assembly observes the position of the chip through the through hole and the adsorption channel, and adjusts the position of the chip according to the observation result; When transferring the chip to other chip mounting positions through the nozzle assembly, the nozzle takes the corresponding chip and moves it to the top of the corresponding chip mounting position on the substrate. At this time, the adsorption channel and the observation window are respectively aligned with the chip mounting position of the mounted chip and the chip mounting position of the chip to be mounted. The visual component recognizes the feature points of the two chips through the adsorption channel and the observation window respectively, and at the same time, the relative position and angle of the two chips are corrected through the cooperation of the driving component to complete the mounting.

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