Adhesive with insulating and heat-conducting properties used at ultralow temperature

A kind of insulation and heat conduction, ultra-low temperature technology, used in adhesives, adhesive additives, epoxy resin glue and other directions, can solve the problem of thermal conductivity can not be applied to thermal conductivity and other problems, to achieve excellent thermal conductivity, ensure insulation performance, long storage period effect

Inactive Publication Date: 2012-10-10
TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] An object of the present invention is to overcome the shortcomings of the existing thermally conductive adhesives that cannot be used in ultra-low temperature environments and have poor thermal conductivity at ultra-low temperatures, and provide an insulating and thermally conductive adhesive for ultra-low temperature with insulation and thermal conductivity properties in ultra-low temperature environments

Method used

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  • Adhesive with insulating and heat-conducting properties used at ultralow temperature

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Weigh 100.0g of glycidyl ether type epoxy resin WSR 615 (bisphenol A), 6.0g of silane coupling agent KH-560 and 330.5g of micron-sized AlN powder, stir and mix with a glass rod, and then transfer the mixture to three rollers Grinder for mixing, after mixing evenly, add 28.3g of polyetheramine curing agent D-400 and 7.4g of aliphatic amine curing agent triethylenetetramine for curing reaction, to obtain the ultra-low temperature insulating heat-conducting adhesive of this embodiment; the carried out The curing conditions of the curing reaction are: heating at 25° C. for 24 hours, and then raising the temperature to 150° C. and heating for 6 hours.

Embodiment 2

[0023] Weigh 100.0g of glycidyl ether type epoxy resin WSR 615, 6.0g of silane coupling agent KH-560, 294.0g of micron-sized AlN particle powder and 22.615g of micron-sized Ag flakes, stir and mix with a glass rod, and then transfer the mixture Mix in a three-roll mill, and after mixing evenly, add 28.3g of polyetheramine curing agent D-400 and 7.4g of aliphatic amine curing agent triethylenetetramine for curing reaction to obtain the ultra-low temperature insulating and heat-conducting adhesive of this embodiment; The curing conditions of the curing reaction are: heating at 25° C. for 24 hours, and then raising the temperature to 150° C. and heating for 6 hours.

Embodiment 3

[0025] Weigh 100.0g of glycidyl ether type epoxy resin WSR 615, 6.0g of silane coupling agent KH-560, 226.2g of micron-sized AlN particle powder and 90.5g of micron-sized Ag flakes, stir and mix with a glass rod, and then transfer the mixture Mix in a three-roll mill, and after mixing evenly, add 28.3g of polyetheramine curing agent D-400 and 7.4g of aliphatic amine curing agent triethylenetetramine for curing reaction to obtain the ultra-low temperature insulating and heat-conducting adhesive of this embodiment; The curing conditions of the curing reaction are: heating at 25° C. for 24 hours, and then raising the temperature to 150° C. and heating for 6 hours.

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Abstract

The invention relates to an adhesive with insulating and heat-conducting properties used at an ultralow temperature, the adhesive being a two-component adhesive obtained by mixing a mixture component A and a curing agent and conducting a curing reaction. Curing conditions of the curing reaction are heating the mixture at a temperature of 25 DEG C for 24 hours and then raising the temperature to 150 DEG C to heat for 6 hours. The mixture component A is a mixture obtained by uniformly mixing 100 parts by weight of epoxy resin, 6 parts by weight of silane coupling agent, and 100-1000 parts by weight of heat-conducting powder filler in a mechanical manner, wherein the heat-conducting powder filler is composed of 0-60 wt% of metallic heat-conducting powder and 40-100 wt% of nonmetallic heat-conducting powder. The adhesive of the invention has excellent insulating and heat-conducting properties at ultralow temperature, can overcome the disadvantages that existing heat-conducting adhesives can not be used at ultralow temperature and has bad heat conductivity at ultralow temperature, contains no diluents added during preparation and causes no pollution induced by micro-molecule volatilization in the cuing reaction.

Description

technical field [0001] The invention relates to an insulating and heat-conducting adhesive for ultra-low temperature with insulating and heat-conducting properties in an ultra-low temperature environment. Background technique [0002] Under normal circumstances, ultra-low temperature refers to the temperature range of liquid oxygen (-183°C) and below. Insulation generally means that the conductivity of the object is less than 10 9 Ω·cm. Thermally conductive adhesives refer to adhesives with excellent thermal conductivity. With the increasing densification and miniaturization of electronic circuits, the heat dissipation performance requirements of electronic components are also becoming higher and higher. Generally, a certain heat dissipation device is used to dissipate heat, but there is a problem of poor contact between the heat dissipation device and the surface of the heat source, and thermally conductive adhesives emerge as the times require. [0003] In recent years...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J163/02C09J11/04
Inventor 付绍云邓寅虎沈小军杨娇萍肖红梅刘玉冯青平
Owner TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
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