Wafer holder, heater unit having the wafer holder, and wafer prober having the heater unit

a heater unit and wafer technology, applied in the direction of instruments, basic electric elements, measurement devices, etc., can solve the problems of long time between the increase and decrease temperature of the heater, the contact failure between the wafer and the probe pin, and the improvement of the throughput, so as to effectively prevent the contact failure and improve the heat-insulating effect, the effect of less susceptible to deformation
US20070082313A1Inactive Publication Date: 2007-04-12SUMITOMO ELECTRIC IND LTD
3 Cites 6 Cited by

Patent Information

Authority / Receiving Office
US · United States
Current Assignee / Owner
SUMITOMO ELECTRIC IND LTD
Publication Date
2007-04-12
Estimated Expiration
Not applicable · inactive patent

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

A wafer holder less susceptible to deformation even under high load and having high heat-insulating effect and hence capable of improving positional accuracy, improving thermal uniformity and rapid heating and cooling of chips, as well as a heater unit including the wafer holder and a wafer prober including the heater unit are provided. The wafer holder includes a chuck top having a chuck top conductive layer on its surface and a supporter supporting the chuck top, and has a support member in a space between the chuck top and the supporter. Preferably, the support member is arranged concentric with the supporter or approximately at the center of the supporter, and more preferably, support members arranged concentrically and arranged at the center are both provided.
Need to check novelty before this filing date? Find Prior Art

Description

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to a wafer holder used for a wafer prober in which a semiconductor wafer is mounted on a wafer-mounting surface and a probe card is pressed onto the wafer for inspecting electric characteristics of the wafer, a heater unit including the wafer holder and to a wafer prober including the heater unit.

[0003] 2. Description of the Background Art

[0004] Conventionally, in the step of inspecting a semiconductor, a semiconductor substrate (wafer) as an object of processing is subjected to heat treatment. Specifically, burn-in is performed in which the wafer is heated to a temperature higher than the temperature of normal use, to accelerate degradation of a possibly defective semiconductor chip and to remove the defective chip, in order to prevent defects after shipment. In the burn-in process, after semiconductor circuits are formed on the semiconductor wafer and before cutting the wafer into i...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More